JPS63208233A - Semiconductor device and its manufacture and taper carrier used for manufacture of the same - Google Patents

Abstract

PURPOSE:To effectively conduct the operation test under the thermal environment by supplying the power supply voltage to all of a plurality of semiconductor pellet having the wirings for aging mounted on a tape carrier. CONSTITUTION:The main power supply wiring 10 electrically connected under the condition of branching the power supply lead in unit of each tape carrier 8 and the main ground lead electrically connected under the condition of branching the grounding lead are continuously formed in the major axis direction of a tape carrier 8 and the tape carrier 8 prepared forms the leads phi1, phi2 for control signal which is conductive in the major axis direction of tape carrier 8 through the wiring for aging of semiconductor pellet 2 tor simultaneous connection of multiple points. The power source voltage can be applied to all of a plurality of semiconductor pellets 2 by mounting them having the wirings for aging to the tape carrier 8 and thereby the control signals may be supplied. Thereby, operation tests of semiconductor pellets can be done simultaneously.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor device, a method for manufacturing the same, and a tape carrier used in the method for manufacturing the semiconductor device. tape carrier (tap
There is an e-carrier system. In this semiconductor device, wireless bonding is performed using a tape carrier in which a plurality of leads (wiring patterns) in a predetermined shape are formed using copper foil or the like on a tape (film) made of an insulating material such as polyimide. It is manufactured by In other words, IC and LS are connected to one end of the above lead.
After the electrodes of the semiconductor pellet on which an integrated circuit such as I is formed are bonded by simultaneous multi-point bonding, in other words, by gigantic bonding, the other end of the lead is cut off, and the other end is bonded to a printed wiring board, etc. Semiconductor devices are manufactured by bonding to wiring electrodes of wiring boards and the like.

The tape carrier has an elongated shape in which a lead pattern corresponding to the external lead of one semiconductor pellet is formed on a tape made of an insulating material, and a plurality of tape carrier units are successively formed. Then, it is possible to wind up the tape carrier onto a reel and store it in a state in which semiconductor pellets are bonded to each tape carrier unit. Therefore, the tape carrier method is an extremely suitable technology for automating the manufacture of semiconductor devices, for example, so-called COB (chip on board) type semiconductor devices such as watches and calculators.

The tape carrier method is explained in "IC Mounting Technology" edited by Japan Microelectronics Association, published by Kogyo Kenkyukai Co., Ltd., January 14, 1980, page 107 et seq.

[Problem that the invention seeks to solve]

Nowadays, semiconductor devices are required to have even higher reliability, and in order to meet this demand, aging is carried out as one of the reliability tests.This aging involves heating the semiconductor device. The semiconductor device is placed in an electrical operating state K under a thermal environment of
This is a test under L, 7'e.

However, the tape carrier method has the problem that aging of semiconductor devices is difficult, especially for semiconductor devices that do not operate unless a power supply voltage is applied and a control signal is supplied during an electrical operation test. The inventors have found that this is particularly problematic.

The details of the above are as follows.

In a semiconductor device manufactured by the tape carrier method, the leads are made of copper foil with a thickness of about 35 μm and are soft and easily deformable. Therefore, it is difficult and not easy to handle the waste in each semiconductor device. This is because the semiconductor device manufactured using the tape carrier method is small, so it is extremely difficult to manually transport it or incorporate it into a tester during testing. However, as mentioned above, even during aging, it is extremely difficult to handle tape carrier-type semiconductor devices that are thin, have leads that are soft and easily deformed, and are small in size. Sara K,
Terminals for operation tests can be attached to such thin-film leads that are soft and easily deformable, and quantitative aging tests can be efficiently performed on each small-sized semiconductor device in an even and appropriate environment. It is practically impossible to do so.

Therefore, it has been difficult to accurately identify defective products or semiconductor devices with latent defects because it has been difficult to conduct sufficient operation tests under thermal environmental conditions. Ta.

SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor device that can be efficiently tested for operation under a thermal environment.

Another object of the present invention is to provide a semiconductor device that allows efficient quantitative testing.

Still another object of the present invention is to provide a high-reliability semiconductor device that has undergone proper testing and is of good quality.

Still another object of the present invention is to provide a method for manufacturing a semiconductor device that allows efficient quantitative testing.

Yet another object of the present invention is to provide a tape carrier that allows quantitative performance testing to be performed efficiently.

Still another object of the present invention is to provide a technique that enables aging of semiconductor pellets in a tape carrier type semiconductor device.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Means for solving problems]

A brief overview of typical inventions disclosed in this application is as follows.

In other words, the power supply leads for each tape carrier unit are branched and electrically connected together, and the ground leads for each tape carrier unit are electrically connected in a branched state. A control signal lead is formed that allows conduction in the longitudinal direction of the tape carrier through an aging tray of semiconductor pellets that is continuously formed in the axial direction and simultaneously bonded to the tape carrier at multiple points. By preparing semiconductor pellets and mounting the semiconductor pellets having the aging wiring on the tape carrier, it is possible to apply a power supply voltage and supply a control signal to all of the plurality of semiconductor pellets mounted. Operational testing of all multiple semiconductor pellets loaded on a length of tape carrier can be performed simultaneously.

[Effect]

According to the above-mentioned means, it is possible to perform aging, that is, reliability tests, on a large number of semiconductor devices in a thermal environment and in an operating state while attached to a tape carrier, and the mass production test effect is large. , reliability tests can be performed efficiently.

Therefore, a highly reliable semiconductor device can be provided.

〔Example〕

FIG. 1 is a perspective view of a semiconductor pellet mounted on a semiconductor device according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of the semiconductor pellet taken along the line ■-■, and FIG. FIG. 2 is a cross-sectional view showing a part of an example semiconductor device. Friend, FIG. 4 is a plan view showing a tape carrier applied to manufacturing the semiconductor device of this embodiment, and FIG. 5 is an explanatory view showing aging of the semiconductor pellet.

The semiconductor device of this embodiment is a so-called COB (chip on board) type semiconductor device. That is, a semiconductor pellet 2 is attached face-up to a wiring board 1 made of a printed circuit board, and an electrode pad 3 of the semiconductor pellet 2 and an electrode 1a of the wiring board 1 are connected to a lead 4 made of copper foil with a thickness of about 35 μm. electrically connected via. A polyimide film 5 is adhered to a portion of the lead 4.

As shown in FIG. 1, the semiconductor pellet 2 mounted on the semiconductor device by multi-point simultaneous bonding has electrode pads 3a formed along two sides of a plurality of opposing electrode pads 3. 3b and between 3c and 3d, that is, wirings 6a and 6.
b is formed. In this embodiment, the wirings 6a and 6b are
Used as aging wiring.

The relationship between the electrode pads 3c and 3d and the aging wiring 6b is shown in a cross-sectional view in FIG. The wirings 6a and 6b for processing are formed of aluminum (AA) or the like under the passivation layer in the same way as normal internal wiring, and the electrode pads 3 are formed in the holes 7a of the passivation layer.
It is formed protrudingly. This electrode pad 3 has a bump (
For example, chromium (Cr), copper (Cu),
Gold (Au) can be sequentially deposited to form a 93-layer structure. The structure of the wirings 6a and 6b can take various forms. When manufacturing the multilayer wiring of semiconductor pellets, the wirings 6a and 6b may be formed at the same time or may be formed in a process. When forming multilayer wiring at the same time, 2 layers, 3 layers
A multilayer internal wiring called a layer may be used to form the aging wiring. The material may be aluminum, a low-resistance sub-crystalline silicon layer, or a high melting point metal layer.

The semiconductor device of this example is manufactured using the tape carrier shown in FIG. This tape carrier 8
is a long polyimide film 5 in which a large number of tape carrier units 8a each having a predetermined lead pattern applied to one semiconductor pellet are successively formed in the right direction in the figure, and a wiring pattern is formed on it. There are nine things to form.

Further, on both sides of the tape carrier 8 in the minor axis direction, feed holes 9 are formed over the entire film 5 at a constant pitch.

Further, in the film 5Vc located outside the feed hole 9, a power main wiring 10 is formed in the upper part of the drawing, and a ground main wiring 11 is formed continuously in a straight line in the longitudinal direction of the film 5Vc in the lower part of the drawing.

The tape carrier unit 8a has a semiconductor pellet mounting part 12 in the center thereof, and a plurality of leads 4 having inner ends are arranged in a predetermined shape around the inner periphery of the mounting part 12. Also, there are four through holes 1 around the outside of the mounting part 12.
3 is formed to surround the mounting portion, and each lead 4 is passed through the hole 13Kai.

The 7'j IJ-do 4 is arranged so as to extend to the mounting section 12.
Among them, the power supply lead 4a is branched from the power supply trunk 11i10, and they are integrated as an electrical wiring.

Also, the 9 IJ-do 4 is arranged to extend into the mounting section 12.
Among them, the ground lead 4b is connected to the ground main line 11.
It has a branched T-shape, and the electrical wiring is integrated. Chip carrier 8
When the semiconductor pellet 2 is fixed by gigantic bonding, the power supply lead 4 is attached to the power supply electrode pad 3e and the grounding electrode pad 3f of the semiconductor pellet 2, respectively.
The inner ends of the ground lead 4b and the ground lead 4b can be joined. As a result, by setting the power supply E between the power supply main line 10 and the ground main line 11 and applying a predetermined test voltage, all the semiconductor pellets 2 mounted on the tape carrier 8Vc were It is capable of applying a power supply voltage.

Further, each tape carrier unit 8aK is connected to the mounting section 12.
Leads 4 are also arranged on the left and right sides of the control signal, and two of them, one located at the top and the other at the bottom, are control signal leads 4c and 4d. The other leads 4 are electrically isolated between adjacent tape carrier units, but the control signal leads 4c and 4
d, adjacent tape carrier units are electrically connected by connection wiring 15.

By bonding and fixing the semiconductor pellet 2 to the tape carrier 8, that is, by simultaneously bonding the tape carrier glue 4 and the pad electrode 3 of the semiconductor pellet at multiple points, in each tape carrier unit 8a, Connect the inner end of the control signal lead 4c to the electrode pad 3.
It is possible to connect the inner end of the lead 4d to 3a or 3d. therefore,
The ratio control signal leads 4c and 4d formed on each tape carrier unit 8a are passed through the aging wiring 6a and 6b formed on the semiconductor pellet 2, respectively.[Each tape carrier unit is electrically connected] become. As a result, by using the semiconductor pellet of the present invention for control signal leads, the tape carrier 8
Electrical continuity is achieved throughout.

Therefore, by applying a control signal φ to the control signal lead 4c and a control signal φ to the control signal lead 4d, a control signal is simultaneously applied to a large number of semiconductor pellets mounted on the entire tape carrier 8. Operation tests can be performed with the voltage applied.

Note that the aging wiring lines 6a and 6b can be subjected to a cutting line treatment if necessary.

As described above, by mounting the semiconductor pellets 2 on the tape carrier 8, the power supply voltage E is applied to all of the semiconductor pellets 2 on the entire tape carrier 8, and the control signal φ1. φ! It is possible to supply electricity and perform energization tests in nine states. Therefore, as shown in FIG. 5, the above-mentioned energization test is carried out using a large number of semiconductor pellets rather than placing a plurality of tape carriers 8 in a compact state into a thermal constant temperature bath at the same time. )K, simultaneous aging can be performed.

The semiconductor device of this example is manufactured as follows.

First, thermal diffusion, oxide film formation, CVD film formation, etc. are performed on a silicon wafer in a wafer state to form a semiconductor integrated circuit 2a, and a multilayer wiring layer 2b including wiring for aging is formed.
form. Next, a probe inspection is performed in the wafer state to perform a test to determine the quality of the aging wiring. Next, the semiconductor pellets 2 are simultaneously bonded at multiple points and the above-mentioned aging is performed on the tape carrier 8. After that, a probe test is performed on each tape carrier unit 8a to select only non-defective products. For each tape carrier 8a on which the good semiconductor pellets are mounted, the leads 4 formed on the film shown in FIG. It is possible to obtain a good product in which the pellet 2 and the lead 4 joined to the pellet 2 are integrated. Thereafter, the tips of the leads 4, which have been separated and bonded to the nine semiconductor pellets (2Vc), are bonded to the electrodes 1a of the wiring board 1, thereby completing the process.

The semiconductor device of this embodiment manufactured in this manner is defect-free and extremely reliable because it is equipped with the semiconductor pellet 2 that has been sufficiently aged as described above.

If the tape carrier 8 is used, the control signal leads 4c and 4d of adjacent tape carrier units can be cut at their connecting portions 15 while the semiconductor pellets are being aged, or immediately after aging. It is possible to perform a probe test on the semiconductor pellets 2 of each tape carrier unit 8a.

Therefore, potential defects that would be overlooked because they would recover if left unattended after aging can be effectively detected because probe inspection can be performed immediately after aging.

9. The aging method involves cutting out a part of the tape carrier, dividing it into parts, mounting it on a separate part, and electrically connecting the power supply, ground, control signals, etc. to the semiconductor pellets (2) each time. is possible. The tape carrier 8 shown in this embodiment does not have the above-mentioned troubles.

Since all the semiconductor pellets on the entire tape carrier 8 can be aged at the same time, aging can be carried out for a longer time and quantitatively in the same working time than in the above-mentioned partial case. Therefore, the reliability of the semiconductor device can be greatly improved.

As explained above, according to the novel technology disclosed in this application, the following effects can be obtained.

(1) A power main line electrically connected by branching the power supply leads of each tape carrier unit and a ground main line branching the ground leads of each tape carrier and electrically connected in a T-shape, respectively, in the longitudinal direction. A tape carrier is prepared in which a control signal lead is formed continuously on the semiconductor pellet and is capable of conduction in the longitudinal direction 1 through the aging wiring of the semiconductor pellet to be mounted, and the core tape carrier has the aging wiring. By loading semiconductor pellets,
By applying power and supplying control signals to all the semiconductor pellets mounted on a large number of semiconductor pellets, it is possible to simultaneously test the operation (continuity) of all the semiconductor pellets mounted on a tape carrier of any length. can be done.

(2) By performing the above operation (continuity) test by heating to a predetermined temperature, it is possible to simultaneously age all of a large number of semiconductor pellets mounted on a tape carrier of arbitrary length.

(3) According to (2) above, it is possible to simultaneously age a large number of semiconductor pellets, so quantitative testing can be performed efficiently within a predetermined time, and cost reduction of tape carrier type semiconductor devices can be achieved.

(4) For the same reasons as in (3) above, quantitative tests can be carried out efficiently, and aging can be carried out over a long period of time as a result of aging a large number of semiconductor pellets in a compact state. , the reliability of the semiconductor device can be improved.

(5) According to (2) K above, when aging semiconductor pellets, during or immediately after aging, semiconductor pellets in tape gear units are aged by cutting control signal leads between adjacent tape carrier units. Immediate probe inspection is possible. Therefore,
Since defects that recover over time can be discovered through glove inspection, highly reliable semiconductor devices can be provided to customers.

(6) From (1) to (5) K above, highly reliable tape carrier type semiconductor devices can be provided to customers at low cost.

Although the invention made by the present inventor has been specifically explained based on examples, it is understood that the present invention is not limited to the above-mentioned examples, and can be modified in various ways without departing from the gist of the invention. Needless to say.

The test wiring #Lf, which is formed in a separate process at the same time as the multilayer wiring layer 2b of the semiconductor pellet 2, is an electrical short-circuit wiring structure between the control signal pad electrodes 3a and 3b or between 3C and 3d. That's fine. Therefore, a jumper wire separate from the wiring layer in the multilayer wiring layer may be used as the short-circuit wiring between the pads. This jumper wire has the advantage that it can be easily cut and separated if necessary.

Although the power supply main line and the ground main line are formed in the blank film area outside the perforation hole of the tape carrier, the present invention is not limited to this, and it is also possible to use other blank film areas. good.

However, in the tape carrier, the control signal leads are shown as two leads located at the top and bottom ends in the figure, but the number of control signal leads, their formation positions, and shape patterns also vary. It is not limited to the examples. Therefore, the wiring for aging of the semiconductor pellet to which the control signal lead is connected is also shown in the embodiment and is not limited to what is shown in the embodiment.

Furthermore, it goes without saying that the shape of the film of each tape carrier, the lead pattern formed thereon, etc. are not limited to those shown in the examples.

In the above explanation, the nine inventions made by the present inventor are mainly applied to a so-called COB type semiconductor device, which is the field of application as a background, and the invention is not limited thereto. This is an effective technique that can be applied to all semiconductor devices that adopt the tape carrier method, regardless of the external shape of the package or the like.

The present invention allows a large number of semiconductor pellets to be subjected to aging, thermal environment operation tests, and various tests without having to manually handle each semiconductor pellet while in the tape carrier state. Therefore, T A B (T
The semiconductor device of the present invention, which is a product of Ape Automated Bonding, can perform quantitative testing automatically without human intervention, which has been extremely difficult in the past, and the testing process can be performed extremely efficiently.

The semiconductor device of the present invention can efficiently perform an operation test in a thermal environment.

The semiconductor device of the present invention enables efficient quantitative testing.

An object of the present invention is to provide a non-defective and highly reliable semiconductor device after completing appropriate tests.

The present invention can provide a method for manufacturing a semiconductor device in which quantitative testing can be performed efficiently.

INDUSTRIAL APPLICATION This invention can provide the tape carrier which can perform a quantitative operation test efficiently.

〔Effect of the invention〕

A brief explanation of the effects obtained by typical inventions disclosed in this application is as follows.

In the present invention, nine power supply main lines are electrically connected with the power leads of each tape carrier unit being branched, and nine power supply main lines are electrically connected with the ground leads of each tape carrier unit being branched. A control signal lead is formed that is continuous in the longitudinal direction of the tape carrier and can conduct electricity in the longitudinal direction of the tape carrier through the aging wiring of the semiconductor pellet which is simultaneously bonded to the tape carrier at multiple points. By preparing a semiconductor pellet and mounting a semiconductor pellet having the above-mentioned aging wiring on the tape carrier, a power supply voltage can be applied to all the mounted semiconductor pellets, and a control signal can be supplied. The operation of all the multiple semiconductor pellets mounted on a length of tape carrier can be tested simultaneously. From this, it is possible to perform aging, that is, reliability testing, on a large number of semiconductor devices in a thermal environment and in an operating state by attaching them to a tape carrier, which has a great testing effect and is efficient. Reliability tests can be performed. Therefore, a highly reliable semiconductor device can be provided.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a semiconductor pellet mounted on a semiconductor device according to an embodiment of the present invention, FIG. 2 is an enlarged cross-sectional view of the semiconductor pellet as viewed from the line ■-■, and FIG. 3 is an embodiment of the present invention. 4 is a schematic cross-sectional view showing a part of the semiconductor device of this embodiment, FIG. 4 is a plan view showing an outline of a tape carrier applied to manufacturing the semiconductor device of this example, and FIG. 5 is a schematic explanation showing aging of the semiconductor pellet described above. It is a diagram. 1... Wiring board, 2... Semiconductor pellet, 3, 3a
. 3b, 3c, 3d...electrode pad, 3e...electrode pad for power supply, 3f...electrode pad for ground, 4
...Lead, 4a...Power supply lead, 4b...Ground lead, 5...Polyimide film, 6,6
a... Wiring for aging, 7... Pudge vane 1st layer, 7a... Perforation part, 8... Tape carrier, 8a
...Unit carrier, 9...Spring hole, 10...Power main line, 11...Ground main line, 12...Mounting section, 1
3... Hole, 14... Constant temperature chamber, 15... Connection part, φ
1. φ: Control signal lead, E: Power supply. Figure l Figure 2 Figure 3 Figure 4

Claims (1)

[Claims] 1. In a semiconductor device in which a pad electrode of a semiconductor pellet is fixed to a plurality of tape carrier type leads formed on an insulating tape by wireless bonding, one side of a rectangular semiconductor pellet is At least one pad electrode for control signal input formed nearby and at least one pad electrode formed near the side opposite to the side are electrically connected by a conductor. semiconductor device. 2. A tape carrier unit in which a wiring pattern having multiple leads is formed on a long insulating tape,
A plurality of tape carriers are formed at regular intervals, and the control signal input leads of adjacent tape carrier units are short-circuited by conductive leads, and at least 1
A tape carrier is prepared in which more than one trunk lead is provided extending over almost the entire length of the tape, and leads branched from the trunk lead are short-circuited to the corresponding lead of each tape carrier unit. at least one pad electrode for control signal input formed near one side of the rectangular semiconductor pellet; and at least one pad electrode formed near the side opposite to said side. a step of preparing a semiconductor pellet electrically connected by a conductor; a step of simultaneously bonding a plurality of pad electrodes of the semiconductor pellet to a plurality of leads of the tape carrier at multiple points by wireless bonding; A method for manufacturing a semiconductor device, comprising at least the step of applying a control signal to a control signal input lead of a carrier and testing the operation of a semiconductor pellet while applying a power supply voltage to a main lead. 3. A tape carrier unit in which a wiring pattern having multiple leads is formed on a long insulating tape,
In tape carriers formed in large numbers at regular intervals, the control signal input leads of adjacent tape carrier units are short-circuited by conductive leads, and at least in the longitudinal direction of the tape. 1
The tape is characterized in that at least one main lead is provided extending over almost the entire length of the tape, and the leads branched from the main lead are short-circuited to the corresponding lead of each tape carrier unit. tape carrier.