JPS6320850B2 - - Google Patents
Info
- Publication number
- JPS6320850B2 JPS6320850B2 JP22916485A JP22916485A JPS6320850B2 JP S6320850 B2 JPS6320850 B2 JP S6320850B2 JP 22916485 A JP22916485 A JP 22916485A JP 22916485 A JP22916485 A JP 22916485A JP S6320850 B2 JPS6320850 B2 JP S6320850B2
- Authority
- JP
- Japan
- Prior art keywords
- acid
- vinyl ester
- resin
- formula
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 29
- 239000011347 resin Substances 0.000 claims description 29
- 229920001567 vinyl ester resin Polymers 0.000 claims description 22
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 12
- 239000003822 epoxy resin Substances 0.000 claims description 12
- 229920000647 polyepoxide Polymers 0.000 claims description 12
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 10
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 3
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 13
- 239000002253 acid Substances 0.000 description 13
- 239000000178 monomer Substances 0.000 description 11
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 10
- 229920002554 vinyl polymer Polymers 0.000 description 10
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 238000005886 esterification reaction Methods 0.000 description 9
- 239000002904 solvent Substances 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 8
- 239000004593 Epoxy Substances 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 6
- 230000032050 esterification Effects 0.000 description 6
- 229920000058 polyacrylate Polymers 0.000 description 6
- 150000002148 esters Chemical class 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 229920003986 novolac Polymers 0.000 description 4
- 150000007524 organic acids Chemical class 0.000 description 4
- -1 phenol compound Chemical class 0.000 description 4
- 239000003505 polymerization initiator Substances 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 229920006337 unsaturated polyester resin Polymers 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 3
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 3
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 238000000862 absorption spectrum Methods 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 239000012153 distilled water Substances 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- AMXOYNBUYSYVKV-UHFFFAOYSA-M lithium bromide Chemical compound [Li+].[Br-] AMXOYNBUYSYVKV-UHFFFAOYSA-M 0.000 description 2
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 235000005985 organic acids Nutrition 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- DDFYFBUWEBINLX-UHFFFAOYSA-M tetramethylammonium bromide Chemical compound [Br-].C[N+](C)(C)C DDFYFBUWEBINLX-UHFFFAOYSA-M 0.000 description 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 2
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 1
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 description 1
- CRBJBYGJVIBWIY-UHFFFAOYSA-N 2-isopropylphenol Chemical compound CC(C)C1=CC=CC=C1O CRBJBYGJVIBWIY-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical class [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- KGIGUEBEKRSTEW-UHFFFAOYSA-N 2-vinylpyridine Chemical compound C=CC1=CC=CC=N1 KGIGUEBEKRSTEW-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- 229930192627 Naphthoquinone Natural products 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- 150000001253 acrylic acids Chemical class 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 229960004217 benzyl alcohol Drugs 0.000 description 1
- CHQVQXZFZHACQQ-UHFFFAOYSA-M benzyl(triethyl)azanium;bromide Chemical compound [Br-].CC[N+](CC)(CC)CC1=CC=CC=C1 CHQVQXZFZHACQQ-UHFFFAOYSA-M 0.000 description 1
- KXHPPCXNWTUNSB-UHFFFAOYSA-M benzyl(trimethyl)azanium;chloride Chemical compound [Cl-].C[N+](C)(C)CC1=CC=CC=C1 KXHPPCXNWTUNSB-UHFFFAOYSA-M 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000007810 chemical reaction solvent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001868 cobalt Chemical class 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- PNQSSNBXIHMFMW-UHFFFAOYSA-M dimethyl(phenyl)sulfanium;chloride Chemical compound [Cl-].C[S+](C)C1=CC=CC=C1 PNQSSNBXIHMFMW-UHFFFAOYSA-M 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 239000011968 lewis acid catalyst Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 150000002791 naphthoquinones Chemical class 0.000 description 1
- 238000000655 nuclear magnetic resonance spectrum Methods 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- LSMAIBOZUPTNBR-UHFFFAOYSA-N phosphanium;iodide Chemical compound [PH4+].[I-] LSMAIBOZUPTNBR-UHFFFAOYSA-N 0.000 description 1
- 150000004714 phosphonium salts Chemical class 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 150000004053 quinones Chemical class 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 239000002990 reinforced plastic Substances 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 239000001119 stannous chloride Substances 0.000 description 1
- 235000011150 stannous chloride Nutrition 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 150000003460 sulfonic acids Chemical class 0.000 description 1
- HWCKGOZZJDHMNC-UHFFFAOYSA-M tetraethylammonium bromide Chemical compound [Br-].CC[N+](CC)(CC)CC HWCKGOZZJDHMNC-UHFFFAOYSA-M 0.000 description 1
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- OWUGVJBQKGQQKJ-UHFFFAOYSA-M trimethylsulfanium;chloride Chemical compound [Cl-].C[S+](C)C OWUGVJBQKGQQKJ-UHFFFAOYSA-M 0.000 description 1
- ZFEAYIKULRXTAR-UHFFFAOYSA-M triphenylsulfanium;chloride Chemical compound [Cl-].C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 ZFEAYIKULRXTAR-UHFFFAOYSA-M 0.000 description 1
- 238000000108 ultra-filtration Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
Landscapes
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Epoxy Resins (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Description
〔産業上の利用分野〕
本発明は、ビニル単量体に溶解させ、その硬化
体物が高い耐熱性、可撓性を有する新規ビニルエ
ステル樹脂およびその製造法に関するものであ
る。
〔従来の技術および発明が解決すべき問題点〕
近年、エポキシ樹脂と不飽和一塩基酸との反応
物をスチレンのような重合性単量体に溶解した不
飽和エポキシエステル樹脂(ビニルエステル樹
脂)が、エポキシ樹脂の性能と不飽和ポリエステ
ル樹脂の作業性や硬化性の良さを兼ね備えたもの
として着実に市場に利用されつつある。
かかるビニルエステル樹脂の使用分野は、不飽
和ポリエステル樹脂と同様に、耐蝕性強化プラス
チツク材、ライニング材、被覆材、含浸材、接着
剤、注型材など広範囲に及んでいる。
また、このビニルエステル樹脂は、エステル構
成部分であるエポキシ化合物の種類や重合度の異
なつたものを選ぶことにより、あるいはこれらを
ブレンドすることにより多種多様な性能を持たせ
ることができる。
上記ビニルエステル樹脂は、エポキシ化合物の
エポキシ基を、アクリル酸、メタクリル酸等のよ
うな不飽和一塩基酸のカルボキシル基で開環し、
エステル化してエポキシエステルを生成する反応
により製造される。最も一般式なビニルエステル
樹脂に用いられるエポキシ樹脂としては、ビスフ
エノールAのジグリシジルエーテル型のものが用
いられる。
しかし、これらビスフエノールAのジグリシジ
ルエーテル型のエポキシを原料としたビニルエス
テル樹脂は、耐酸性、耐アルカリ性においては、
一般の不飽和ポリエステル樹脂より飛躍的に高い
性能を持つものの、その熱変形温度はたかだか
110℃程度であつて高温での使用は著しく制限さ
れる。
また、従来市販されているノポラツク骨格を有
するエポキシアクリレート樹脂は、フエノール化
合物とホルマリンとを反応させて得たノボラツク
に、エピクロルヒドリンを反応させて次式〔〕
で示されるノボラツク型エポキシ樹脂
〔式中RはHまたはCH3であり、nは0〜10の
整数を示す。〕
を得、これとアクリル酸および/またはメタクリ
ル酸とをスチレン、メタクリル酸メチル等のビニ
ル性単量体の溶媒の存在下に反応させて樹脂のビ
ニル単量体溶液として製造されている。
このノボラツク骨格を有するエポキシアクリレ
ート樹脂(ビニルエステル樹脂)は次式〔〕で
示される。
〔式中RはHまたはCH3であり、ExAcは、
[Industrial Application Field] The present invention relates to a novel vinyl ester resin which is dissolved in a vinyl monomer and whose cured product has high heat resistance and flexibility, and a method for producing the same. [Prior art and problems to be solved by the invention] In recent years, unsaturated epoxy ester resins (vinyl ester resins), which are made by dissolving a reaction product of an epoxy resin and an unsaturated monobasic acid in a polymerizable monomer such as styrene, have been developed. However, it is steadily being used in the market as it combines the performance of epoxy resin with the workability and curing properties of unsaturated polyester resin. Similar to unsaturated polyester resins, vinyl ester resins are used in a wide range of applications, including corrosion-resistant reinforced plastic materials, lining materials, coating materials, impregnation materials, adhesives, and casting materials. Moreover, this vinyl ester resin can be made to have a wide variety of performances by selecting epoxy compounds having different types and degrees of polymerization as the ester component, or by blending these. The vinyl ester resin is produced by ring-opening the epoxy group of an epoxy compound with the carboxyl group of an unsaturated monobasic acid such as acrylic acid, methacrylic acid, etc.
It is produced by a reaction that involves esterification to produce an epoxy ester. As the epoxy resin used for the most general vinyl ester resin, a diglycidyl ether type of bisphenol A is used. However, these vinyl ester resins made from diglycidyl ether type epoxy of bisphenol A have poor acid resistance and alkali resistance.
Although it has dramatically higher performance than general unsaturated polyester resin, its heat distortion temperature is only
Use at high temperatures of around 110°C is severely restricted. In addition, conventionally commercially available epoxy acrylate resins having a novolac skeleton are produced by reacting epichlorohydrin with novolac obtained by reacting a phenol compound and formalin to obtain the following formula []
Novolac type epoxy resin shown by [In the formula, R is H or CH3 , and n represents an integer of 0 to 10. ] and reacts this with acrylic acid and/or methacrylic acid in the presence of a vinyl monomer solvent such as styrene or methyl methacrylate to produce a vinyl monomer solution of the resin. This epoxy acrylate resin (vinyl ester resin) having a novolak skeleton is represented by the following formula []. [In the formula, R is H or CH 3 , and ExAc is
本発明はこれらの問題点を解消するためになさ
れたもので、本発明は下記一般式〔〕
〔式中Rはメチル基または水素原子、nは0〜
15の整数を示す。〕
で示される新規ビニルエステル樹脂およびその製
造法を提供したものである。
本発明の上記一般式〔〕で示される新規ビニ
ルエステル樹脂はビニル単量体に溶解させ、その
硬化物が高い耐熱性、可撓性を有していることを
特徴としている。
又本発明の一般式〔〕で示される新規ビニル
エステル樹脂は下記一般式〔〕
〔式中Rはメチル基または水素原子、nは0〜
15の整数を示す。〕
で示されるジシクロペンタジエン変性エポキシ樹
脂にアクリル酸またはアクリル酸の反応性誘導体
を反応させることにより得られる。
本発明において上記一般式〔〕で示されるジ
シクロペンタジエン変性エポキシ樹脂は、ジシク
ロペンタジエンとフエノール類(フエノール、オ
ルソクレゾール、バラクレゾール、イソプロピル
フエノール等)をルイス酸触媒中で重合させ、得
られたジシクロペンタジエン変性フエノール樹脂
をエピクロルヒドリンと反応させて得ることがで
きる。
上記一般式〔〕で示されるジシクロペンタジ
エン変性エポキシ樹脂とアクリル酸とのエステル
化反応は、エポキシ基1当量当り、アクリル酸を
0.5〜1.8当量、好まましく0.7〜1.1当量の割合で
混合し、エステル化触媒の存在下に70〜180℃好
ましくは90〜130℃の温度で、得られる樹脂の酸
価が1〜16となるまで反応させることによつて好
適に製造することができる。
かかるエステル反応は、酸素あるいは空気雰囲
気下で行うことが望ましい。
一般に反応時間は2〜16時間、好ましくは4〜
8時間である。反応溶媒としては、エステル化反
応を阻害しない溶媒であれば必要に応じ用いるこ
とが出来る。また溶媒を留去することなく硬化体
を得るには、生成せしめるビニルエステル樹脂と
共重合可能なスチレン、ジビニルベンゼン等のビ
ニル単量体を溶媒に用いると好都合である。
アクリル酸を過量に使用することは、エポキシ
樹脂とのエステル化反応速度を低下させるととも
に得られる硬化物の耐アルカリ性を著しく悪化さ
せるので好ましくない。
また、アクリル酸の一部を飽和一塩基酸、飽和
二塩基酸あるいは不飽和二塩基酸で置きかえても
よい。これらの酸は、使用する全酸成分に対して
80重量%まで、好ましくは10〜60重量%の量で用
いるのがよい。上記アクリル酸の一部の代りに使
用しうる酸の例としては、プロピオン酸、安息香
酸、フタル酸、テレフタル酸、テトラヒドロ無水
フタル酸、コハク酸、アジビン酸、フマール酸、
無水マレイン酸などが挙げられる。
本発明に用いられるエステル化触媒としては、
例えば、
(1) N,N―ジメチルアニリン、ピリジン、トリ
エチルアミン、ヘキサメチレンジアミン等の3
級アミン及びその無機酸例えば塩酸の塩あるい
は有機酸例えば酢酸の塩。
(2) テトラメチルアンモニウムブロマイド、トリ
メチルベンジルアンモニウムクロライド等の4
級アンモニウム塩。
(3) パラトルエンスルホン酸、トリフエニルスル
ホニウムクロライド等のスルホン酸及びスルホ
ニウム塩類。
(4) トリメチルスルホニウムクロライド、ジメチ
ルフエニルスルホニウムクロライド等のスルホ
ニウム塩。
(5) ホスホニウムアイオダイド等のホスホニウム
塩。
(6) 塩化リチウム、臭化リチウム、塩化第1ス
ズ、塩化亜鉛等の金属ハロゲン化物。
(7) 水酸化カリリウム、水酸化リチウム等の金属
水酸化物等。
これらエステル化触媒の中でもテトラエチルア
ンモニウムブロマイドが、他のものに比較し、ジ
シクロペンタジエン変性エポキシ樹脂との相溶性
に格段と優れ、速い反応速度を与えると共に、か
つ、高い反応率に到達させることができるので好
ましい。
これらエステル化触媒は、エポキシ樹脂と酸成
分の混合物100重量部に対し、0.005〜3重量部の
割合で用いる。
また、エステル反応は重合禁止剤の存在下で行
うことが好ましく、かかる重合禁止剤としては、
例えば、p―ハイドロキノン、ナフトキノン、ベ
ンゾキノン、ジターシヤリーブチルハイドロキシ
トルエン、ハイドロキノンモノメチルエーテル、
ターシヤリーブチルカテコールなどのモノまたは
多価フエノール類や、キノン類が挙げられる。そ
の使用量は、前記反応混合物100重量部に対して
約0.001〜1.0重量部、好ましくは0.005〜0.5重量
部である。
本発明の実施により製造されたビニルエステル
樹脂は重合開始剤の存在下に単独で硬化させるこ
とができるが、このビニルエステル樹脂はこれと
共重合可能なビニル単量体に溶解させて低粘度の
液状物とした方が取扱いが容易となる。
この際、ビニル単量体は、ビニルエステル樹脂
100重量部に対し、30〜120重量部、好ましくは40
〜80重量部の割合で用いる。
かかるビニル単量体の例としては、スチレン、
メチルアクリレート、メチルメタクリレート、ビ
ニルトルエン、クロロスチレン、ビニルベンゼ
ン、アクリロニトリル、メタクリロニトリル、シ
クロペンタジエン、シビニルベンゼン、ビニルピ
リジン、酢酸ビニル、ジアクリルフタレート、グ
リシジルメタクリレートなどが挙げられ、これら
は一種又はそれ以上を併用することもできる。
反応終了後、ポリアクリレートの貧溶媒、例え
ば水を投入することによりポリアクリレトを析出
させ、溶媒より分離する。
また、有機酸の貧溶媒であつてポリアクリレー
トの良溶媒、例えばメチルイソブチルケトン、ト
ルエン、キシレン、クロロホルム、メチルエチル
ケトン等を添加し、ポリアクリレートを有機酸層
よりこれらの溶媒層に移行させ、有機酸層を分離
後、これら溶媒を留去してポリアクリレートを分
離する。
このようにして得たポリアクリレートはアセト
ン、トルエン、クロロホルム、酢酸メチル等の有
機溶媒またはメチルメタクリレート、スチレン等
のビニル単量体に重合開始剤とともに溶解され、
塗料、プリプレグに使用される。
そして、ビニル単量体により希釈されたビニル
エステル樹脂の液状物は、液状の不飽和ポリエス
テル樹脂組成物と同様に、例えばメチルエチルケ
トンバーオキサイド―コバルト塩の組合せの重合
開始剤の存在下で常温で硬化することも可能であ
り、ベンゾイルバーオキサイドの様な高温分解重
合開始剤の添加によつて高温硬化することも可能
である。
〔実施例〕
以下に実施例を挙げて本発明を更に説明する。
実施例中、部及び%は特にことわらない限り重量
による。
実施例 1
ジシクロペンタジエン変性エポキシ樹脂
(DCE―400、エポキシ当量280g/eq)500部、
アクリル酸150部、テトラメチルアンモニウムブ
ロマイド3.0部、ハイドロキノン0.3部およびトル
エン1500部を撹拌翼及びコンデンサーを備えたフ
ラスコ内に仕込み、油溶上で100℃に加熱し反応
を行つたところ3時間後に酸価がほとんど雰とな
つた。
この反応液に10%炭酸水素ナトリウム水溶液
200ml、蒸溜水1000mlを加え過剰のアクリル酸を
除去し、更に蒸溜水1000mlで3回抽出洗浄後、有
機層を分離し、有機溶媒を留去すると、目的とす
る新規ビニルエステル樹脂 593gを得た。分析
結果を表1に示す。
この反応生成物100部に対し、スチレン54部を
加え、混合してガードナー色相が7〜8、25℃に
おける粘度が3.5ボイズの粘稠な溶液を得た。
実施例 2
実施例1で用いたエステル化触媒をトリエチル
ベンジルアンモニウムブロマイド2.5部に変えた
以外は同様な条件で、目的樹脂を得た。
その分析結果を表1に示した。
The present invention has been made to solve these problems, and the present invention has the following general formula [] [In the formula, R is a methyl group or a hydrogen atom, n is 0-
Indicates 15 integers. ] The present invention provides a novel vinyl ester resin shown in the following and a method for producing the same. The novel vinyl ester resin of the present invention represented by the above general formula [] is characterized in that it is dissolved in a vinyl monomer and the cured product thereof has high heat resistance and flexibility. In addition, the new vinyl ester resin of the present invention represented by the general formula [] is the following general formula [] [In the formula, R is a methyl group or a hydrogen atom, n is 0-
Indicates 15 integers. ] It is obtained by reacting the dicyclopentadiene-modified epoxy resin represented by acrylic acid or a reactive derivative of acrylic acid. In the present invention, the dicyclopentadiene-modified epoxy resin represented by the above general formula [] is obtained by polymerizing dicyclopentadiene and phenols (phenol, orthocresol, valaclesol, isopropylphenol, etc.) in a Lewis acid catalyst. It can be obtained by reacting dicyclopentadiene-modified phenolic resin with epichlorohydrin. In the esterification reaction between the dicyclopentadiene-modified epoxy resin represented by the above general formula [] and acrylic acid, acrylic acid is added per equivalent of epoxy group.
Mix at a ratio of 0.5 to 1.8 equivalents, preferably 0.7 to 1.1 equivalents, in the presence of an esterification catalyst at a temperature of 70 to 180°C, preferably 90 to 130°C, so that the resulting resin has an acid value of 1 to 16. It can be suitably produced by reacting until the Such ester reaction is preferably carried out in an oxygen or air atmosphere. Generally the reaction time is 2 to 16 hours, preferably 4 to 16 hours.
It is 8 hours. As the reaction solvent, any solvent that does not inhibit the esterification reaction can be used as necessary. In order to obtain a cured product without distilling off the solvent, it is convenient to use a vinyl monomer such as styrene or divinylbenzene that is copolymerizable with the vinyl ester resin to be produced. It is not preferable to use an excessive amount of acrylic acid because it reduces the rate of esterification reaction with the epoxy resin and significantly deteriorates the alkali resistance of the cured product obtained. Further, a part of the acrylic acid may be replaced with a saturated monobasic acid, a saturated dibasic acid, or an unsaturated dibasic acid. These acids are based on the total acid component used.
It is advisable to use amounts up to 80% by weight, preferably from 10 to 60% by weight. Examples of acids that can be used in place of some of the above acrylic acids include propionic acid, benzoic acid, phthalic acid, terephthalic acid, tetrahydrophthalic anhydride, succinic acid, adivic acid, fumaric acid,
Examples include maleic anhydride. As the esterification catalyst used in the present invention,
For example, (1) N,N-dimethylaniline, pyridine, triethylamine, hexamethylenediamine, etc.
amines and their salts with inorganic acids such as hydrochloric acid or with organic acids such as acetic acid. (2) 4 such as tetramethylammonium bromide, trimethylbenzylammonium chloride, etc.
grade ammonium salt. (3) Sulfonic acids and sulfonium salts such as para-toluenesulfonic acid and triphenylsulfonium chloride. (4) Sulfonium salts such as trimethylsulfonium chloride and dimethylphenylsulfonium chloride. (5) Phosphonium salts such as phosphonium iodide. (6) Metal halides such as lithium chloride, lithium bromide, stannous chloride, and zinc chloride. (7) Metal hydroxides such as potassium hydroxide and lithium hydroxide. Among these esterification catalysts, tetraethylammonium bromide has much better compatibility with dicyclopentadiene-modified epoxy resin than other catalysts, provides a fast reaction rate, and is capable of achieving a high reaction rate. This is preferable because it can be done. These esterification catalysts are used in a proportion of 0.005 to 3 parts by weight based on 100 parts by weight of the mixture of epoxy resin and acid component. Furthermore, the ester reaction is preferably carried out in the presence of a polymerization inhibitor, and such polymerization inhibitors include:
For example, p-hydroquinone, naphthoquinone, benzoquinone, ditertiarybutyl hydroxytoluene, hydroquinone monomethyl ether,
Examples include mono- or polyhydric phenols such as tertiary-butylcatechol, and quinones. The amount used is about 0.001 to 1.0 parts by weight, preferably 0.005 to 0.5 parts by weight, based on 100 parts by weight of the reaction mixture. Although the vinyl ester resin produced by the practice of the present invention can be cured alone in the presence of a polymerization initiator, the vinyl ester resin can be dissolved in a vinyl monomer copolymerizable with it to form a low viscosity resin. It is easier to handle if it is in liquid form. At this time, the vinyl monomer is a vinyl ester resin.
30 to 120 parts by weight, preferably 40 parts by weight per 100 parts by weight
It is used in a proportion of ~80 parts by weight. Examples of such vinyl monomers include styrene,
Examples include methyl acrylate, methyl methacrylate, vinyltoluene, chlorostyrene, vinylbenzene, acrylonitrile, methacrylonitrile, cyclopentadiene, cyvinylbenzene, vinylpyridine, vinyl acetate, diacrylphthalate, glycidyl methacrylate, etc. The above can also be used together. After the reaction is completed, polyacrylate is precipitated by adding a poor solvent for polyacrylate, such as water, and separated from the solvent. Additionally, by adding a poor solvent for organic acids and a good solvent for polyacrylate, such as methyl isobutyl ketone, toluene, xylene, chloroform, methyl ethyl ketone, etc., the polyacrylate is transferred from the organic acid layer to these solvent layers, and the organic acid After separating the layers, these solvents are distilled off to separate the polyacrylate. The polyacrylate thus obtained is dissolved together with a polymerization initiator in an organic solvent such as acetone, toluene, chloroform, or methyl acetate, or in a vinyl monomer such as methyl methacrylate or styrene.
Used in paints and prepregs. The liquid vinyl ester resin diluted with the vinyl monomer is then cured at room temperature in the presence of a polymerization initiator such as a combination of methyl ethyl ketone peroxide and cobalt salt, similar to the liquid unsaturated polyester resin composition. It is also possible to cure at a high temperature by adding a high temperature decomposition polymerization initiator such as benzoyl peroxide. [Example] The present invention will be further explained with reference to Examples below.
In the examples, parts and percentages are by weight unless otherwise specified. Example 1 500 parts of dicyclopentadiene-modified epoxy resin (DCE-400, epoxy equivalent 280 g/eq),
150 parts of acrylic acid, 3.0 parts of tetramethylammonium bromide, 0.3 parts of hydroquinone, and 1500 parts of toluene were placed in a flask equipped with a stirring blade and a condenser, and the reaction was carried out by heating to 100°C on an oil solution. After 3 hours, the acid The price was almost unbearable. Add 10% sodium hydrogen carbonate aqueous solution to this reaction solution.
Excess acrylic acid was removed by adding 200 ml and 1000 ml of distilled water, and after extraction and washing three times with 1000 ml of distilled water, the organic layer was separated and the organic solvent was distilled off to obtain 593 g of the desired new vinyl ester resin. . The analysis results are shown in Table 1. To 100 parts of this reaction product, 54 parts of styrene was added and mixed to obtain a viscous solution with a Gardner hue of 7 to 8 and a viscosity of 3.5 voids at 25°C. Example 2 A target resin was obtained under the same conditions as in Example 1 except that 2.5 parts of triethylbenzylammonium bromide was used as the esterification catalyst. The analysis results are shown in Table 1.
第1図は本発明の実施例1のビニルエステル樹
脂の赤外吸収スペクトルを示す図表、第2図は同
上の樹脂のGPC(限外濾過クロマトグラフ)を示
す図表、第3図は本発明の実施例2のビニルエス
テル樹脂のGPCを示す図表、第4図は本発明の
核磁気共鳴スペクトルを示す図表である。
Figure 1 is a chart showing the infrared absorption spectrum of the vinyl ester resin of Example 1 of the present invention, Figure 2 is a chart showing the GPC (ultrafiltration chromatograph) of the same resin, and Figure 3 is a chart showing the infrared absorption spectrum of the vinyl ester resin of Example 1 of the present invention. FIG. 4 is a chart showing the GPC of the vinyl ester resin of Example 2, and FIG. 4 is a chart showing the nuclear magnetic resonance spectrum of the present invention.
Claims (1)
の整数を示す。〕 で示される新規ビニルエステル樹脂。 2 一般式〔〕 〔式中Rはメチル基または水素原子、nは0〜15
の整数を示す。〕 で示されるジシクロペンタジエン変性エポキシ樹
脂にアクリル酸またはアクリル酸の反応性誘導体
を反応させるこを特徴とする下記一般式〔〕で
示される新規ビニルエステル樹脂の製造法。 〔式中Rはメチル基または水素原子、nは0〜15
の整数を示す。〕[Claims] 1. The following general formula [] [In the formula, R is a methyl group or a hydrogen atom, n is 0 to 15
indicates an integer. ] A new vinyl ester resin. 2 General formula [] [In the formula, R is a methyl group or a hydrogen atom, n is 0 to 15
indicates an integer. ] A method for producing a novel vinyl ester resin represented by the following general formula [ ], which comprises reacting a dicyclopentadiene-modified epoxy resin represented by the formula with acrylic acid or a reactive derivative of acrylic acid. [In the formula, R is a methyl group or a hydrogen atom, n is 0 to 15
indicates an integer. ]
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22916485A JPS6289719A (en) | 1985-10-15 | 1985-10-15 | Novel vinyl ester resin and production thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22916485A JPS6289719A (en) | 1985-10-15 | 1985-10-15 | Novel vinyl ester resin and production thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6289719A JPS6289719A (en) | 1987-04-24 |
JPS6320850B2 true JPS6320850B2 (en) | 1988-04-30 |
Family
ID=16887787
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22916485A Granted JPS6289719A (en) | 1985-10-15 | 1985-10-15 | Novel vinyl ester resin and production thereof |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6289719A (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0830028B2 (en) * | 1987-06-15 | 1996-03-27 | ダイキン工業株式会社 | Fluorine-containing alicyclic compound and method for producing the same |
JP4295196B2 (en) | 2004-11-09 | 2009-07-15 | 住友化学株式会社 | How to stop continuous polymerization |
WO2021230097A1 (en) * | 2020-05-12 | 2021-11-18 | 日鉄ケミカル&マテリアル株式会社 | Epoxy acrylate resin, alkali-soluble resin, resin composition including same, and cured product thereof |
CN115551915A (en) * | 2020-05-19 | 2022-12-30 | 日铁化学材料株式会社 | Polymerizable unsaturated group-containing alkali-soluble resin and method for producing same, and photosensitive resin composition and cured product thereof |
-
1985
- 1985-10-15 JP JP22916485A patent/JPS6289719A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6289719A (en) | 1987-04-24 |
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