JPS6320362A - Vibration-proof composite material - Google Patents

Abstract

PURPOSE:To provide a vibration-proof composite material which has a high logarithmic decrement, excellent vibration-proofness and high Younger's modulus, by integrally mixing a thermosetting resin material with a reactive liquid rubber and a piezoelectric material powder. CONSTITUTION:100pts.wt. thermosetting resin material (A) (e.g., an epoxy resin) is mixed with 50-150pts.wt. reactive liquid rubber (B) (e.g., liquid styrene/ butadiene rubber) and 100-4,000pts.wt. piezoelectric material powder (C) (e.g., polyvinylidene fluoride). The mixture is integrally molded to obtain the desired vibration-proof composite material. When external vibrational energy is applied to this material, the vibrational energy is absorbed by the piezoelectric material powder to convert it into electrical charge. Vibration is absorbed by synergism of the vibration-damping effect between the resin material and the reactive liquid rubber and a frictional effect by these material and the piezoelectric material powder and a high logarithmic decrement can be obtd.

Description

[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to a vibration isolating composite used to eliminate minute unnecessary vibrations in the semiconductor manufacturing industry, etc. (Background of the Invention) In recent years, semiconductor integrated circuits With the development of (IC) technology, the density of elements integrated into semiconductor chips has also increased significantly. Therefore, the width of the lines constituting the IC pattern on the semiconductor chip is very thin, for example, about 1 μm. In devices that manufacture such high-density integrated circuits, the quality of the products has come to be greatly affected by even the slightest vibrations applied from the outside or generated by the devices themselves.

Countermeasures against such vibrations have been considered from a design perspective, such as increasing the rigidity of the equipment that is the source of vibration, avoiding resonance with these equipment, and installing vibration isolation systems. It wasn't quite enough.

Therefore, as an anti-vibration measure, consideration is being given to using materials that dampen vibrations at the source of the vibrations.

Generally, according to vibration theory, in order to reduce the influence of vibration on the outside, the energy loss ratio (Q
- Emphasis is placed on a large gloss logarithmic attenuation rate (δ). In addition to this, characteristics such as the weight and elastic modulus (K) of the vibration-proof material may also be taken into consideration.

Conventional anti-vibration materials include, for example, rubber, anti-vibration metals (alloys), and ferrite composite materials. Among these, rubber has a large logarithmic damping rate, but when Young's modulus is evaluated as an elastic modulus, there is a problem in that the Young's modulus is small. Furthermore, although vibration-proof metals have a large Young's modulus, they have a problem in that they have a small logarithmic damping rate. Furthermore, ferrite composite materials have the advantage of having a large Young's modulus and a large logarithmic attenuation rate, but because they contain ferromagnetic materials, magnetic flux is generated due to oriented magnetization. It was unsuitable as a vibration isolating material for circuit manufacturing equipment, precision equipment, etc.

Therefore, in view of the above circumstances, the applicant of the present application
In Japanese Patent No. 51750, an anti-vibration composite body was designed, which was made of a mixed body of a piezoelectric powder material and a polymeric resin material, and in which a leakage path was formed in the mixed body.

(Objective of the Invention) An object of the present invention is to provide a vibration-proofing composite which has further improved vibration-damping characteristics and has a larger logarithmic damping rate than the vibration-proofing composite described above.

(Structure of the Invention) Therefore, the present invention is characterized in that it consists of a mixed and integrated product of a thermosetting resin material, a reactive liquid rubber, and a piezoelectric powder material.

The above-mentioned mixed body may contain a conductive powder material.

Examples of the thermosetting resin include polyimide, polyamideimide, polyurethane, silicone, allyl resin, epoxy resin, unsaturated polyester, amino resin,
There are phenolic resins, etc.

Examples of the reactive liquid rubber include liquid butadiene copolymers and diene copolymers whose terminal groups are modified with functional groups.

Among these, examples of liquid butadiene copolymers include liquid acrylonitrile butadiene rubber and liquid styrene butadiene rubber.

Examples of copolymers in which the terminal groups of diene copolymers are modified with functional groups include polybutadiene with carboxyl terminal groups and polybutadiene with hydroxyl terminal groups.

The reactive liquid rubber is contained in an amount of 50 to 150 parts by weight per 100 parts by weight of the thermosetting resin material. This is because when the content of the reactive liquid rubber is less than 50 parts by weight, the vibration damping composite becomes hard and the damping properties are poor, whereas when the content of the reactive liquid rubber is 150 parts by weight or more, This is because the Young's modulus of the vibratory composite is small and the strength is reduced.

Examples of the piezoelectric powder material include polymeric piezoelectric powder materials such as polyvinylidene fluoride, trifluoroethylene-PVDF copolymer, PbTiOs, Pb(T t
, Z r)03 binary or ternary system, Li
There are inorganic piezoelectric powder materials such as various solid solution metamorphosed materials such as NbO3-based, LiTaO3-based, and BaTiO3.

The piezoelectric powder material is contained in an amount of 100 to 4000 parts by weight based on 100 parts by weight of the thermosetting resin material. This is because when the content of the piezoelectric powder material is 100 parts by weight or less, the piezoelectric effect is small and the damping characteristics of the vibration-proof composite are poor;
This is because if the vibration-proof composite becomes brittle and its strength decreases.

Next, when a conductive powder material is included in the integrated mixture of the thermosetting resin, reactive liquid rubber, and piezoelectric powder material, a leakage path is formed by the conductive powder material. Examples of the above-mentioned conductive powder materials that form this leakage path include the following.

That is, the types of conductor powder materials include, for example:
Carbon, graphite, carbon-based microscopic objects such as carbon resistors, metal powder, semiconductive polymer resin materials, Snow, ZnO
There are materials in which a conductive film is formed on the surface of a semiconductive inorganic material, an insulating polymer resin material, or an insulating inorganic material such as.

The conductor powder material has the function of forming a leakage path in the vibration-proof composite, and its addition improves the strength of the vibration-proof composite. The appropriate amount of addition is 1 part by weight to 100 parts by weight per 100 parts by weight of the thermosetting resin, and if it exceeds 100 parts by weight, the moldability of the vibration-damping composite will deteriorate.

The above-mentioned leakage path is such that when vibration energy is applied to the vibration isolation composite, the vibration energy is absorbed by the piezoelectric powder material and converted into electric charge, and the generated electric charge is transferred to the surroundings of the piezoelectric powder material or to the piezoelectric powder material itself. A large logarithmic damping rate is obtained by leaking current from the existing leakage path and dissipating it as heat, that is, converting vibrational energy into tow energy.

(Effects of the Invention) According to the present invention, since the vibration isolating composite is made of a mixture of a thermosetting resin material, a reactive liquid rubber, and a piezoelectric powder material, the vibration isolating composite has When vibrational energy is applied from the outside, the vibrational energy is absorbed by the piezoelectric powder material and converted into electric charge, thereby absorbing the vibration. On the other hand, the vibration damping effect of the polymer resin and reactive liquid rubber and the piezoelectricity The frictional effects of the body powder material combine to absorb vibrations, and a large logarithmic damping rate can be obtained. When a conductive powder material is included in the mixture, a leakage path is formed, vibration energy is applied, and the piezoelectric powder material absorbs this vibrational energy and converts it into an electric charge, and this electric charge leaks through the leakage path. Vibration absorption is achieved by dissipating the heat as heat.

Further, according to the present invention, since the thermosetting resin material and the reactive liquid rubber fill the voids between the particles constituting the piezoelectric powder material, the rigidity of the piezoelectric powder material can be improved. A vibration damping composite with a large Young's modulus can be obtained.

Furthermore, according to the present invention, since the vibration-proof composite is made of a non-ferromagnetic material, generation of magnetic flux due to oriented magnetization can also be eliminated.

(Example) The present invention will be explained in detail below.

100 grams of epoxy resin and 100 grams of reactive liquid rubber were mixed together with 6 grams of solvent.

Next, 2200 grams of piezoelectric powder material and 200 grams of solvent were mixed into the mixture of the epoxy resin and liquid butadiene copolymer obtained above, and the piezoelectric powder material and carbon fiber powder were uniformly dispersed. Ta.

In order to distill off the solvent in the composition obtained as described above, this composition was left to stand naturally for a day and night, and then lmmH
Distilled in vacuo at g/3Hr. In this case, leaving to stand naturally may be omitted and vacuum distillation may be performed at 1 mmHg/5 Hr.

The obtained composition was heated at 150°C and 35Kgf/cm' for 3
Hot press for 0 minutes, length x width x thickness 75mm x
A vibration isolation composite of 75 mm x 2 mm was made.

A sample of the anti-vibration composite obtained in this way (hereinafter referred to as
It is called sample l. ) from a height of about 20 cra to give an impact, the logarithmic attenuation rate δ was determined from the following equation, and δ = 0.22. However, in the above formula (1), An and An+
, are the n-th and n-1-1-th amplitudes of vibrations generated in the sample l when the steel ball hits the sample, respectively.

In the above example, the amount of carbon fiber powder was 20
For sample 2 in grams, the logarithmic decay rate δ is δ=0
．． It was 24.

Further, in the above example, in sample 3 in which the amount of carphone fiber powder was 30 grams, δ=0.22.

The above is summarized in Table 1 below.

Table 1 Next, in order to confirm the effect of the above embodiment,
Comparative Examples 1 to 4 were produced based on Examples 1 to 4 of Japanese Patent No. 51750, respectively.

That is, in Comparative Example 1, 84% by weight of PZT powder, 1% by weight of carbon powder, and 15% by weight of polyester resin were mixed, the polymer material was added, the air was sufficiently defoamed, and the mixture was formed into a sheet. A sheet-like molded body was produced by heating and polymerizing it at 100°C for 2 hours.

Comparative Example 2 was produced by mixing 84% by weight of BaTiO3 powder, 1% by weight of carbon powder, and 15% by weight of polyester resin, and then heat-treating in the same manner as in Comparative Example 1.

In Comparative Example 3, a nickel conductive film was formed on the surface of BaTiO3 powder by electroless plating, and this BaTiO3
88% by weight of powder and 12% by weight of polyester resin were mixed, defoamed and then molded into a sheet, and this sheet-shaped molded product was produced by heating and polymerizing for 2 hours.

Comparative Example 4 is BaTi containing a trace amount of a semiconducting agent.
It was manufactured by mixing 8.8% by weight of O3 semiconductor powder and 12% by weight of polyester resin, defoaming, molding into a sheet, and heating and polymerizing this sheet-shaped molded product at 100° C. for 2 hours.

Regarding the above Comparative Examples 1 to 4, the logarithmic attenuation rate δ
When measured, the results shown in Table 2 below were obtained.

Table 2 As is clear from the comparison of Table 2 above with Table 1, the anti-vibration composites of Examples 1 to 3 have logarithmic damping rates δ of any of Comparative Examples 1 to 4. It can be seen that it is improved. In addition, when the characteristic of elastic modulus was measured, the value was smaller than that of the comparative example, but the value was larger than the elastic modulus of rubber, and there was no problem in practical use.

Claims (2)

[Claims] (1) Consists of a mixture of thermosetting resin material, reactive liquid rubber, and piezoelectric powder material, and this mixture includes:
50 to 150 parts by weight of the reactive liquid rubber and 100 to 4000 parts by weight of the piezoelectric powder material are contained in 100 parts by weight of the thermosetting resin material, respectively. Shaking complex. (2) The integrated mixture further contains a conductive powder material, and this conductive powder material is contained in an amount of 1 part by weight to 100 parts by weight based on 100 parts by weight of the thermosetting resin material. The anti-vibration composite according to claim 1, characterized in that: