JPS63200400U - - Google Patents
Info
- Publication number
- JPS63200400U JPS63200400U JP9115787U JP9115787U JPS63200400U JP S63200400 U JPS63200400 U JP S63200400U JP 9115787 U JP9115787 U JP 9115787U JP 9115787 U JP9115787 U JP 9115787U JP S63200400 U JPS63200400 U JP S63200400U
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- lead
- ground
- electrically connected
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
- 238000003780 insertion Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第１図は本考案の一実施例としてのプリント配
線体の断面図、第２図はプリント配線体の斜視図
、第３図は絶縁基板に貫通型コンデンサを挿入す
るための治具の斜視図、第４図は前記プリント配
線体を電子チユーナ等のベースに取付けた状態の
部分側面図、第５図は本考案の他の実施例として
のプリント配線体の斜視図、第６図は前記プリン
ト配線体をベースに取付けた状態の部分側面図で
ある。第７図は従来例のプリント配線体の斜視図
である。
１……絶縁基板、２……グランドパターン、３
……導電パターン、４……リード挿通孔、５……
貫通型コンデンサ、５２……貫通リード、５３…
…グランド電極、Ａ……治具、Ｂ……ベース。
Fig. 1 is a sectional view of a printed wiring body as an embodiment of the present invention, Fig. 2 is a perspective view of the printed wiring body, and Fig. 3 is a perspective view of a jig for inserting a feedthrough capacitor into an insulating substrate. , FIG. 4 is a partial side view of the printed wiring body attached to the base of an electronic tuner, etc., FIG. 5 is a perspective view of the printed wiring body as another embodiment of the present invention, and FIG. FIG. 3 is a partial side view of the wiring body attached to the base. FIG. 7 is a perspective view of a conventional printed wiring body. 1...Insulating board, 2...Ground pattern, 3
...Conductive pattern, 4...Lead insertion hole, 5...
Feedthrough capacitor, 52...Through lead, 53...
...Ground electrode, A...Jig, B...Base.
Claims (1)
の面に導電パターンをそれぞれ形成し、リード挿
通孔を各パターンに開口させ、リード挿通孔に挿
通した貫通型コンデンサのグランド電極をグラン
ドパターンと電気的に接続しかつ、前記リードを
導電パターンと電気的に接続したことを特徴とす
るプリント配線板。 A ground pattern is formed on one side of the insulating substrate and a conductive pattern is formed on the other side. Lead insertion holes are opened in each pattern, and the ground electrode of the feedthrough capacitor inserted through the lead insertion hole is electrically connected to the ground pattern. What is claimed is: 1. A printed wiring board, wherein the lead is electrically connected to a conductive pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9115787U JPS63200400U (en) | 1987-06-12 | 1987-06-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9115787U JPS63200400U (en) | 1987-06-12 | 1987-06-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63200400U true JPS63200400U (en) | 1988-12-23 |
Family
ID=30951678
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9115787U Pending JPS63200400U (en) | 1987-06-12 | 1987-06-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63200400U (en) |
-
1987
- 1987-06-12 JP JP9115787U patent/JPS63200400U/ja active Pending