JPS63201373U - - Google Patents

Info

Publication number
JPS63201373U
JPS63201373U JP9277587U JP9277587U JPS63201373U JP S63201373 U JPS63201373 U JP S63201373U JP 9277587 U JP9277587 U JP 9277587U JP 9277587 U JP9277587 U JP 9277587U JP S63201373 U JPS63201373 U JP S63201373U
Authority
JP
Japan
Prior art keywords
flexible printed
printed circuit
reinforcing plate
circuit board
electric circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9277587U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9277587U priority Critical patent/JPS63201373U/ja
Publication of JPS63201373U publication Critical patent/JPS63201373U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の一実施例を示す斜視図、第２
図は要部拡大断面図、第３図は補強板の位置決め
を示す図、第４図は従来のフレキシブルプリント
回路基板の使用例を示す図である。 １……可動部、２……フレキシブルプリント回
路基板、３……電子部品、４……コネクタ、５…
…ベースフイルム、６……電気回路、７……オー
バーレイフイルム、８……補強板、８Ａ……基板
押え部、９……接着剤、１０……電子部品収納孔
、１１……リード線、１２……半田、１３……高
圧回路、１４……黒色両面接着テープ、１５……
保護フイルム。 Fig. 1 is a perspective view showing one embodiment of the present invention;
The figure is an enlarged sectional view of the main part, FIG. 3 is a diagram showing the positioning of the reinforcing plate, and FIG. 4 is a diagram showing an example of use of a conventional flexible printed circuit board. DESCRIPTION OF SYMBOLS 1...Movable part, 2...Flexible printed circuit board, 3...Electronic component, 4...Connector, 5...
... Base film, 6 ... Electric circuit, 7 ... Overlay film, 8 ... Reinforcement plate, 8A ... Board holding part, 9 ... Adhesive, 10 ... Electronic component storage hole, 11 ... Lead wire, 12 ...Solder, 13...High voltage circuit, 14...Black double-sided adhesive tape, 15...
protective film.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ベースフイルムとオーバーレイフイルムとで電
気回路を被覆保護したフレキシブルプリント回路
基板において、この基板の所定箇所に補強板を接
着固定し、この補強板に設けた電子部品収納孔内
に電子部品を挿入配置し、そのリード線を前記電
気回路に接続したことを特徴とするフレキシブル
プリント回路基板。 In a flexible printed circuit board in which the electric circuit is covered and protected with a base film and an overlay film, a reinforcing plate is adhesively fixed to a predetermined location on this board, and electronic components are inserted and placed in the electronic component storage hole provided in this reinforcing plate. , a flexible printed circuit board characterized in that the lead wire is connected to the electric circuit.
JP9277587U 1987-06-18 1987-06-18 Pending JPS63201373U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9277587U JPS63201373U (en) 1987-06-18 1987-06-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9277587U JPS63201373U (en) 1987-06-18 1987-06-18

Publications (1)

Publication Number Publication Date
JPS63201373U true JPS63201373U (en) 1988-12-26

Family

ID=30954784

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9277587U Pending JPS63201373U (en) 1987-06-18 1987-06-18

Country Status (1)

Country Link
JP (1) JPS63201373U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7638888B2 (en) 2007-02-16 2009-12-29 Panasonic Corporation Semiconductor chip mounting substrate, semiconductor chip mounting body, semiconductor chip stacked module, and semiconductor chip mounting substrate manufacturing method
JP2011146628A (en) * 2010-01-18 2011-07-28 Nec Corp Flexible printed board, connection structure, and method of manufacturing the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6054364B2 (en) * 1979-11-07 1985-11-29 三菱マテリアル株式会社 Composite sintered piece for cutting blade

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6054364B2 (en) * 1979-11-07 1985-11-29 三菱マテリアル株式会社 Composite sintered piece for cutting blade

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7638888B2 (en) 2007-02-16 2009-12-29 Panasonic Corporation Semiconductor chip mounting substrate, semiconductor chip mounting body, semiconductor chip stacked module, and semiconductor chip mounting substrate manufacturing method
JP2011146628A (en) * 2010-01-18 2011-07-28 Nec Corp Flexible printed board, connection structure, and method of manufacturing the same

Similar Documents

Publication Publication Date Title
JPS63201373U (en)
JPS58138365U (en) Dummy pattern for reinforcing flexible printed circuits
JPS60125769U (en) electrical circuit board
JPS6018564U (en) Film for flexible printed boards
JPS5936273U (en) Structure of lead wire fixing part of flexible circuit board with reinforcing plate
JPH0465479U (en)
JPS5936291U (en) Protective device for flexible printed wiring boards
JPS5853175U (en) Hybrid integrated circuit device
JPS58187177U (en) flexible printed circuit board
JPS59109172U (en) flexible circuit board
JPS61149386U (en)
JPS614407U (en) flyback transformer
JPS61190170U (en)
JPS59145059U (en) Printed board
JPS58168166U (en) Terminal processing structure of small coil
JPS6298493U (en)
JPS586405U (en) antenna connection device
JPS63108675U (en)
JPS61182077U (en)
JPS6054313U (en) Toroidal coil mounting structure
JPS64357U (en)
JPS6041077U (en) Electronics
JPS5925188U (en) connector
JPS60133590U (en) Mounting socket for printed circuit board
JPS5944073U (en) Adhesive structure of flexible printed board