JPS63217316A - Electronic endoscope - Google Patents

Abstract

PURPOSE:To eliminate deterioration in performance due to a rise in temperature by providing a heat radiating means and a heat insulator to a lighting optical system, a CCD, and an IC. CONSTITUTION:A metallic water supply pipe 8a and an air supply pipe 6b are stored in a heat-insulating tip constitution part 10 and a lens frame 2a which supports the CCD 3 is covered with the heat insulator 2c; and the IC 4 is covered with heat-insulating resin 4a and a heat-conductive member 4b and a lighting window 5 and the lighting optical system LG 6 are covered with the heat insulator 2c. Washing water is discharged from the nozzle 9 of the water supply pipe 8a to the tip surfaces of an objective optical system 2 and the window 5 respectively. Consequently, heat applied externally to the CCD and heat generated by itself are radiated speedily to eliminate deterioration in performance due to a temperature rise.

Description

Detailed Description of the Invention [Field of Industrial Application] The present invention relates to an electronic endoscope, and more particularly, to an electronic endoscope having a solid-state image sensor that photoelectrically converts a subject image formed by an objective optical system. .

[Prior Art] As is well known, an electronic endoscope uses an objective optical system that uses a solid-state image sensor (hereinafter referred to as C) disposed near the rear of the objective optical system.
The object image is formed on a CCD (OD), which is then photoelectrically converted and extracted as an electrical signal.
is stroked so as to be driven by a driving IC or the like disposed near it. On the other hand, the objective optical system, COD,
A light guide (hereinafter referred to as L) that generates light and heat is installed near the IC.
G) are arranged in close proximity.

In the distal end portion of the electronic endoscope configured in this way, L
G, CCD, and IC are considered to be three major heat sources, and there is a possibility that other peripheral components may be adversely affected. However, in conventional electronic endoscopes, including ``1 LG, COD, I
Regarding the heating caused by C etc. on other peripheral parts, for example,
As disclosed in Japanese Patent Application Laid-Open No. 61-219922,
No particular heat dissipation measures were taken, leaving the COD to natural diffusion through the frame supporting the COD.

[Problems to be solved by the invention] By the way, 1. In the conventional electronic endoscope described in
The heat generated by G, COD, IC, etc. not only has a negative effect on peripheral components, but also the temperature of CCD and IC increases due to heating.
If the value increases by 1, the function will obviously deteriorate and the performance will deteriorate.

Therefore, in view of these problems, it is an object of the present invention to specifically eliminate external heat applied to COD, and to
It is an object of the present invention to provide an electronic endoscope in which the heat generated by the OD itself is quickly dissipated to the outside, thereby eliminating the above-mentioned drawbacks.

[Means and effects for solving the problems] In order to solve the above problems, the present invention provides the illumination optical system, COD,
At least one of the ICs is provided with a heat dissipation means, and
They are characterized by being separated from each other by heat insulation 4].

[Example] Hereinafter, the present invention will be explained based on illustrated embodiments.

FIG. 1 is a sectional view of the distal end portion of an electronic endoscope showing a first embodiment of the present invention. In Fig. 1, 1 is an electronic endoscope, 2 is an objective optical system, and 3 is a CCD.

4 is a driving IC for operating the CCD, 5 is an illumination optical window, 6 is an LG made of an optical fiber bundle, 7 is a channel for inserting a treatment instrument such as forceps, 8a is a metal water pipe, 8b is an air pipe, 9 indicates nozzles for air supply and water supply, respectively.
These are each disposed within a tip component 10 made of a heat insulating material.

The heat dissipation and heat insulation means according to the present invention is constructed as follows. That is, the heat dissipation means of the CCD 3 is achieved by extending a connecting fitting 2b formed by bending the base of the metallic lens frame 2a supporting the objective optical system 2 and the CCD 3 to the outer wall of the water pipe 8a. , the same connecting fitting 2b
The outer periphery of the lens frame 2a is covered with a heat insulating material 2c forming the tip component 10, thereby thermally separating it from other members. In this way, 1:, the CCD 3 radiates and insulates heat through the lens frame 2a, the connecting metal fittings 2b, and the heat insulating shrine 2c, and also covers the IC 4 with a heat insulating resin 4a between it and the IC 4 for thermal protection. I try to separate them.

Further, the IC 4 covers the outer circumferential surface except for the rear end surface with a thermally conductive member 4b, extends a part of it, and bends it to form a connecting part 4C, which is attached to the outer wall of the -1- delivery water pipe 8a. It is connected to dissipate heat. -1- The illumination optical window 5 and LG6 are fixed to the endoscope tip component with a holding frame 6a made of a heat dissipating material, and the outside thereof is covered with a heat insulating material 2C, and the frame 6a is attached to a connecting metal fitting 6b. It is connected to a limb covering body 11 made of wire mesh or the like, which constitutes a flexible tube. Furthermore, the cleaning water discharged from the nozzle 9 of the [-2 water pipe 8a toward the front end surface of the objective optical system 2] reaches the front end surface of the illumination optical window 5, thereby serving as a heat dissipation means. Note that the objective optical system 2. The lens frame 2a holding the CCD 3 and the thermally conductive member 4b covering the IC 4 may be directly soldered to the outer wall of the water pipe 8a.

FIG. 2 is a sectional view of the distal end portion of an electronic endoscope showing a second embodiment of the present invention. Note that the electronic endoscope 1 in this embodiment
Since the configuration is almost the same as that of the electronic endoscope shown in FIG. 1, the same components will be designated by the same reference numerals and their explanation will be omitted. The CCD 3 in this electronic endoscope* 12 has one end of a highly thermally conductive cable 13 connected to the side surface of the chip, and the other end of the cable 13 connected to the water pipe 8a to radiate heat. At this time, the cable 13 is kept sufficiently away from the light guide 6, which gets very hot, so that the heat from the light guide 6 does not flow back to the CCD 3. Further, a base 14 is provided at the tip of the light guide 6, and water is injected from a water pipe nozzle 9 to radiate heat from the light guide 6. In addition, the heat radiation of the light guide 6 is
4 to the water pipe 8 with a highly thermally conductive cable (not shown).
It is also possible to perform this by connecting to a. Further” 1 CC
D3 and IC4 are thermally isolated by a heat insulating resin 4a. Moreover, the above IC4 is a member 1 having higher thermal conductivity.
5 covers all sides except the base, and connects one end of the member 15 to a part of the flexible tube 21 (see Fig. 3) forming the curved part of the endoscope (see Fig. 3) using a highly thermally conductive cable 16. to dissipate heat.

The flexible tube 21 within the curved portion of the endoscope is constructed as shown in FIG. 3. That is, as is well known, this flexible pipe 21 has four guide rings 23 (see FIG. (A) and (B)), the operating wire 24 whose tip end is attached to the tip fitting 25 is pulled through, and by operating the operating wire 24 with an operating section (not shown), the flexible tube 21 is rotated to bend the operating wire 24. The part is curved. Also, 20′? 'j bending machine (111
%, the guide ring 23 that guides the running of the operating wire (angle wire) 24 inside the curved pipe is U (up) and D (
If you are outside of the four equally divided positions of (down), L (left), and R (right), if you apply a curve, the curve will deviate in the direction you left it, so the guide ring should be placed on the rear end side of the curve. 23 is provided in a direction opposite to the direction in which the tip comes off on the distal end side, so as to reduce the deviation of the curvature. That is, as shown in FIG. 4 (8), the connecting ring 22 on the tip side is slightly moved toward the L (left) side due to the fixed position of the tip of the operating wire 24, and the guide ring 23 on the D (down) side is It's off. If the operating wire is operated in this position, the tip will shift toward L (left) and become curved.
In this example, the guide ring 23 on the D (down) side on the rear end side is slightly removed to the R (right side) as shown in Figure 3 (B) to correct the deviation on the tip side. It is.

In the electronic endoscope 1 of the present invention configured as described above, the CCD, IC, etc. are not particularly heated as in a double series. Therefore, performance deterioration due to such heating does not occur.

It goes without saying that between the CCD and the base, for example, a heat insulating resin and a resin with good thermal conductivity may be laminated to provide heat insulation and heat radiation.

[Effects of the Invention] As explained above, according to the present invention, heat from the outside applied to the electronic endoscope, especially the CCD and IC, is prevented, and the heat generated by the endoscope itself is quickly dissipated to the outside. Therefore, it is possible to provide an electronic endoscope that eliminates the drawback of conventional electronic endoscopes, in particular that the performance deteriorates due to the temperature r = 4-'it of the CCD and IC. can.

[BRIEF DESCRIPTION OF THE DRAWINGS] FIG. 1 is an enlarged sectional view of the distal end of an electronic endoscope showing a first embodiment of the present invention, and FIG. 2 is an enlarged sectional view of an electronic endoscope showing a second embodiment of the present invention. FIG. 3 is an enlarged cross-sectional view of the distal end of the endoscope. FIG.
FIG. 3 is an enlarged side view of the guide ring taken along line and line BB'. 1......Electronic endoscope 2...Objective optical system 3...CCD (solid-state imaging device) 4...
......IC

Claims (2)

[Claims] (1) At the tip, an illumination optical system, an objective optical system, a solid-state image sensor that photoelectrically converts a subject image formed by this objective optical system, an IC related to this solid-state image sensor, and an objective of the objective optical system. An electronic endoscope equipped with a water supply pipe for washing a window, characterized in that at least one of the illumination optical system, solid-state image sensor, and IC is provided with a heat dissipation means, and each is separated by a heat insulating material. Electronic endoscope. (2) The electronic endoscope according to claim 1, wherein the heat radiating means conducts heat from the solid-state image pickup device or IC to the water supply pipe through a heat radiating member.