JPS63210111A - Optical resin material - Google Patents
Optical resin materialInfo
- Publication number
- JPS63210111A JPS63210111A JP62043167A JP4316787A JPS63210111A JP S63210111 A JPS63210111 A JP S63210111A JP 62043167 A JP62043167 A JP 62043167A JP 4316787 A JP4316787 A JP 4316787A JP S63210111 A JPS63210111 A JP S63210111A
- Authority
- JP
- Japan
- Prior art keywords
- compound
- vinylphenyl
- molecule
- vinyl monomer
- bis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 24
- 239000000463 material Substances 0.000 title claims abstract description 15
- 239000011347 resin Substances 0.000 title claims description 16
- 229920005989 resin Polymers 0.000 title claims description 16
- 150000001875 compounds Chemical class 0.000 claims abstract description 22
- 239000000178 monomer Substances 0.000 claims abstract description 22
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims abstract description 16
- -1 vinylphenyl groups Chemical group 0.000 claims abstract description 15
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 14
- 239000000203 mixture Substances 0.000 claims abstract description 13
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 12
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229920000642 polymer Polymers 0.000 claims abstract description 6
- AZDCYKCDXXPQIK-UHFFFAOYSA-N ethenoxymethylbenzene Chemical compound C=COCC1=CC=CC=C1 AZDCYKCDXXPQIK-UHFFFAOYSA-N 0.000 claims abstract description 5
- ZXLAFQNTMMFLSA-UHFFFAOYSA-N 1-ethenyl-4-[2-(4-ethenylphenyl)ethyl]benzene Chemical compound C1=CC(C=C)=CC=C1CCC1=CC=C(C=C)C=C1 ZXLAFQNTMMFLSA-UHFFFAOYSA-N 0.000 claims abstract 2
- 150000003440 styrenes Chemical class 0.000 claims 1
- 125000003011 styrenyl group Chemical group [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 33
- 238000006116 polymerization reaction Methods 0.000 abstract description 18
- 239000003431 cross linking reagent Substances 0.000 abstract description 8
- 238000010521 absorption reaction Methods 0.000 abstract description 4
- 239000003999 initiator Substances 0.000 abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 4
- 125000000217 alkyl group Chemical group 0.000 abstract description 3
- 238000002156 mixing Methods 0.000 abstract description 3
- 125000003118 aryl group Chemical group 0.000 abstract description 2
- 125000000623 heterocyclic group Chemical group 0.000 abstract description 2
- 125000001424 substituent group Chemical group 0.000 abstract description 2
- 125000001931 aliphatic group Chemical group 0.000 abstract 2
- NCHZKEUPDYRVSU-UHFFFAOYSA-N 1-[2-[1,8-bis(4-ethenylphenyl)octan-2-yloxy]-8-(4-ethenylphenyl)octyl]-4-ethenylbenzene Chemical compound C1=CC(C=C)=CC=C1CCCCCCC(OC(CCCCCCC=1C=CC(C=C)=CC=1)CC=1C=CC(C=C)=CC=1)CC1=CC=C(C=C)C=C1 NCHZKEUPDYRVSU-UHFFFAOYSA-N 0.000 abstract 1
- 238000007872 degassing Methods 0.000 abstract 1
- 230000000704 physical effect Effects 0.000 description 9
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- PJANXHGTPQOBST-VAWYXSNFSA-N Stilbene Natural products C=1C=CC=CC=1/C=C/C1=CC=CC=C1 PJANXHGTPQOBST-VAWYXSNFSA-N 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- PJANXHGTPQOBST-UHFFFAOYSA-N stilbene Chemical compound C=1C=CC=CC=1C=CC1=CC=CC=C1 PJANXHGTPQOBST-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- IAXXETNIOYFMLW-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) 2-methylprop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C(=C)C)CC1C2(C)C IAXXETNIOYFMLW-UHFFFAOYSA-N 0.000 description 1
- DSPZRAREZHBQMV-UHFFFAOYSA-N (4-butylcyclohexyl) (4-butylcyclohexyl)oxycarbonyloxy carbonate Chemical compound C1CC(CCCC)CCC1OC(=O)OOC(=O)OC1CCC(CCCC)CC1 DSPZRAREZHBQMV-UHFFFAOYSA-N 0.000 description 1
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 1
- 150000003923 2,5-pyrrolediones Chemical class 0.000 description 1
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 1
- KBKNKFIRGXQLDB-UHFFFAOYSA-N 2-fluoroethenylbenzene Chemical compound FC=CC1=CC=CC=C1 KBKNKFIRGXQLDB-UHFFFAOYSA-N 0.000 description 1
- QZYCWJVSPFQUQC-UHFFFAOYSA-N 3-phenylfuran-2,5-dione Chemical compound O=C1OC(=O)C(C=2C=CC=CC=2)=C1 QZYCWJVSPFQUQC-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- 235000009852 Cucurbita pepo Nutrition 0.000 description 1
- 241000219104 Cucurbitaceae Species 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- YMOONIIMQBGTDU-VOTSOKGWSA-N [(e)-2-bromoethenyl]benzene Chemical compound Br\C=C\C1=CC=CC=C1 YMOONIIMQBGTDU-VOTSOKGWSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 125000000751 azo group Chemical group [*]N=N[*] 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- QUZSUMLPWDHKCJ-UHFFFAOYSA-N bisphenol A dimethacrylate Chemical compound C1=CC(OC(=O)C(=C)C)=CC=C1C(C)(C)C1=CC=C(OC(=O)C(C)=C)C=C1 QUZSUMLPWDHKCJ-UHFFFAOYSA-N 0.000 description 1
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- KETWBQOXTBGBBN-UHFFFAOYSA-N hex-1-enylbenzene Chemical compound CCCCC=CC1=CC=CC=C1 KETWBQOXTBGBBN-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- SEEYREPSKCQBBF-UHFFFAOYSA-N n-methylmaleimide Chemical compound CN1C(=O)C=CC1=O SEEYREPSKCQBBF-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- QIWKUEJZZCOPFV-UHFFFAOYSA-N phenyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1=CC=CC=C1 QIWKUEJZZCOPFV-UHFFFAOYSA-N 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 235000021286 stilbenes Nutrition 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は特に複屈折が小さく、透明性、耐熱性及び吸湿
性に優れた光学用樹脂素材忙関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Field of Application) The present invention particularly relates to optical resin materials having low birefringence and excellent transparency, heat resistance, and hygroscopicity.
(従来技術)
近年、特に記憶容量が大きく、ランダムアクセス可能な
情報記録媒体として光ディスクが注目され、その普及が
著しい。かかる光ディスクは、その種類により再生専用
型、追記専用型及び書換可能型に分類され、再生専用型
については、例えばビデオディスク、コンパクトディス
ク等に応用され大規模な市場を形成するに至っている。(Prior Art) In recent years, optical disks have attracted attention as information recording media that have a particularly large storage capacity and are randomly accessible, and their use has been remarkable. Such optical discs are classified into read-only types, write-once-only types, and rewritable types depending on their type, and the read-only types have been applied to, for example, video discs, compact discs, etc., and have formed a large-scale market.
一方、追記専用型や書換可能型については、例えば文章
ファイル。On the other hand, for write-only types and rewritable types, for example, text files.
計算機用ファイル、ビデオファイル等に応用されて一部
市場に出たものもあるが、さらに開発が進められている
。このような光デイスり用基板としては、複屈折が小さ
く、透明性。Some of these have been applied to computer files, video files, etc., and have reached the market, but further development is underway. A substrate for such an optical device has low birefringence and is transparent.
耐熱性、吸湿性などの機能が要求され、特に追記専用型
や書換可能型は再生専用型に較べて上記した機能により
優れることが要求される。従来、光デイスク用基板など
の光学用樹脂素材に関しては、ポリメタクリル酸メチル
やポリカーボネートなどで、射出成形してビデオディス
クやコンパクトディスク等の基板として使用されている
。しかしながら、かかる従来のディスク基板などの光学
用樹脂素材は、追記専用型や書換可能型に適用する場合
に上記したような機能の不足により問題があった。Functions such as heat resistance and hygroscopicity are required, and in particular, write-only types and rewritable types are required to be superior to the above-mentioned functions compared to read-only types. Conventionally, optical resin materials such as substrates for optical disks are made of polymethyl methacrylate, polycarbonate, etc., and are injection molded and used as substrates for video disks, compact disks, and the like. However, such conventional optical resin materials such as disk substrates have problems due to the lack of the above-mentioned functions when applied to write-once type or rewritable type.
上記した問題に対して、最近では例えばエポキシ樹脂の
注型重合による光デイスク基板の製造方法(特開昭59
−22248号)、メタクリル酸メチルと特定のメタク
リル酸アルキルエステル、架橋性単量体及びこれらと共
重合可能なモノエチレン性不飽和単量体からなる、粘度
を特定したメタクリル系部分混合物をラジカル重合開始
剤の存在下に、成形金型内で加圧加熱条件下で硬化させ
る光デイスク用基板の製造方法(特開昭−61−8!1
213号)、芳香族ビニル系単量体および該芳香族ビニ
ル系単量体と共重合可能な他のビニル系単量体をそれぞ
れ特定量配合してなる単量体混合物または単量体を注型
重合してなる光デイスク基板(特開昭61−24621
0号)等が提案されている。In order to solve the above-mentioned problems, recently, for example, a method for manufacturing an optical disk substrate by cast polymerization of epoxy resin (Japanese Patent Laid-Open No. 59
-22248), radical polymerization of a methacrylic partial mixture with a specified viscosity, consisting of methyl methacrylate, a specific methacrylic acid alkyl ester, a crosslinkable monomer, and a monoethylenically unsaturated monomer copolymerizable with these. A method for producing an optical disk substrate in which the substrate is cured under pressure and heat in a mold in the presence of an initiator (JP-A-61-8!1)
No. 213), a monomer mixture or a monomer comprising a specific amount of an aromatic vinyl monomer and another vinyl monomer copolymerizable with the aromatic vinyl monomer. Optical disk substrate formed by mold polymerization (Japanese Patent Application Laid-Open No. 61-24621
No. 0) etc. have been proposed.
(発明が解決しようとする課題)
しかしながら、上記の如き提案された光学用樹脂素材も
、その要求される全ての機能を満足するものでなく、特
に追記専用型や書換可能型用の光デイスク用基板として
用いた場合に、より複屈折が小さく、透明性、耐熱性。(Problem to be Solved by the Invention) However, the optical resin materials proposed above do not satisfy all the required functions, and are especially suitable for write-once type and rewritable type optical discs. When used as a substrate, it has lower birefringence, transparency, and heat resistance.
及び吸湿性の全ての機能をより満足させる光デイスク基
板が要望されている。したh′−って、本発明の目的は
このような光デイスク用基板などとして好適なプラスチ
ック光学用樹脂素材を提供することにある。There is a need for an optical disk substrate that satisfies all the functions of hygroscopicity and hygroscopicity. An object of the present invention is to provide a plastic optical resin material suitable for such optical disk substrates.
(課題を解決するための手段)
本発明者等は上記課題を解決するために鋭意検討した結
果、特定した化合物の架橋剤と該架橋剤と共重合可能な
ビニル系単量体よりなる組成物を注型重合することによ
り、所望の物性を有する樹脂が得られることを見出して
、本発明を提案するに至った。即ち、本発明は分子内に
少なくと42個以上のビニルフェニル基を有する化合物
5〜50重量%及び該化合物と共重合可能な他のビニル
系単量体50〜95重量%よりなる組成物を主成分とす
る光学用樹脂素材である。(Means for Solving the Problems) As a result of intensive studies to solve the above problems, the present inventors have developed a composition comprising a crosslinking agent of a specified compound and a vinyl monomer copolymerizable with the crosslinking agent. The present inventors have discovered that a resin having desired physical properties can be obtained by cast polymerization, and have proposed the present invention. That is, the present invention provides a composition comprising 5 to 50% by weight of a compound having at least 42 or more vinyl phenyl groups in the molecule and 50 to 95% by weight of another vinyl monomer copolymerizable with the compound. It is an optical resin material whose main component is optical resin material.
本発明においては、上記の特定した化合物の架橋剤を配
合することにより、注型重合して得られる樹脂が特に複
屈折を改良されるとともに、耐熱性及び吸湿性を満足す
るため、特に追記専用型や書換可能型としてのディスク
基板として有用である。In the present invention, by blending the crosslinking agent of the above-specified compound, the resin obtained by cast polymerization is particularly improved in birefringence, and also satisfies heat resistance and hygroscopicity. It is useful as a disk substrate for molds and rewritable molds.
本発明に用いられる架橋剤である分子内に少なくとも2
個以上のビニルフェニル基を有する化合物としては、一
般式
RicH−’H2)ユで示され、Rが例えば脂肪族炭化
水素、・・ロゲン化アルキルあるいは脂肪環、芳香環、
複素環もしくはフェニル置換アルキル等の置換基、nが
2以上であり、そなどで示される2個のビニルフェニル
基ヲ有する化合物C式中のR′はI(、CH,、C2H
5。The crosslinking agent used in the present invention contains at least two
Compounds having at least 3 vinylphenyl groups are represented by the general formula RicH-'H2), where R is, for example, an aliphatic hydrocarbon, a logogenated alkyl, an alicyclic ring, an aromatic ring,
A compound having two vinyl phenyl groups represented by a heterocyclic ring or a substituent such as phenyl-substituted alkyl, where n is 2 or more, etc. R' in the formula C is I(, CH,, C2H
5.
F 、 ct 、 Br 、 @など)、また例えばな
どの6個のビニルフェニル基を有する化合物などが挙げ
られる。なお、上記の式中におけるビニルフェニル基ま
たはフェニル基の水素は、それぞれメチル基などのアル
キル基。(F, ct, Br, @, etc.), and compounds having six vinylphenyl groups such as, for example. In addition, hydrogen of the vinyl phenyl group or the phenyl group in the above formula is an alkyl group such as a methyl group, respectively.
・・ロゲンと置換されてもよい。... May be substituted with rogen.
また、本発明に用いられる上記の架橋剤と共重合可能な
ビニル系単量体としては、ディスク基板などを得るため
に注型重合に供せられる従来公知の単量体であれば特に
限定されず、例工ばスチレン、p−メチルスチレン。Furthermore, the vinyl monomer copolymerizable with the above-mentioned crosslinking agent used in the present invention is not particularly limited as long as it is a conventionally known monomer that is subjected to cast polymerization to obtain a disk substrate or the like. Examples include styrene and p-methylstyrene.
α−メチルスチレン、クロロスチレン、フルオロスチレ
ン、ブロモスチレン、ブチルスチレン、 trans−
スチルベン、ジビニルベンゼンなどのスチレンおよびそ
の誘導体;メタクリル酸メチル、メタクリル酸ブチル、
メタクリル酸エチル、メタクリル酸フェニル、メタクリ
ル酸シクロヘキシル、メタクリル酸ボルニル、アクリル
酸メチル、アクリル酸エチルなどのメタクリル酸エステ
ル及びアクリル酸エステル;無水マレイン酸、マレイン
酸、フェニル無水マレイン酸などのマレイン酸及びその
誘導体;N−メチルマレイミド、N−フェニルマレイミ
ド等のマレイミド誘導体などが挙げられるが、架橋剤と
の共重合性が良好で且つ吸湿性の低いディスク基板を得
るためには特にスチレン及びその誘導体を用いることが
好ましい。なお、目的とするディスク基板における他の
物性の向上を図るために、上記のビニル′単量体と共重
合可能な単量体を併用することも出来る。α-methylstyrene, chlorostyrene, fluorostyrene, bromostyrene, butylstyrene, trans-
Styrene and its derivatives such as stilbene and divinylbenzene; methyl methacrylate, butyl methacrylate,
Methacrylic acid esters and acrylic esters such as ethyl methacrylate, phenyl methacrylate, cyclohexyl methacrylate, bornyl methacrylate, methyl acrylate, and ethyl acrylate; maleic anhydride, maleic acid, and maleic acid such as phenylmaleic anhydride; Derivatives: Maleimide derivatives such as N-methylmaleimide and N-phenylmaleimide can be mentioned, but styrene and its derivatives are particularly used in order to obtain a disk substrate that has good copolymerizability with a crosslinking agent and has low hygroscopicity. It is preferable. Incidentally, in order to improve other physical properties of the target disk substrate, a monomer copolymerizable with the above-mentioned vinyl' monomer can also be used in combination.
さらに、上記の単量体混合物に、本発明の目的の達成を
阻害しない範囲で、例えば酸化防止剤、光安定剤、離型
剤、帯電防止剤などを混合してもかまわなり0
本発明における分子内に少なくとも2個以上のビニルフ
ェニル基を有する化合物と該化合物と共重合可能な他の
ビニル系単量体との配合割合は、本発明の効果を十分に
発揮させるためには1分子内に少なくとも2個以上のビ
ニルフェニル基を有する化合物が5〜50重量%、好ま
しくは10〜30重量%と該化合物と共重合可能な他の
ビニル系単量体が50〜95重量%、好ましくは90〜
70重量%となるように選ぶのがよい。即ち、分子内に
少なくとも2個以上のビニルフェニル基を有する化合物
の配合量が5重量%より少な込場合には、得られる基板
の耐熱性が低下し、複屈折が大きくなる。また、逆に分
子内に少なくとも2個以上のビニルフェニル基を有する
化合物を50重量%より多く用いた場合には、得られる
基板の機械的強度が低下するため好ましくなho
本発明の重合体は一般に注型重合の方法により得られる
。注型重合法は特に制限な(用いられ、例えば上記した
分子内に少なくとも2個以上のビニルフェニル基を有す
る化合物と該化合物と共重合可能な他のビニル系単量体
を混合した組成物に、例えばビス−(4−1−ブチルシ
クロヘキシル)パーオキシジカーボネート、ベンゾイル
パーオキサイド等の過酸化物系、アゾ系などのラジカル
開始剤を所定量混合し、重合用金型中に注入し、脱泡後
に所定温度で所定時間の重合を行なう方法である。この
際1重合用金型として、案内溝またはピットが記された
金属原板を用い、直接に基板に案内溝やピットの転写を
行なってもよいし、所定の厚さの注型重合板を作成した
後、その板から円板を切り出してもよい。Furthermore, it is possible to mix, for example, an antioxidant, a light stabilizer, a mold release agent, an antistatic agent, etc. into the above-mentioned monomer mixture as long as it does not impede the achievement of the objects of the present invention. In order to fully exhibit the effects of the present invention, the blending ratio of a compound having at least two or more vinyl phenyl groups in the molecule and another vinyl monomer that can be copolymerized with the compound should be within one molecule. 5 to 50% by weight, preferably 10 to 30% by weight of a compound having at least two or more vinyl phenyl groups, and 50 to 95% by weight, preferably 50 to 95% by weight of another vinyl monomer copolymerizable with the compound. 90~
It is preferable to select it so that it is 70% by weight. That is, if the amount of the compound having at least two vinyl phenyl groups in the molecule is less than 5% by weight, the heat resistance of the resulting substrate will decrease and the birefringence will increase. On the other hand, if the compound having at least two or more vinyl phenyl groups in the molecule is used in an amount exceeding 50% by weight, the mechanical strength of the resulting substrate will decrease, which is preferable for the polymer of the present invention. It is generally obtained by a cast polymerization method. The cast polymerization method is not particularly limited (it can be used, for example, for a composition containing a compound having at least two or more vinyl phenyl groups in the molecule described above and another vinyl monomer copolymerizable with the compound). For example, a predetermined amount of peroxide-based radical initiators such as bis-(4-1-butylcyclohexyl) peroxydicarbonate and benzoyl peroxide, and azo-based radical initiators are mixed, and the mixture is injected into a polymerization mold and decomposed. This is a method in which polymerization is carried out at a predetermined temperature for a predetermined time after foaming.At this time, a metal original plate with guide grooves or pits is used as a mold for one polymerization, and the guide grooves and pits are transferred directly onto the substrate. Alternatively, after creating a cast-polymerized board with a predetermined thickness, a disc may be cut out from that board.
また、所定量の単量体混合物を、所定の間隙ヲ有スるガ
ラス製のモールドに注入し、紫外線、放射線の照射など
で重合してもよい。Alternatively, a predetermined amount of the monomer mixture may be injected into a glass mold having a predetermined gap and polymerized by irradiation with ultraviolet rays or radiation.
(効果)
本発明の樹脂素材は、特定した架橋剤を含む組成物を注
型重合することにより、得られる樹脂基板は複屈折15
mm以下、特に5m以下、全光線透過率85%以上、特
に90%以上、ガラス転位温度100℃以上、特に12
0℃以上及び吸水率0.1%以下、特に0.05%以下
等と優れた物性を有するため光デイスク用基板などに好
適である。(Effects) The resin material of the present invention is obtained by cast-polymerizing a composition containing a specified crosslinking agent, so that the resulting resin substrate has a birefringence of 15
mm or less, especially 5 m or less, total light transmittance of 85% or more, especially 90% or more, glass transition temperature of 100°C or more, especially 12
It has excellent physical properties such as 0° C. or higher and a water absorption rate of 0.1% or less, especially 0.05% or less, so it is suitable for substrates for optical disks and the like.
(実施例)
本発明をさらに具体的に説明するため、以下に実施例を
あげるが、本発明はこれらの実施例に限定されるもので
はなり0
なお、実施例において得られるディスク基板の材料は、
以下の試験方法によってその物性を測定した。(Example) In order to explain the present invention more specifically, Examples are given below, but the present invention is not limited to these Examples.The material of the disk substrate obtained in the Example is ,
Its physical properties were measured by the following test methods.
(1)複屈折:厚さ1.3 mの板を作り、偏光顕微鏡
にて垂直入射及び30°#4め入
射の複屈折を測定。(1) Birefringence: A plate with a thickness of 1.3 m was made, and the birefringence at normal incidence and at 30° #4 was measured using a polarizing microscope.
(11)全光線透過率:厚さ1.3■の板を作り、JI
8−に−7105に従い測定。(11) Total light transmittance: Make a plate with a thickness of 1.3 cm, and
Measured according to 8-7105.
(iii) ガラス転移温度:示差走査熱量計にて測
定。(iii) Glass transition temperature: Measured with a differential scanning calorimeter.
(1v)吸水率: JIEI−に−6911に従い測定
。(1v) Water absorption rate: Measured according to JIEI-6911.
実施例 1
ビスフェノールAビニルベンジルエーテルC下、BAV
Eと略記する)20重量部とスチレン80重量部に1重
合開始剤としてビス−C4−1−ブチルシクロヘキシル
)パーオキシジカーボネニト0.2重量部を混合し、5
0℃で30分分子型合を行なった後、脱泡し、2枚のガ
ラス板とテフロンチューブで構成されたモールドの中へ
注入し、注型重合を行なった。重合は50℃で8時間、
80℃で2時間、120℃で1時間とし、重合体をガラ
スモールドから離型し、厚さ1.3■、直径150鱈で
無色透明のディスク基板を得た。得られたディスク基板
の物性を表−1に示した。Example 1 Bisphenol A Vinyl Benzyl Ether C, BAV
(abbreviated as E) and 80 parts by weight of styrene were mixed with 0.2 parts by weight of bis-C4-1-butylcyclohexyl) peroxydicarbonenite as a polymerization initiator, and
After molecular molding was carried out at 0° C. for 30 minutes, the mixture was degassed and poured into a mold composed of two glass plates and a Teflon tube to carry out cast polymerization. Polymerization was carried out at 50°C for 8 hours.
The polymer was heated at 80° C. for 2 hours and at 120° C. for 1 hour, and the polymer was released from the glass mold to obtain a colorless and transparent disk substrate with a thickness of 1.3 cm and a diameter of 150 cm. Table 1 shows the physical properties of the obtained disk substrate.
実施例2及び3
実施例1に示したビスフェノールAビニルベンジルエー
テルの代りK、
aH2=cH(c列cn2cH2$ca=cH21,2
−ビス(p−ビニルフェニル)エタンC以下、BPVg
と略記する)及び
CH2=CH−@−CH2−0←CH2大0−CH2知
トH421,6−ビス(p−ビニルベンジル)へキシエ
ーテルC以下、BPVHと略記する)を用いた以外は、
実施例1と同様に注型重合を行ないディスク基板を得た
。得られたディスク基板の物性を表−1に示した。Examples 2 and 3 K instead of bisphenol A vinylbenzyl ether shown in Example 1, aH2=cH (column ccn2cH2$ca=cH21,2
-Bis(p-vinylphenyl)ethane C or less, BPVg
(hereinafter abbreviated as BPVH)
Cast polymerization was carried out in the same manner as in Example 1 to obtain a disk substrate. Table 1 shows the physical properties of the obtained disk substrate.
実施例4及び5
実施例1で用いたBAVBの配合量を表−1に示したよ
うに変化させた他は、実施例1と同様に注型重合を行な
い、ディスク基板を得た。得られたディスク基板の物性
を表−1に示した。Examples 4 and 5 Cast polymerization was carried out in the same manner as in Example 1, except that the amount of BAVB used in Example 1 was changed as shown in Table 1, to obtain a disk substrate. Table 1 shows the physical properties of the obtained disk substrate.
比較例1.2.3及び4
実m例1に示したビスフェノールAビニルベンジルエー
テルの代すに、ジビニルベンゼンC以下、DVBと略記
する)、エチレングリコールジメタクリレートC以下、
EGDMAと略記する)及びビスフェノールAジメタク
リレートC以下、BADMAと略記する)を用すた以外
は、実施例1と同様に注型重合を行ない、ディスク基板
を得た。さらにスチレン単独で実施例1と同様に注型重
合を行ないディスク基板を得た。得られたディスク基板
の物性を表−1に示した。Comparative Examples 1.2.3 and 4 In place of the bisphenol A vinylbenzyl ether shown in Example 1, divinylbenzene C (hereinafter abbreviated as DVB), ethylene glycol dimethacrylate C or less,
Cast polymerization was carried out in the same manner as in Example 1, except that bisphenol A dimethacrylate C (hereinafter abbreviated as BADMA) was used to obtain a disk substrate. Further, cast polymerization was performed using styrene alone in the same manner as in Example 1 to obtain a disk substrate. Table 1 shows the physical properties of the obtained disk substrate.
実施例 6
実施例1に示したスチレンの代わりに、スチレン60重
量部およびtrans−スチルベン20重量部を用いた
以外は、実施例1と同様に注型重合を行ない、ディスク
基板を得た。Example 6 Cast polymerization was carried out in the same manner as in Example 1, except that 60 parts by weight of styrene and 20 parts by weight of trans-stilbene were used instead of the styrene shown in Example 1, to obtain a disk substrate.
得られたディスク基板の物性を表−1に示した。Table 1 shows the physical properties of the obtained disk substrate.
比較例 5
ホリスチレン(エスチレンH−15,新日鉄化学■製)
を1.5 oz射出成形機にて長さ120+w、幅12
■、厚さ1.5瓢の板を成形し、その中心部の複屈折及
びガラス転移温度。Comparative Example 5 Holistyrene (Estyrene H-15, manufactured by Nippon Steel Chemical)
Using a 1.5 oz injection molding machine, the length is 120+W and the width is 12
(2) Molding a plate with a thickness of 1.5 gourds and measuring the birefringence and glass transition temperature of its center.
吸水率を測定した。結果を表−1に示した。The water absorption rate was measured. The results are shown in Table-1.
Claims (4)
を有する化合物5〜50重量%及び該化合物と共重合可
能な他のビニル系単量体50〜95重量%よりなる組成
物の重合体を主成分とする光学用樹脂素材(1) A polymer composition consisting of 5 to 50% by weight of a compound having at least two or more vinyl phenyl groups in the molecule and 50 to 95% by weight of another vinyl monomer copolymerizable with the compound. Optical resin material as main component
を、有する化合物がビスフェノールAビニルベンジルエ
ーテル、1,2−ビス(p−ビニルフェニル)エタンま
たは1,6−ビス(p−ビニルベンジル)へキシエーテ
ルである特許請求の範囲第1項記載の光学用樹脂素材(2) A compound having at least two or more vinylphenyl groups in the molecule is converted into bisphenol A vinylbenzyl ether, 1,2-bis(p-vinylphenyl)ethane or 1,6-bis(p-vinylbenzyl) The optical resin material according to claim 1, which is xyether
導体である特許請求の範囲第1項記載の光学用樹脂素材(3) The optical resin material according to claim 1, wherein the other vinyl monomer is styrene or a styrene derivative.
記載の光学用樹脂素材(4) The optical resin material according to claim 1, which is a cast-polymerized polymer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62043167A JPS63210111A (en) | 1987-02-27 | 1987-02-27 | Optical resin material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62043167A JPS63210111A (en) | 1987-02-27 | 1987-02-27 | Optical resin material |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63210111A true JPS63210111A (en) | 1988-08-31 |
Family
ID=12656321
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62043167A Pending JPS63210111A (en) | 1987-02-27 | 1987-02-27 | Optical resin material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63210111A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4975491A (en) * | 1989-01-18 | 1990-12-04 | The Dow Chemical Company | Functionalized polymers prepared by anionic polymerization |
US5081191A (en) * | 1989-01-18 | 1992-01-14 | The Dow Chemical Company | Functionalized polymers prepared by anionic polymerization |
WO2013031699A1 (en) * | 2011-08-26 | 2013-03-07 | 株式会社Adeka | Curable composition and cured article |
JP2013209571A (en) * | 2012-03-30 | 2013-10-10 | Nippon Steel & Sumikin Chemical Co Ltd | Aromatic dihydroxy compound, vinyl benzil ether based compound, and curable composition containing the same |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58153901A (en) * | 1982-03-09 | 1983-09-13 | Tokuyama Soda Co Ltd | Organic optical glass |
JPS58179801A (en) * | 1982-04-15 | 1983-10-21 | Tokuyama Soda Co Ltd | Organic optical glass |
JPS6067521A (en) * | 1983-09-22 | 1985-04-17 | Agency Of Ind Science & Technol | Crosslinking agent of high polymer and its preparation |
-
1987
- 1987-02-27 JP JP62043167A patent/JPS63210111A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58153901A (en) * | 1982-03-09 | 1983-09-13 | Tokuyama Soda Co Ltd | Organic optical glass |
JPS58179801A (en) * | 1982-04-15 | 1983-10-21 | Tokuyama Soda Co Ltd | Organic optical glass |
JPS6067521A (en) * | 1983-09-22 | 1985-04-17 | Agency Of Ind Science & Technol | Crosslinking agent of high polymer and its preparation |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4975491A (en) * | 1989-01-18 | 1990-12-04 | The Dow Chemical Company | Functionalized polymers prepared by anionic polymerization |
US5081191A (en) * | 1989-01-18 | 1992-01-14 | The Dow Chemical Company | Functionalized polymers prepared by anionic polymerization |
WO2013031699A1 (en) * | 2011-08-26 | 2013-03-07 | 株式会社Adeka | Curable composition and cured article |
US20140187715A1 (en) * | 2011-08-26 | 2014-07-03 | Adeka Corporation | Curable composition and cured article |
JPWO2013031699A1 (en) * | 2011-08-26 | 2015-03-23 | 株式会社Adeka | Curable composition and cured product |
US9403925B2 (en) | 2011-08-26 | 2016-08-02 | Adeka Corporation | Curable composition and cured article |
JP2013209571A (en) * | 2012-03-30 | 2013-10-10 | Nippon Steel & Sumikin Chemical Co Ltd | Aromatic dihydroxy compound, vinyl benzil ether based compound, and curable composition containing the same |
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