JPS63201376U - - Google Patents
Info
- Publication number
- JPS63201376U JPS63201376U JP9209687U JP9209687U JPS63201376U JP S63201376 U JPS63201376 U JP S63201376U JP 9209687 U JP9209687 U JP 9209687U JP 9209687 U JP9209687 U JP 9209687U JP S63201376 U JPS63201376 U JP S63201376U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- printed circuit
- circuit board
- flow direction
- lead wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 14
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 4
- 238000010586 diagram Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9209687U JPS63201376U (enrdf_load_stackoverflow) | 1987-06-17 | 1987-06-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9209687U JPS63201376U (enrdf_load_stackoverflow) | 1987-06-17 | 1987-06-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63201376U true JPS63201376U (enrdf_load_stackoverflow) | 1988-12-26 |
Family
ID=30953485
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9209687U Pending JPS63201376U (enrdf_load_stackoverflow) | 1987-06-17 | 1987-06-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63201376U (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017175815A1 (ja) * | 2016-04-06 | 2017-10-12 | 三菱重工サーマルシステムズ株式会社 | 配線基板、電子部品付き配線基板、及び電子部品付き配線基板の製造方法 |
| JP2021141183A (ja) * | 2020-03-05 | 2021-09-16 | アール・ビー・コントロールズ株式会社 | プリント配線基板 |
-
1987
- 1987-06-17 JP JP9209687U patent/JPS63201376U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017175815A1 (ja) * | 2016-04-06 | 2017-10-12 | 三菱重工サーマルシステムズ株式会社 | 配線基板、電子部品付き配線基板、及び電子部品付き配線基板の製造方法 |
| JP2017188582A (ja) * | 2016-04-06 | 2017-10-12 | 三菱重工サーマルシステムズ株式会社 | 配線基板、電子部品付き配線基板、及び電子部品付き配線基板の製造方法 |
| EP3386281A4 (en) * | 2016-04-06 | 2019-03-06 | Mitsubishi Heavy Industries Thermal Systems, Ltd. | WIRING SUBSTRATE, WIRING SUBSTRATE ATTACHED TO AN ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING THE WIRING SUBSTRATE ATTACHED TO AN ELECTRONIC COMPONENT |
| JP2021141183A (ja) * | 2020-03-05 | 2021-09-16 | アール・ビー・コントロールズ株式会社 | プリント配線基板 |