JPS6320473U - - Google Patents
Info
- Publication number
- JPS6320473U JPS6320473U JP11400886U JP11400886U JPS6320473U JP S6320473 U JPS6320473 U JP S6320473U JP 11400886 U JP11400886 U JP 11400886U JP 11400886 U JP11400886 U JP 11400886U JP S6320473 U JPS6320473 U JP S6320473U
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- predetermined
- printed wiring
- protective film
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 12
- 230000001681 protective effect Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図はこの考案の一実施例による印刷配線板
の平面図、第２図及び第３図はそれぞれ従来のも
のを示す平面図である。図において、１は基板、
２は第１の導体、３は第２の導体、４は保護膜、
５は第３の導体である。なお、各図中同一符号は
同一又は相当部分を示す。
FIG. 1 is a plan view of a printed wiring board according to an embodiment of this invention, and FIGS. 2 and 3 are plan views of conventional printed wiring boards. In the figure, 1 is a substrate,
2 is a first conductor, 3 is a second conductor, 4 is a protective film,
5 is the third conductor. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
れる複数個の第１の導体と所定の上記第１の導体
間を接続した第２の導体とを配置し、上記第１の
導体の外周を所定の距離残して上記基板と上記第
２の導体との上に高分子部材からなる保護膜を設
けたものにおいて、上記基板と上記保護膜との間
に上記第１の導体が上記第２の導体と接続された
方向と異なる方向に上記第１の導体と接続された
第３の導体を埋設したことを特徴とする印刷配線
板。 A plurality of first conductors connected to electrical components and a second conductor connecting a predetermined first conductor are disposed on at least one surface of the board, and the outer periphery of the first conductor is arranged in a predetermined manner. A protective film made of a polymeric material is provided on the substrate and the second conductor with a distance of A printed wiring board characterized in that a third conductor connected to the first conductor is buried in a direction different from the direction in which the third conductor is connected to the first conductor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11400886U JPS6320473U (en) | 1986-07-23 | 1986-07-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11400886U JPS6320473U (en) | 1986-07-23 | 1986-07-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6320473U true JPS6320473U (en) | 1988-02-10 |
Family
ID=30996344
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11400886U Pending JPS6320473U (en) | 1986-07-23 | 1986-07-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6320473U (en) |
-
1986
- 1986-07-23 JP JP11400886U patent/JPS6320473U/ja active Pending
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