JPS63201373U - - Google Patents
Info
- Publication number
- JPS63201373U JPS63201373U JP9277587U JP9277587U JPS63201373U JP S63201373 U JPS63201373 U JP S63201373U JP 9277587 U JP9277587 U JP 9277587U JP 9277587 U JP9277587 U JP 9277587U JP S63201373 U JPS63201373 U JP S63201373U
- Authority
- JP
- Japan
- Prior art keywords
- flexible printed
- printed circuit
- reinforcing plate
- circuit board
- electric circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003014 reinforcing effect Effects 0.000 claims description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9277587U JPS63201373U (US06623731-20030923-C00052.png) | 1987-06-18 | 1987-06-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9277587U JPS63201373U (US06623731-20030923-C00052.png) | 1987-06-18 | 1987-06-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63201373U true JPS63201373U (US06623731-20030923-C00052.png) | 1988-12-26 |
Family
ID=30954784
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9277587U Pending JPS63201373U (US06623731-20030923-C00052.png) | 1987-06-18 | 1987-06-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63201373U (US06623731-20030923-C00052.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7638888B2 (en) | 2007-02-16 | 2009-12-29 | Panasonic Corporation | Semiconductor chip mounting substrate, semiconductor chip mounting body, semiconductor chip stacked module, and semiconductor chip mounting substrate manufacturing method |
| JP2011146628A (ja) * | 2010-01-18 | 2011-07-28 | Nec Corp | フレキシブルプリント基板及び接続構造体及びその製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6054364B2 (ja) * | 1979-11-07 | 1985-11-29 | 三菱マテリアル株式会社 | 切刃用複合焼結部片 |
-
1987
- 1987-06-18 JP JP9277587U patent/JPS63201373U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6054364B2 (ja) * | 1979-11-07 | 1985-11-29 | 三菱マテリアル株式会社 | 切刃用複合焼結部片 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7638888B2 (en) | 2007-02-16 | 2009-12-29 | Panasonic Corporation | Semiconductor chip mounting substrate, semiconductor chip mounting body, semiconductor chip stacked module, and semiconductor chip mounting substrate manufacturing method |
| JP2011146628A (ja) * | 2010-01-18 | 2011-07-28 | Nec Corp | フレキシブルプリント基板及び接続構造体及びその製造方法 |
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