JPS61141793U - - Google Patents
Info
- Publication number
- JPS61141793U JPS61141793U JP2450685U JP2450685U JPS61141793U JP S61141793 U JPS61141793 U JP S61141793U JP 2450685 U JP2450685 U JP 2450685U JP 2450685 U JP2450685 U JP 2450685U JP S61141793 U JPS61141793 U JP S61141793U
- Authority
- JP
- Japan
- Prior art keywords
- socket
- socket body
- capacitor
- wiring connected
- electrode terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims description 4
- 230000037431 insertion Effects 0.000 claims description 3
- 238000003780 insertion Methods 0.000 claims description 3
Description
第１図は本考案の一実施例の斜視図、第２図は
従来のＩＣ用ソケツトをプリント基板に取付け、
ＩＣを装着した状態を示す斜視図である。
１……ソケツト本体、２……ＩＣさし込み口、
３……ソケツトリード端子、５，９……コンデン
サ、４ａ……ソケツト本体上面の配線、４ｂ……
ソケツト本体下面の配線、６……プリント基板、
７……プリント基板の接地配線、８……プリント
基板の電源配線、１１……装着ＩＣ。
Fig. 1 is a perspective view of an embodiment of the present invention, and Fig. 2 shows a conventional IC socket attached to a printed circuit board.
FIG. 3 is a perspective view showing a state in which an IC is attached. 1...Socket body, 2...IC insertion port,
3...Socket lead terminal, 5, 9...Capacitor, 4a...Wiring on top of socket body, 4b...
Wiring on the bottom of the socket body, 6...Printed circuit board,
7... Ground wiring of the printed circuit board, 8... Power supply wiring of the printed circuit board, 11... Mounted IC.
Claims (1)
数のさし込み口を上面に有するソケツト本体と、
前記さし込み口から前記ソケツト本体内を貫通し
てその下面外部に引出されたソケツトリード端子
とを備えたＩＣ用ソケツトにおいて、前記ソケツ
ト本体にはさらにコンデンサが内蔵され、かつ、
このコンデンサの一方の電極端子と接続された配
線が前記ソケツト本体の上面に、他方の電極端子
と接続された配線が前記ソケツト本体の下面にそ
れぞれ形成されていることを特徴とするＩＣ用ソ
ケツト。 a socket body having a plurality of insertion openings on the upper surface into which lead terminals of an IC to be mounted are inserted;
In the IC socket, the IC socket includes a socket lead terminal that penetrates through the socket body from the insertion opening and is drawn out to the outside of the bottom surface of the socket, wherein the socket body further includes a built-in capacitor, and
An IC socket characterized in that a wiring connected to one electrode terminal of the capacitor is formed on the upper surface of the socket body, and a wiring connected to the other electrode terminal of the capacitor is formed on the lower surface of the socket body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2450685U JPS61141793U (en) | 1985-02-22 | 1985-02-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2450685U JPS61141793U (en) | 1985-02-22 | 1985-02-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61141793U true JPS61141793U (en) | 1986-09-02 |
Family
ID=30518716
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2450685U Pending JPS61141793U (en) | 1985-02-22 | 1985-02-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61141793U (en) |
-
1985
- 1985-02-22 JP JP2450685U patent/JPS61141793U/ja active Pending