JPS63199969U - - Google Patents
Info
- Publication number
- JPS63199969U JPS63199969U JP9002387U JP9002387U JPS63199969U JP S63199969 U JPS63199969 U JP S63199969U JP 9002387 U JP9002387 U JP 9002387U JP 9002387 U JP9002387 U JP 9002387U JP S63199969 U JPS63199969 U JP S63199969U
- Authority
- JP
- Japan
- Prior art keywords
- perforations
- tape
- strip
- adhesive layer
- shaped substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012790 adhesive layer Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Packages (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9002387U JPS63199969U (es) | 1987-06-11 | 1987-06-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9002387U JPS63199969U (es) | 1987-06-11 | 1987-06-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63199969U true JPS63199969U (es) | 1988-12-22 |
Family
ID=30949526
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9002387U Pending JPS63199969U (es) | 1987-06-11 | 1987-06-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63199969U (es) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5827398A (ja) * | 1981-08-11 | 1983-02-18 | 松下電器産業株式会社 | 電子部品集合体 |
-
1987
- 1987-06-11 JP JP9002387U patent/JPS63199969U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5827398A (ja) * | 1981-08-11 | 1983-02-18 | 松下電器産業株式会社 | 電子部品集合体 |