JPS6320710A - Production of thin film magnetic head - Google Patents
Production of thin film magnetic headInfo
- Publication number
- JPS6320710A JPS6320710A JP16410786A JP16410786A JPS6320710A JP S6320710 A JPS6320710 A JP S6320710A JP 16410786 A JP16410786 A JP 16410786A JP 16410786 A JP16410786 A JP 16410786A JP S6320710 A JPS6320710 A JP S6320710A
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- layer
- magnetic
- film coil
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010409 thin film Substances 0.000 title claims abstract description 60
- 230000005291 magnetic effect Effects 0.000 title claims abstract description 57
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 230000035699 permeability Effects 0.000 claims abstract description 17
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 16
- 239000004020 conductor Substances 0.000 claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 13
- 230000005294 ferromagnetic effect Effects 0.000 claims abstract description 7
- 238000005530 etching Methods 0.000 abstract description 12
- 230000006866 deterioration Effects 0.000 abstract description 5
- 239000000463 material Substances 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 13
- 238000003801 milling Methods 0.000 description 6
- 238000010884 ion-beam technique Methods 0.000 description 5
- 239000011810 insulating material Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3109—Details
- G11B5/313—Disposition of layers
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3109—Details
- G11B5/313—Disposition of layers
- G11B5/3133—Disposition of layers including layers not usually being a part of the electromagnetic transducer structure and providing additional features, e.g. for improving heat radiation, reduction of power dissipation, adaptations for measurement or indication of gap depth or other properties of the structure
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Magnetic Heads (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明ｆ″ｉ磁気記録再生装置（使用する薄膜磁気ヘッ
ドの製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for manufacturing a thin film magnetic head used in an f''i magnetic recording/reproducing apparatus.
従来の技術
薄膜磁気ヘッドの重要な製造プロセスとしての磁性層の
形成がある。薄膜磁気ヘッド（以下ヘッドとする）の書
き込み効率を高めるためには、上記磁性層の透磁率を向
上させなければならず、それには磁性層表面を平坦に形
成する必要がある。BACKGROUND OF THE INVENTION An important manufacturing process for thin film magnetic heads is the formation of a magnetic layer. In order to increase the writing efficiency of a thin film magnetic head (hereinafter referred to as a head), it is necessary to improve the magnetic permeability of the magnetic layer, and to do so, the surface of the magnetic layer must be formed flat.
第２図に従来のヘッドにおける磁性層の製造プロセスを
示す。第２図において、ｉｆｉ高透磁率強磁性体基板、
２ｆ”ｉ絶縁層、３は薄膜コイル、４は薄膜コイル絶縁
層、５ｆ′ｉ薄膜コイル絶縁層を平坦化するためのフォ
トレジスト、６ｆｉ磁気回路を構成する磁性層である。FIG. 2 shows a manufacturing process for a magnetic layer in a conventional head. In FIG. 2, ifi high permeability ferromagnetic substrate,
2f''i insulating layer, 3 a thin film coil, 4 a thin film coil insulating layer, 5f'i a photoresist for planarizing the thin film coil insulating layer, and 6fi a magnetic layer constituting a magnetic circuit.
この構成で以下に第２図におけるａ −ｆの順序でヘッ
ドにおける磁性層の製造プロセスについて述ヘル。With this configuration, the manufacturing process of the magnetic layer in the head will be described below in the order of a to f in FIG.
第２図ａＵ、高透磁率強磁性体基板１上にコイルとの絶
縁層２を形成した工程を示す。第２図すに示す工程てお
いては、絶縁層２上に薄膜コイル導体３をイオンミリ゛
ング等で微細エッチフグ加工を行いバターニングをする
。この時、微細エツチング加工精度等により薄膜コイル
導体間の導通防止のため導膜コイル導体間は１０μｍ以
上の距離が必要である。第２図Ｃは薄膜コイル３に薄膜
コイル絶縁層４を形成した工程を示す。第２図ｄはは絶
縁層４の段差を縮少せしめるためｆこフォトレジスト５
をスピンコードで形成、コイル絶縁層４を必要な厚さに
までイオンビームエツチングを行う工程を示している。FIG. 2 aU shows the process of forming an insulating layer 2 with a coil on a high magnetic permeability ferromagnetic substrate 1. In the step shown in FIG. 2, the thin film coil conductor 3 is patterned on the insulating layer 2 by finely etching it by ion milling or the like. At this time, a distance of 10 μm or more is required between the conductive film coil conductors in order to prevent electrical conduction between the thin film coil conductors due to the precision of fine etching and the like. FIG. 2C shows the process of forming the thin film coil insulating layer 4 on the thin film coil 3. In FIG.
The coil insulating layer 4 is formed using a spin cord and ion beam etched to the required thickness.
更に不必要な絶、線層２を微細エツチング加工した工程
を第２図ｅに示す。そして、第２図ｆは上記薄膜コイル
絶縁層４の上ｌこ磁性層すを形成した工程を示している
。FIG. 2e shows a step in which the unnecessary cut-off line layer 2 is finely etched. FIG. 2f shows the step of forming a magnetic layer on the thin film coil insulating layer 4.
発明が解決しようとする問題点
しかしながら、上記のようなヘッドの製造方１去では、
薄膜コイル導体間が空いているため、第２図ｄにおける
フォトレジスト５における上部のくぼみがそのま１イオ
ンピームエ、チング後において、薄膜コイル絶縁層４の
上部ンこ残る。従って、その上に形成される磁性層６の
表面にくぼみができ、透磁率の劣化を招くという問題点
がある。Problems to be Solved by the Invention However, in the method of manufacturing the head as described above,
Since there is a gap between the thin film coil conductors, the upper depression of the photoresist 5 in FIG. 2d remains as it is after one ion beam etching. Therefore, there is a problem in that depressions are formed on the surface of the magnetic layer 6 formed thereon, leading to deterioration of magnetic permeability.
本発明は上記問題点に鑑み、磁性層の表面のくぼみを解
消し磁性層の透磁率を向上させる薄膜磁気ヘッドの製造
方法を提供するものである。In view of the above-mentioned problems, the present invention provides a method for manufacturing a thin-film magnetic head that eliminates the depressions on the surface of the magnetic layer and improves the magnetic permeability of the magnetic layer.
問題点を解決するための手段
この目的を達成するために本発明の薄膜磁気ヘッドの製
造方法は、ρ線層上・に薄１摸コイルを形成した後、薄
膜コイル導体間の凹部に位置するように、９りえばＳ
＋ ０２等の絶縁材料から成る凸形状パターンを形成す
るとともに、薄膜コイル及び凸状パターン上にフォトレ
ジスト層を介して磁性層を形成する構成となっている。Means for Solving the Problems To achieve this object, the method for manufacturing a thin film magnetic head of the present invention includes forming a thin film coil on the ρ line layer, and then positioning the thin film coil in the recess between the conductors. Like, 9 years old
A convex pattern made of an insulating material such as +02 is formed, and a magnetic layer is formed on the thin film coil and the convex pattern via a photoresist layer.
作 用
この構成により、薄膜コイル絶縁層の上面は従来のもの
に比べてくぼみが小さくなり、その上にｆｌＪｔはスピ
ンコードしたフォトレジストを形成する状態では、表面
にくぼみは殆んど生じない。Effect: With this configuration, the upper surface of the thin film coil insulating layer has a smaller depression than the conventional one, and when the flJt spin-coded photoresist is formed thereon, almost no depression occurs on the surface.
従って、イオンビームエツチングを行い、所定形状に加
工した後の薄膜コイル絶縁層上にくぼみは見られず、そ
の上に形成される磁性層もまた、その表面が平坦化し透
磁率の劣化を防ぎ、書き込み効率の向上が実現できる。Therefore, no depressions are observed on the thin film coil insulating layer after it has been processed into a predetermined shape by ion beam etching, and the surface of the magnetic layer formed thereon is also flattened to prevent deterioration of magnetic permeability. It is possible to improve write efficiency.
実施例
以下、本発明の一実施例について図面を参照しながら説
明を行う。第１図は本発明の一実施例の薄膜磁気ヘッド
における磁性層の形成プロセスの断面図を示すものであ
る。EXAMPLE Hereinafter, an example of the present invention will be described with reference to the drawings. FIG. 1 shows a cross-sectional view of a process for forming a magnetic layer in a thin-film magnetic head according to an embodiment of the present invention.
第１図において、１は高透磁率強磁性体基板、２はＳｉ
Ｏ２等の絶縁層、３はＡ、！、Ａｕ等の薄膜コイル、４
は３１０２等の薄膜コイル絶縁層、５け薄膜コイル絶縁
層上面を平坦にするために用いるネガ型の７オトレジス
ト、６は磁性層で、以上は従来の構成と同じものである
。了）ま薄膜コイル導体間凹部略平坦化させるために配
された３ １０２等の絶縁材料からなる凸形状パターン
である。In FIG. 1, 1 is a high permeability ferromagnetic substrate, 2 is a Si
Insulating layer such as O2, 3 is A,! , thin film coil such as Au, 4
Reference numeral 3102 indicates a thin film coil insulating layer, negative type 7 photoresist is used to flatten the upper surface of the 5 thin film coil insulating layer, and 6 indicates a magnetic layer, which is the same as the conventional structure. This is a convex pattern made of an insulating material such as 3102, which is arranged to substantially flatten the concave portion between the thin film coil conductors.
以上のような構成の薄膜磁気ヘッドについて、第１図を
参照しながら、・頂に説明を行う。The thin film magnetic head having the above structure will be explained below with reference to FIG.
第１図ａでは高透磁率強磁性体基板１上に絶縁層２を形
成している。第１図すでは絶縁層２上にＡ２を形成し、
微細エツチング加工により薄膜コイル３を形成し、その
後、薄膜コイル形成と同様に微細エツチング加ニレζよ
り、凸形状パターンを形成する。この時、凸形状パター
ンと薄膜コイル導体との距離は各々２〜３７ｚｍに縮小
されている。In FIG. 1a, an insulating layer 2 is formed on a high magnetic permeability ferromagnetic substrate 1. In FIG. In FIG. 1, A2 is formed on the insulating layer 2,
A thin film coil 3 is formed by fine etching, and then a convex pattern is formed by fine etching ζ in the same manner as in the formation of the thin film coil. At this time, the distance between the convex pattern and the thin film coil conductor is reduced to 2 to 37 zm, respectively.
次に薄膜コイル３及び凸形状パターンγ上に、磁性層６
にχＪする絶縁として薄膜コイル絶縁層４を形成する。Next, a magnetic layer 6 is placed on the thin film coil 3 and the convex pattern γ.
A thin film coil insulating layer 4 is formed as an insulator with χJ.
この状態を第１図Ｃに示す。薄膜コイル導体間に凸形状
パターンが設けられたため、薄膜コイル絶縁層４上部に
おける溝も小さくなる。This state is shown in FIG. 1C. Since the convex pattern is provided between the thin film coil conductors, the groove in the upper part of the thin film coil insulating layer 4 also becomes smaller.
第１図ｄＫ薄膜コイル絶縁層４上にフォトレジスト５を
スピンコードで形成した状態を示す。この状態における
フォトレジスト６の上面は、薄膜コイル絶縁層４の上面
における溝が充分に小さくなっているため、ｔの厚み、
硬化温度、スピンコード条件を最適化することによって
平坦化することは可能である。ここで、第１図ｄにおけ
る形状のものにエツチングを行なうと、第１図ｅに示す
形状のものが得られる。尚、エツチングはイオンビーム
ミリング装置を用いた。第１１２１ｄにおけるフォトレ
スト６の上面形状をそのま１．推持し所定形状に仕上げ
るには、フォトレジスト５とコイル絶縁層４のエツチン
グレートが等速である条件、すなわちビームの試料角度
等の諸条件を設定しなければならない。FIG. 1 shows a state in which a photoresist 5 is formed on a dK thin film coil insulating layer 4 using a spin code. In this state, the upper surface of the photoresist 6 has a thickness of t, since the groove on the upper surface of the thin-film coil insulating layer 4 is sufficiently small.
It is possible to achieve flattening by optimizing the curing temperature and spin code conditions. If etching is performed on the shape shown in FIG. 1d, the shape shown in FIG. 1e will be obtained. Note that an ion beam milling device was used for etching. The upper surface shape of the photorest 6 in No. 1121d is the same as 1. In order to hold and finish into a predetermined shape, conditions must be set such that the etching rates of the photoresist 5 and the coil insulating layer 4 are constant, that is, conditions such as the sample angle of the beam.
第３図にミ＋）ングレート特性を示す。この場合、試料
角度が７５度において、Ｓ ｚ ０２ とネガ型レジス
トのミリングレートが等速となる。そこで、この条件で
第１図ｅにおける形状までミリングを行う。フォトレジ
スト５は全てミリングで、剥離されるため新たに剥離す
る必要はない。第１図ｅにおいて、薄膜コイル絶縁層４
の上面は平坦化されている。この薄膜コイル絶縁層４上
に磁性層６を形成すると第１図ｆに示すように１その上
面が平坦となっている磁性層６を持つ薄膜磁気ヘッドが
製造される。従って、透磁率の劣化もなく記録再生の磁
束が容易に流れ、書き込み効率の向上が実現できる。Figure 3 shows the mining rate characteristics. In this case, when the sample angle is 75 degrees, the milling rate of S z 02 and the negative resist are constant. Therefore, under these conditions, milling is carried out to the shape shown in FIG. 1e. Since all of the photoresist 5 is removed by milling, there is no need to remove it again. In FIG. 1e, the thin film coil insulating layer 4
The top surface of is flattened. When a magnetic layer 6 is formed on this thin film coil insulating layer 4, a thin film magnetic head having the magnetic layer 6 whose upper surface is flat as shown in FIG. 1F is manufactured. Therefore, the magnetic flux for recording and reproduction flows easily without deterioration of magnetic permeability, and it is possible to improve the writing efficiency.
尚、本実施例では、単体の高透磁率基板を用いているが
、基板として非磁性基板上に高透磁率材料薄膜を形成し
たものを用いても良い。更に、エツチング過程において
、イオンビームミリング装置を用いたが、他にドライエ
ツチング、プラズマエツチングを用いた場合も、絶縁薄
膜とフォトレジストのエツチング速度が等速度となるよ
うな条件下で平坦化加工を行ってもよい。In this embodiment, a single high magnetic permeability substrate is used, but a substrate having a high magnetic permeability material thin film formed on a nonmagnetic substrate may also be used. Furthermore, in the etching process, an ion beam milling device was used, but even when dry etching or plasma etching was used, the planarization process was performed under conditions where the etching speed of the insulating thin film and the photoresist were the same. You may go.
発明の効果
以上のように本発明の薄膜磁気ヘッドの製造方法は、薄
膜コイル導体間凹部に位置するようＫ、例えば、３１０
２等の絶縁材からなる凸形状ノζターンを形成し、薄膜
コイル導体間知形成される凹部距離を縮小することによ
り、基板上を略平坦化することができる。このこと罠よ
り、薄膜コイル上部に形成さバる薄膜コイル絶縁層の上
部表面の溝を小さくすることができ、フォトレジストを
用いて最終的に平坦化を行った場合、上部表面が平坦な
磁性層を得、透磁率の劣化がなく、書き込み効率を飛躍
的に向上した薄膜磁気ヘッドを実現できる。Effects of the Invention As described above, the method for manufacturing a thin film magnetic head of the present invention provides a method for manufacturing a thin film magnetic head with K, for example, 310, so as to be located in the recess between the thin film coil conductors.
By forming convex ζ turns made of an insulating material such as No. 2, and reducing the distance between the recesses formed between the thin film coil conductors, it is possible to make the substrate surface substantially flat. This means that the grooves on the top surface of the thin-film coil insulating layer formed on top of the thin-film coil can be made smaller, and when final planarization is performed using photoresist, the top surface becomes flat and magnetic. It is possible to realize a thin-film magnetic head that dramatically improves writing efficiency without deterioration of magnetic permeability.
第１図は本発明の一実施例における薄膜磁気ヘッドの製
造方法の磁性層形成プロセスを示す薄膜磁気ヘッドの断
面図、第２図は従来の磁性層形成プロセスを示す薄膜磁
気ヘッドの断面図、第３図はミリングレート特性図であ
る。
１・・・・・・高透磁率強磁性体基板、２・・・・・−
絶縁層、３・・・・・・薄膜コイル、４・・・・・・薄
膜コイル絶縁層、６・・・・・・フォトレジスト、６・
・・・・・磁性層、７・・・・・・凸形状パターン。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名第３
図
仄！′Ｉ−汚濁 Ｑ（窪）FIG. 1 is a cross-sectional view of a thin-film magnetic head showing a magnetic layer forming process in a method for manufacturing a thin-film magnetic head according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view of a thin-film magnetic head showing a conventional magnetic layer forming process. FIG. 3 is a milling rate characteristic diagram. 1...High permeability ferromagnetic substrate, 2...-
Insulating layer, 3... Thin film coil, 4... Thin film coil insulating layer, 6... Photoresist, 6.
. . . Magnetic layer, 7 . . . Convex pattern. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 3
Illustration! 'I - Pollution Q (depression)
Claims (1)
上に導電体で薄膜コイルを形成し、前記薄膜コイルの導
電体によって形成された導電体間の凹部に位置する如く
、前記導電体間に上記薄膜コイルとは電気的に絶縁され
た凸状パターンを形成するとともに、前記薄膜コイル及
び前記凸状パターン上にフォトレジスト層を介して磁性
層を形成することを特徴とする薄膜磁気ヘッドの製造方
法。An insulating layer is formed on a high magnetic permeability ferromagnetic substrate, a thin film coil is formed of a conductor on the insulating layer, and the thin film coil is located in a recess between the conductors formed by the conductor. A thin film characterized in that a convex pattern electrically insulated from the thin film coil is formed between the conductors, and a magnetic layer is formed on the thin film coil and the convex pattern via a photoresist layer. A method of manufacturing a magnetic head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16410786A JPS6320710A (en) | 1986-07-11 | 1986-07-11 | Production of thin film magnetic head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16410786A JPS6320710A (en) | 1986-07-11 | 1986-07-11 | Production of thin film magnetic head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6320710A true JPS6320710A (en) | 1988-01-28 |
Family
ID=15786890
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16410786A Pending JPS6320710A (en) | 1986-07-11 | 1986-07-11 | Production of thin film magnetic head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6320710A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10369137B2 (en) | 2008-07-08 | 2019-08-06 | Incyte Corporation | 1,2,5-Oxadiazoles as inhibitors of indoleamine 2,3-dioxygenase |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5611613A (en) * | 1979-07-04 | 1981-02-05 | Matsushita Electric Ind Co Ltd | Thin film magnetic head |
| JPS5974608A (en) * | 1982-10-21 | 1984-04-27 | Hitachi Ltd | Formation of wiring structure |
-
1986
- 1986-07-11 JP JP16410786A patent/JPS6320710A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5611613A (en) * | 1979-07-04 | 1981-02-05 | Matsushita Electric Ind Co Ltd | Thin film magnetic head |
| JPS5974608A (en) * | 1982-10-21 | 1984-04-27 | Hitachi Ltd | Formation of wiring structure |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10369137B2 (en) | 2008-07-08 | 2019-08-06 | Incyte Corporation | 1,2,5-Oxadiazoles as inhibitors of indoleamine 2,3-dioxygenase |
| US10653677B2 (en) | 2008-07-08 | 2020-05-19 | Incyte Holdings Corporation | 1,2,5-oxadiazoles as inhibitors of indoleamine 2,3-dioxygenase |
| US11207302B2 (en) | 2008-07-08 | 2021-12-28 | Incyte Corporation | 1,2,5-oxadiazoles as inhibitors of indoleamine 2,3-dioxygenase |
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