JPS6320107Y2 - - Google Patents
Info
- Publication number
- JPS6320107Y2 JPS6320107Y2 JP5366481U JP5366481U JPS6320107Y2 JP S6320107 Y2 JPS6320107 Y2 JP S6320107Y2 JP 5366481 U JP5366481 U JP 5366481U JP 5366481 U JP5366481 U JP 5366481U JP S6320107 Y2 JPS6320107 Y2 JP S6320107Y2
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- electronic component
- exterior body
- electrodes
- ceramic substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 claims description 46
- 239000000919 ceramic Substances 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 13
- 238000000605 extraction Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229910052573 porcelain Inorganic materials 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000010405 reoxidation reaction Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
- Coils Or Transformers For Communication (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5366481U JPS6320107Y2 (me) | 1981-04-13 | 1981-04-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5366481U JPS6320107Y2 (me) | 1981-04-13 | 1981-04-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57166330U JPS57166330U (me) | 1982-10-20 |
| JPS6320107Y2 true JPS6320107Y2 (me) | 1988-06-03 |
Family
ID=29850293
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5366481U Expired JPS6320107Y2 (me) | 1981-04-13 | 1981-04-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6320107Y2 (me) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61195030U (me) * | 1985-05-27 | 1986-12-04 | ||
| JP4736225B2 (ja) * | 2001-04-16 | 2011-07-27 | パナソニック株式会社 | コンデンサ |
| JP6424460B2 (ja) * | 2014-05-09 | 2018-11-21 | 日本ケミコン株式会社 | 積層セラミックコンデンサ及びその製造方法 |
-
1981
- 1981-04-13 JP JP5366481U patent/JPS6320107Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57166330U (me) | 1982-10-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR930010076B1 (ko) | 다층혼성집적회로 | |
| US5055966A (en) | Via capacitors within multi-layer, 3 dimensional structures/substrates | |
| EP0423821B1 (en) | Surface-mount network device | |
| KR101911310B1 (ko) | 복합 전자부품 및 저항 소자 | |
| JPS6320107Y2 (me) | ||
| JPS5924535B2 (ja) | 積層複合部品 | |
| CN106486223A (zh) | 电阻元件用的集合基板 | |
| US4630170A (en) | Decoupling capacitor and method of manufacture thereof | |
| JP6232836B2 (ja) | コンデンサ素子 | |
| US6381120B2 (en) | Mounting arrangement for multilayer electronic part | |
| US6597056B1 (en) | Laminated chip component and manufacturing method | |
| US4622619A (en) | Decoupling capacitor and method of manufacture thereof | |
| JP3246166B2 (ja) | 薄膜コンデンサ | |
| JPS62213226A (ja) | チツプ型電子部品 | |
| JP2571389B2 (ja) | 積層型混成集積回路部品 | |
| US20230262888A1 (en) | Multilayer structure and method for manufacturing the same | |
| JPS6228749Y2 (me) | ||
| JP2538631Y2 (ja) | チップ状素子ネットワークデバイス | |
| JPH0427152Y2 (me) | ||
| JPH022318B2 (me) | ||
| JPS626675Y2 (me) | ||
| JPS6129530B2 (me) | ||
| JP3731284B2 (ja) | 積層型チップインダクタ | |
| JPH0441619Y2 (me) | ||
| JPS6347248B2 (me) |