JPS63217652A - Device for cutting lead - Google Patents
Device for cutting leadInfo
- Publication number
- JPS63217652A JPS63217652A JP5132387A JP5132387A JPS63217652A JP S63217652 A JPS63217652 A JP S63217652A JP 5132387 A JP5132387 A JP 5132387A JP 5132387 A JP5132387 A JP 5132387A JP S63217652 A JPS63217652 A JP S63217652A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- plate
- cutter
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 14
- 238000000034 method Methods 0.000 abstract description 5
- 101100008047 Caenorhabditis elegans cut-3 gene Proteins 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、プリント基板に搭載されたラジアル部品アキ
シャル部品等のリード線切断装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a lead wire cutting device for radial parts, axial parts, etc. mounted on a printed circuit board.
従来、この種のリード線切断装置は、ニッパ状のカッタ
を自動的に移動させながら部品のリード線を１本づつ切
断するか、又は高速で回転している円盤状のカッタをプ
リント基板裏面と平行に移動させることにより切断して
いた。Conventionally, this type of lead wire cutting device cuts the lead wires of a component one by one while automatically moving a nipper-shaped cutter, or cuts a disc-shaped cutter rotating at high speed to the back of a printed circuit board. It was cut by moving it in parallel.
上述した従来のリード線切断装置は、リード線を１本づ
つ切断する方式ではリード線の数に比例して作業時間が
長くなる欠点があり、又、円盤状のカッタで切断する方
式ではパリ発生の危険性及びプリント基板にソリがある
と、基板裏面を傷つけてしまう等の欠点がある。The above-mentioned conventional lead wire cutting device has the drawback that the method of cutting the lead wires one by one takes longer work time in proportion to the number of lead wires, and the method of cutting with a disc-shaped cutter has the disadvantage of causing paring. There is a danger of this, and if the printed circuit board is warped, it may damage the back side of the board.
本発明のリード線切断装置は、プリント基板を載置する
ためのプレートと、このプレートに沿って移動するカッ
タとを含み、前記プレートおよび前記カッタに前記プリ
ント基板のリード線が挿通されるスルーホールに対応す
る位置に穴が設けられたことを特徴とする。The lead wire cutting device of the present invention includes a plate for placing a printed circuit board, and a cutter that moves along the plate, and a through hole through which the lead wire of the printed circuit board is inserted through the plate and the cutter. A hole is provided at a position corresponding to the hole.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の実施例の正面図である。１はキャビネ
ットでプレート９が固定されている。２は部品が搭載さ
れているプリント基板でプレート９に載置されている。FIG. 1 is a front view of an embodiment of the invention. 1 is a cabinet to which a plate 9 is fixed. 2 is a printed circuit board on which components are mounted, and is placed on a plate 9.
３はリード線を切断するためのカッタ、４はプリント基
板２を正しい位置にセットするための基準ビンでプレー
ト９に固定されている。５はカッタを駆動させるための
モータ、６はモータ５により駆動されるシャフトでカッ
ト３をプレート９に沿って移動させる。７，８は装置の
電気系統のスイッチである。3 is a cutter for cutting the lead wire, and 4 is a reference pin for setting the printed circuit board 2 in the correct position, which is fixed to the plate 9. 5 is a motor for driving the cutter, and 6 is a shaft driven by the motor 5 to move the cut 3 along the plate 9. 7 and 8 are switches for the electrical system of the device.
第２図はプリント基板２、プレート９およびカッタ３を
詳細に示す正面図である。プレート９およびカッタ３に
はプリント基板２のリード線１１が挿通されるスルーホ
ールの位置に合わせて穴１３．１２が設けられている。FIG. 2 is a front view showing the printed circuit board 2, plate 9, and cutter 3 in detail. Holes 13 and 12 are provided in the plate 9 and the cutter 3 in accordance with the positions of through holes through which the lead wires 11 of the printed circuit board 2 are inserted.
搭載部品１０のリード線１１を切断しようとするプリン
ト基板２を基準ビン４がプリント基板２に設けた基準穴
に嵌合するようにプレート９上に正しくセットする。こ
の時、リード線１１はカッタおよびプレート９に明けら
れた穴１２．１３に入り、切断可能な状態となる０次に
、スイッチを押し、モータ５を駆動してカッタ３をスラ
イドさせ、リード線１１を切断する。The printed circuit board 2 whose lead wire 11 of the mounted component 10 is to be cut is properly set on the plate 9 so that the reference pin 4 fits into the reference hole provided in the printed circuit board 2. At this time, the lead wire 11 enters the hole 12.13 made in the cutter and plate 9, and becomes ready for cutting.Next, press the switch, drive the motor 5, slide the cutter 3, and cut the lead wire. Cut 11.
切断が終ったプリント基板２をプレートから取り外し収
納する。The printed circuit board 2 that has been cut is removed from the plate and stored.
以上説明したように本発明はプリント基板に搭載された
部品のリード線位置に合わせて穴をあけたプレートとカ
ッタを使うことにより、プレートに対するカッタの相対
的な移動で一度に全てのリード線を切断することができ
ると同時にカッタの厚さを変えることにより、プリント
基板裏面のリード線の切断後の高さを調節することが可
能であり、短時間で精度の高い切断工事を行える効果が
ある。As explained above, the present invention uses a cutter and a plate with holes drilled in accordance with the lead wire positions of components mounted on a printed circuit board, thereby cutting out all the lead wires at once by moving the cutter relative to the plate. By changing the thickness of the cutter, it is possible to adjust the height of the lead wire on the back of the printed circuit board after cutting, making it possible to cut with high precision in a short period of time. .
第１図は本−発明の一実施例のリード線切断装置の正面
図、第２図は第１図に示す実施例の切断部の拡大正面図
である。
１・・・キャビネット、２・・・プリント基板、３・・
・カッタ、４・・・基準ビン、５・・・モータ、６・・
・シャフト、７．８・・・スイッチ、９・・・プレート
、１０・・・搭載部品、１１・・・リード線、１２．１
３・・・穴。FIG. 1 is a front view of a lead wire cutting device according to an embodiment of the present invention, and FIG. 2 is an enlarged front view of the cutting section of the embodiment shown in FIG. 1...cabinet, 2...printed circuit board, 3...
・Cutter, 4...Reference bin, 5...Motor, 6...
・Shaft, 7.8...Switch, 9...Plate, 10...Mounted parts, 11...Lead wire, 12.1
3...hole.
Claims (1)
トに沿つて移動するカッタとを含み、前記プレートおよ
び前記カッタに前記プリント基板のリード線が挿通され
るスルーホールに対応する位置に穴が設けられたことを
特徴とするリード線切断装置。The device includes a plate for mounting a printed circuit board and a cutter that moves along the plate, and holes are provided in the plate and the cutter at positions corresponding to through holes through which lead wires of the printed circuit board are inserted. A lead wire cutting device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5132387A JPS63217652A (en) | 1987-03-05 | 1987-03-05 | Device for cutting lead |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5132387A JPS63217652A (en) | 1987-03-05 | 1987-03-05 | Device for cutting lead |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63217652A true JPS63217652A (en) | 1988-09-09 |
Family
ID=12883706
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5132387A Pending JPS63217652A (en) | 1987-03-05 | 1987-03-05 | Device for cutting lead |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63217652A (en) |
-
1987
- 1987-03-05 JP JP5132387A patent/JPS63217652A/en active Pending
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