JPS63211627A - Surface treatment lising chemical - Google Patents

Abstract

PURPOSE:To make throughput speed uniform, and to improve the dimensional accuracy of film thickness, etc., formed onto a substrate to be treated by simultaneously supplying the whole surface of the substrate to be treated with chemicals by using a liquid supply nozzle to which a thin-film having a fine hole is shaped. CONSTITUTION:Chemicals 3 are held into a thin-film 2 having fine holes 2a in a chemical supply nozzle 1, the chemical supply nozzle 1 is brought near to a substrate to be treated 4 under the state in which chemicals 3 exude onto the surface by surface tension, chemicals 3 are brought into contact with the substrate to be treated 4, and the whole surface of the substrate to be treated 4 is supplied simultaneously with chemicals 3. The chemical supply nozzle 1 is pulled up by several mm and separated from the substrate to be treated 4 until chemicals 3 and the substrate to be treated 4 are not brought into contact from the state, the substrate 4 is developed, a spin chuck 5 is turned and used chemicals are flung away, and the substrate to be treated 4 is supplied with chemicals 3 as mentioned above. Accordingly, since the whole surface of the substrate to be treated 4 can be fed simultaneously with chemicals 3 by the fine holes 2a in the thin-film 2 shaped to the chemical supply nozzle 1, chemicals are distributed uniformly, thus improving the dimensional accuracy of film thickness formed to the substrate to be treated 4.

Description

[Detailed Description of the Invention] [Summary] A chemical solution is simultaneously supplied to the entire surface of a substrate to be processed through a thin film having a larger area than the substrate to be processed and having micropores through which the chemical solution can pass. A surface treatment method using a chemical solution that performs surface treatment on a substrate, uniformizes the processing speed on the surface of the substrate to be processed, and improves dimensional accuracy such as film thickness formed on the substrate to be processed.

[Industrial application field]

The present invention relates to a method for manufacturing a semiconductor device, and particularly to an improvement in a surface treatment method using a chemical solution.

In the manufacturing process of semiconductor devices, it is common practice to treat the surface of the substrate to be processed with a chemical solution. It often happens that the dimensional accuracy of the film formed on the substrate becomes poor.

Under these circumstances, there is a need for a surface treatment method using a chemical solution that can uniformize the processing speed and improve the dimensional accuracy of the film formed on the substrate to be treated.

[Conventional technology]

One of the conventional surface treatment methods using a chemical liquid is a spray method, in which a substrate 4 to be processed is placed on a spin chuck 5, and a chemical liquid used for processing is applied from a chemical liquid spray nozzle 11, as shown in FIG. 2(a). Processing is performed by spouting the spray into a mist and adhering it to the surface of the substrate 4 to be processed, and after the processing, while rotating the spin chuck 5, the rinsing liquid is sprayed from the rinsing liquid spray nozzle 6 to cover the surface of the substrate 4 to be processed. It is something to be cleaned.

The other method is a nozzle dripping method, in which the chemical solution is sprayed dropwise from the chemical solution dripping nozzle 21 and applied to the surface of the substrate 4 to be processed, as shown in FIG. 2(b). While rotating the chuck 5, a rinsing liquid is sprayed from a rinsing liquid spray nozzle 6 to clean the surface of the substrate 4 to be processed.

[Problem to be Solved by the Invention 3] Problems with the conventional surface treatment method using a chemical as described above are that the amount of the chemical used is extremely large, and in the spray method, the treatment liquid is concentrated in the peripheral area. Replacement of liquid is fast, and in the center, the discharge of the processing liquid after being used for processing is blocked by the processing liquid in the periphery, making it difficult to discharge.On the other hand, with the nozzle dripping method, new liquid is always supplied to the center, and the discharge of the processing liquid after being used for processing is impaired. Since used liquid is supplied to the substrate, variations occur in the distribution of the chemical solution supplied to the substrate to be processed, resulting in uneven processing speed and poor dimensional accuracy such as the thickness of the film formed on the substrate to be processed. That's true.

In view of the above-mentioned circumstances, the present invention aims to provide a surface treatment method using a chemical solution that can be carried out simply and at low cost.

[Means for solving problems]

The above-mentioned problem is that the chemical solution passes through a thin film that has a larger area than the substrate to be processed and has micropores that allow the chemical solution to pass through.

This problem is solved by the surface treatment method using a chemical solution of the present invention, in which a chemical solution is simultaneously supplied to the entire surface of the substrate to be processed, and the surface of the substrate to be processed is treated.

[Effect]

That is, in the present invention, a chemical solution is held in a thin film having micropores that is larger than the substrate to be processed by surface tension, and the thin film with the chemical solution seeping out from the micropores is placed close to the substrate to be processed. By contacting the substrate to be processed, the chemical solution can be simultaneously supplied to the entire surface of the substrate to be processed. This makes it possible to simultaneously supply the chemical solution to the entire surface of the substrate to be processed, making the processing speed uniform and reducing the It becomes possible to improve the dimensional accuracy of the film thickness and the like formed on the processing substrate.

〔Example〕

An embodiment of the present invention will be described below with reference to FIG. 1 in the case of development.

As shown in FIG. 1(a), the fine holes 2 of the chemical liquid supply nozzle 1
A chemical solution 3 is held in the thin film 2 having a surface tension, and the chemical solution supply nozzle 1 is brought close to the substrate to be processed 4 with the chemical solution 3 oozing out to the surface due to surface tension, and the chemical solution 3 is brought into contact with the substrate to be processed 4. The chemical solution 3 is simultaneously supplied to the entire surface of the substrate 4 to be processed.

From this state, until the chemical solution 3 and the substrate to be processed 4 are no longer in contact with each other, lift the chemical solution supply nozzle l until it is separated from the substrate to be processed 4, wait for development to occur, and then rotate the spin chuck 5 to use it. The chemical solution 3 is shaken off, and the chemical solution 3 is again supplied to the substrate 4 to be processed as described above.

After performing this operation a required number of times, the chemical supply nozzle 1 is pulled up high, and while the spin chuck 5 is rotated, the rinsing liquid is spouted from the rinsing liquid spray nozzle 6 to clean the surface of the substrate 4 to be processed. Finish the process.

In addition, as a method for removing the used chemical solution 3 and supplying a new chemical solution 3, the chemical solution supply nozzle 1 is held in a state where the chemical solution 3 is supplied to the entire surface of the substrate 4 to be processed, and the chemical solution 3 is removed and supplied. It is also possible to perform this by ejecting the chemical solution 3 from the micropores 2a by pressurizing the inside of the chemical solution supply nozzle 1.

The fine holes 2 of the thin film 2 provided in the chemical solution supply nozzle 1 in this way
Since the chemical solution 3 can be simultaneously supplied to the entire surface of the substrate 4 to be processed, the distribution of the chemical solution becomes uniform, and the substrate to be processed Fi
Since the entire surface of the substrate 4 can be developed under the same conditions, it is possible to improve the dimensional accuracy of the film thickness formed on the substrate 4 to be processed.

〔Effect of the invention〕

As explained above, according to the present invention, by simultaneously supplying a chemical solution to the entire surface of a substrate to be processed using a liquid supply nozzle provided with a thin film with micropores having an extremely simple structure,
It has the advantage of making the processing speed uniform and making it possible to improve the dimensional accuracy of the film formed on the substrate to be processed, such as the thickness of the film, so it is expected to have a significant quality improvement effect and is extremely useful industrially. .

[Brief explanation of the drawing]

FIG. 1 is a side sectional view showing an embodiment of the present invention, FIG. 2 is a side sectional view showing a conventional surface treatment method using a chemical solution,
It is. In the figure, 1 is a chemical liquid supply nozzle, 2 is a thin film, 2a is a fine hole, 3 is a chemical liquid, 4 is a substrate to be processed, 5 is a spin chuck, 6 is a rinse liquid spray nozzle, chemical liquid supply +8+ cleaning with rinse liquid (bl FIG. 1 is a side view showing one embodiment of the present invention.

Claims (1)

[Claims] The chemical solution (3) is applied to the entire surface of the substrate to be processed (4) through a thin film (2) having a larger area than the substrate to be processed (4) and having micropores (2a) through which the chemical solution can pass. A surface treatment method using a chemical solution, characterized in that the surface treatment of the substrate (4) to be treated is performed by simultaneously supplying a chemical solution to the substrate (4).