JPS6321185Y2 - - Google Patents

Info

Publication number
JPS6321185Y2
JPS6321185Y2 JP1983031556U JP3155683U JPS6321185Y2 JP S6321185 Y2 JPS6321185 Y2 JP S6321185Y2 JP 1983031556 U JP1983031556 U JP 1983031556U JP 3155683 U JP3155683 U JP 3155683U JP S6321185 Y2 JPS6321185 Y2 JP S6321185Y2
Authority
JP
Japan
Prior art keywords
connection
output terminal
horseshoe
needle
central portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1983031556U
Other languages
English (en)
Japanese (ja)
Other versions
JPS58166282U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1983031556U priority Critical patent/JPS58166282U/ja
Publication of JPS58166282U publication Critical patent/JPS58166282U/ja
Application granted granted Critical
Publication of JPS6321185Y2 publication Critical patent/JPS6321185Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H01L2224/331—Disposition
    • H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
    • H01L2224/33181—On opposite sides of the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Synchronous Machinery (AREA)
JP1983031556U 1983-03-07 1983-03-07 交流発電機用全波整流装置 Granted JPS58166282U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983031556U JPS58166282U (ja) 1983-03-07 1983-03-07 交流発電機用全波整流装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983031556U JPS58166282U (ja) 1983-03-07 1983-03-07 交流発電機用全波整流装置

Publications (2)

Publication Number Publication Date
JPS58166282U JPS58166282U (ja) 1983-11-05
JPS6321185Y2 true JPS6321185Y2 (enrdf_load_stackoverflow) 1988-06-10

Family

ID=30043228

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983031556U Granted JPS58166282U (ja) 1983-03-07 1983-03-07 交流発電機用全波整流装置

Country Status (1)

Country Link
JP (1) JPS58166282U (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS58166282U (ja) 1983-11-05

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