JPS6319986B2 - - Google Patents
Info
- Publication number
- JPS6319986B2 JPS6319986B2 JP15642682A JP15642682A JPS6319986B2 JP S6319986 B2 JPS6319986 B2 JP S6319986B2 JP 15642682 A JP15642682 A JP 15642682A JP 15642682 A JP15642682 A JP 15642682A JP S6319986 B2 JPS6319986 B2 JP S6319986B2
- Authority
- JP
- Japan
- Prior art keywords
- metal
- metal laminate
- tapes
- connection
- synthetic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 46
- 239000002184 metal Substances 0.000 claims description 46
- 238000000034 method Methods 0.000 claims description 16
- 239000010409 thin film Substances 0.000 claims description 16
- 229920003002 synthetic resin Polymers 0.000 claims description 12
- 239000000057 synthetic resin Substances 0.000 claims description 12
- 239000000843 powder Substances 0.000 claims description 9
- 239000011888 foil Substances 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- 230000010355 oscillation Effects 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 description 10
- 230000001070 adhesive effect Effects 0.000 description 10
- 238000005476 soldering Methods 0.000 description 6
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 229920013716 polyethylene resin Polymers 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Electric Cables (AREA)
Description
【発明の詳細な説明】
本発明は片面に合成樹脂薄膜をラミネートした
金属ラミネートテープの導電接続方法特にラミネ
ート樹脂面を重合して接続する金属ラミネートテ
ープの導電接続方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for electrically connecting a metal laminate tape having one side laminated with a synthetic resin thin film, and particularly to a method for electrically connecting a metal laminate tape in which the laminate resin surface is polymerized and connected.
本発明の目的は、金属ラミネートテープを複雑
な工程を要せず、簡単に導電接続することを可能
にし、しかも、接続作業の所要時間が非常に短縮
されるとともに、接続部の接着強度が大であり、
接続作業が大気温度や大気湿度等の外部の環境に
影響されることがない極めて信頼性の高い金属ラ
ミネートテープの導電接続方法を提供せんとする
ものである。 The purpose of the present invention is to make it possible to easily conductively connect metal laminate tapes without the need for complicated processes, to greatly reduce the time required for the connection work, and to increase the adhesive strength of the connection part. and
It is an object of the present invention to provide an extremely reliable method for conductive connection of metal laminate tapes in which the connection work is not affected by external environments such as atmospheric temperature and humidity.
従来、鉛や鉛合金等の軟質金属薄膜テープやそ
の片面に合成樹脂薄膜をラミネートした金属ラミ
ネートテープを導電接続する方法として導電性
の接着剤を使用する方法とハンダ付け方法とが
知られている。前記方法のうち導電性の接着剤
を使用する方法では接着剤を乾燥硬化させるた
め、金属薄膜テープの接着後、10分間から１時間
の硬化時間を必要とした。又、接着部を耐湿性が
悪いため、湿度を大気中の相対湿度にて80％以下
におさえる必要があるとともに、大気の温度や湿
度の変化による接着部の結露を防止するための措
置が必要であつた。従つて、これらの問題点があ
るため、導電性の接着剤を使用する方法は実際上
殆ど用いられていなかつたものである。一方、
のハンダ付けによる方法では、ハンダが溶融する
温度までテープを加熱する必要があるために片面
に合成樹脂薄膜をラミネートしたテープ等ではラ
ミネートされた合成樹脂薄膜が加熱によつて劣化
するので、この方法による接続に適さず、あえて
この方法を採用しようとするときはラミネート層
となる合成樹脂薄膜に耐熱性の合成樹脂を使用す
る必要があつて高価となつてしまう欠点がある。
又、ハンダ付けするためのハンダ材料の供給の問
題やハンダ付け作業に長時間を要するので、短時
間で導電接続することが不可能であるほかハンダ
付け作業に熟練を要するなどの欠点があつた。 Conventionally, methods using a conductive adhesive and soldering methods are known as methods for conductively connecting soft metal thin film tapes such as lead or lead alloys, and metal laminate tapes laminated with a synthetic resin thin film on one side. . Among the above methods, the method using a conductive adhesive requires a curing time of 10 minutes to 1 hour after adhesion of the metal thin film tape in order to dry and harden the adhesive. In addition, because the adhesive part has poor moisture resistance, it is necessary to keep the humidity below 80% of the relative humidity in the atmosphere, and measures must be taken to prevent condensation on the adhesive part due to changes in atmospheric temperature and humidity. It was hot. Therefore, due to these problems, methods using conductive adhesives have rarely been used in practice. on the other hand,
In the soldering method, it is necessary to heat the tape to a temperature at which the solder melts.If the tape has a synthetic resin thin film laminated on one side, the laminated synthetic resin thin film will deteriorate due to heating, so this method However, if this method is used, it is necessary to use a heat-resistant synthetic resin for the synthetic resin thin film that forms the laminate layer, resulting in an expensive connection.
In addition, there were problems with the supply of soldering material for soldering, and since the soldering work took a long time, it was impossible to make conductive connections in a short time, and the soldering work required skill. .
本発明は叙上の問題点を解消せんとするもので
あり、以下に記載する発明の完成によりその目的
を達成できたものである。 The present invention aims to solve the above-mentioned problems, and has achieved its purpose by completing the invention described below.
以下、本発明の実施例を図面を参照して説明す
る。 Embodiments of the present invention will be described below with reference to the drawings.
１，１はその片面に厚さ0.02ｍ／ｍ、巾300
ｍ／ｍのポリエチレン樹脂薄膜２，２をラミネー
トした厚さ0.05ｍ／ｍ、巾300ｍ／ｍの純鉛から
なる金属ラミネートテープである。この金属ラミ
ネートテープ１，１の端部を前記ポリエチレン樹
脂薄膜２，２面が互に対向するように重合して、
鉄ブロツクからなる受台３上に載置し、前記重合
部に接続面４を形成する。そして、この接続面４
に10μ粒度のアルミニユーム粉末等の導電性金属
粉末５…５を0.2〜0.4ｍ／ｍの厚さに散布して接
続面４間に導電性金属粉末５を介在せしめ、更に
この接続面４の上方に位置する金属ラミネートテ
ープ１の上面に厚さ0.2ｍ／ｍ、巾310ｍ／ｍ、長
さ200ｍ／ｍの純アルミニユームからなる金属箔
６を載置する。しかるのち、受台３を180℃程度
に加熱し、あるいは受台３をあらかじめ180℃程
度に加熱しておき、金属ラミネートテープ１，１
の接続面４を加熱しながら、前記金属箔６面上に
圧力をエアシリンダー圧力2.5Kg／cm2、振動時間
を５秒間の条件下で超音波の発振によつてハンマ
ー７を振動せしめて、叩打し金属ラミネートテー
プ１，１の接続面４全面に超音波による振動を与
え、金属ラミネートテープ１，１同志を圧着、接
続するものである。 1,1 has a thickness of 0.02m/m and a width of 300mm on one side.
This is a metal laminate tape made of pure lead with a thickness of 0.05 m/m and a width of 300 m/m, laminated with polyethylene resin thin films 2, 2 of m/m. The ends of the metal laminate tapes 1, 1 are polymerized so that the polyethylene resin thin films 2, 2 sides face each other,
It is placed on a pedestal 3 made of an iron block, and a connecting surface 4 is formed at the overlapping portion. And this connection surface 4
Conductive metal powder 5...5 such as aluminum powder with a particle size of 10μ is sprinkled on the surface to a thickness of 0.2 to 0.4 m/m to interpose the conductive metal powder 5 between the connecting surfaces 4, and further above the connecting surfaces 4. A metal foil 6 made of pure aluminum with a thickness of 0.2 m/m, a width of 310 m/m, and a length of 200 m/m is placed on the upper surface of the metal laminate tape 1 located at . After that, heat the pedestal 3 to about 180℃, or heat the pedestal 3 to about 180℃ in advance, and attach the metal laminate tapes 1 and 1.
While heating the connecting surface 4 of the metal foil 6, the hammer 7 is vibrated by ultrasonic oscillation under the conditions of an air cylinder pressure of 2.5 kg/cm 2 and a vibration time of 5 seconds. Ultrasonic vibration is applied to the entire connecting surface 4 of the hammered metal laminate tapes 1, 1 to press and connect the metal laminate tapes 1, 1 together.
本発明にかかる金属ラミネートテープ１，１の
接続面４の接着強度を実験により測定してみる
と、接続面４から金属ラミネートテープ１，１が
剥離することはなく、すべて接続面４以外の部分
で金属ラミネートテープ１，１の破断があり接着
強度の大きいことが判明した。又、本発明にかか
る金属ラミネートテープ１，１を大気中に放置し
ても、大気中の温度や湿度に影響されず、半年後
の経時測定結果においても、接続面４の接着強度
は当初と全く変化がなかつた。 When the adhesive strength of the connecting surfaces 4 of the metal laminate tapes 1, 1 according to the present invention was experimentally measured, it was found that the metal laminate tapes 1, 1 did not peel off from the connecting surfaces 4, and all parts other than the connecting surfaces 4 The metal laminate tapes 1 and 1 were broken, indicating that the adhesive strength was high. Moreover, even if the metal laminate tapes 1, 1 according to the present invention are left in the atmosphere, they are not affected by the temperature or humidity in the atmosphere, and even in the results of time-lapse measurements after half a year, the adhesive strength of the connecting surface 4 remains the same as at the beginning. There was no change at all.
上記のような方法とした本発明の特徴をあげれ
ば以下の通りである。 The features of the present invention, which is the method described above, are as follows.
金属ラミネートテープ１，１は、
(i) 合成樹脂薄膜２，２を向い合わせて接続面４
を構成したので接続に際する加熱によつて両者
の一体化は強固に維持できるようになつた。 The metal laminate tapes 1, 1 are (i) connected to the connecting surface 4 with the synthetic resin thin films 2, 2 facing each other;
Because of this structure, the integration of the two can be maintained firmly by heating during connection.
(ii) 合成樹脂薄膜２，２を向い合わせることによ
り重合された金属ラミネートテープ１，１の導
電性は阻害されるが、この接続面４にアルミニ
ウムの粉末５…５等の導電性金属粉末を散布介
在させたのでこれらの金属粉末を介して上下の
金属テープ１，１の電気的な導通を図ることが
できる。(ii) By placing the synthetic resin thin films 2, 2 facing each other, the conductivity of the polymerized metal laminate tapes 1, 1 is inhibited; however, conductive metal powder such as aluminum powder 5...5 is applied to this connecting surface 4. Since the metal powder is dispersed, electrical continuity between the upper and lower metal tapes 1, 1 can be achieved through these metal powders.
(iii) 接続面４に散布された金属粉末はラミネート
層である合成樹脂薄膜２，２の層に食い込んで
その上下にある金属薄板テープ１，１に接触す
るので散布位置は強固に保持されることとな
り、接続面４から脱落することがない。(iii) The metal powder sprinkled on the connection surface 4 bites into the laminated synthetic resin thin films 2, 2 and comes into contact with the thin metal tapes 1, 1 above and below, so that the spraying position is firmly maintained. Therefore, it will not fall off from the connection surface 4.
(iv) ハンマー７による超音波接続に際して金属ラ
ミネートテープ１の上面に当て板として金属箔
６を用いたので金属ラミネートテープ１，１に
加えられる剪断力が弱められテープ自体の切断
事故を生じることがない。(iv) Since the metal foil 6 was used as a backing plate on the top surface of the metal laminate tape 1 during the ultrasonic connection using the hammer 7, the shearing force applied to the metal laminate tapes 1, 1 was weakened, and an accident of cutting the tape itself could occur. do not have.
(v) 金属ラミネートテープ１，１の接続作業に要
する時間が従来の10分の１乃至18分の１という
短時間に縮少することができるうえ、接続作業
に熟練を必要としない。(v) The time required to connect the metal laminate tapes 1, 1 can be shortened to 1/10 to 1/18 of the conventional time, and the connection does not require skill.
(vi) 接続部の接続強度が大きいうえ、接続部は外
部の環境変化に影響されることなく長期に渉つ
て接続強度を維持できる。(vi) The connection strength of the connection part is high, and the connection part can maintain connection strength for a long period of time without being affected by changes in the external environment.
図は本発明の実施例を示すものであり、第１図
は金属ラミネートテープの端部を重合した状態を
示す断面図、第２図は金属ラミネートテープの、
接続面に導電性金属粉末を散布した状態を示す断
面図、第３図は、接続作業の状態を示す断面図で
ある。
１，１……金属ラミネートテープ、２，２……
ポリエチレン樹脂薄膜、３……受台、４……接続
面、５……導電性金属粉末、６……金属箔、７…
…ハンマー。
The figures show examples of the present invention, and FIG. 1 is a cross-sectional view showing a state in which the ends of a metal laminate tape are polymerized, and FIG.
FIG. 3 is a cross-sectional view showing a state in which conductive metal powder is sprinkled on the connection surface, and FIG. 3 is a cross-sectional view showing the state of connection work. 1,1...Metal laminate tape, 2,2...
Polyethylene resin thin film, 3... pedestal, 4... connection surface, 5... conductive metal powder, 6... metal foil, 7...
…hammer.
Claims (1)
鉛等からなる金属ラミネートテープの合成樹脂薄
膜面を対向させ、この合成樹脂薄膜の各端部を重
合して接続面を形成し、この接続面にはアルミニ
ユーム粉末等の導電性金属粉末を介在させるとと
もに、前記接続面のある金属ラミネートテープの
上方にアルミニユームテープ等の金属箔を載置し
たのち、金属ラミネートテープの接続面を加熱し
ながら、前記金属箔面上に超音波の発振による振
動を与えて、２枚の金属ラミネートテープを圧
着、接続するようにした金属ラミネートテープの
導電接続方法。1. Place the synthetic resin thin film surfaces of two metal laminate tapes made of lead etc. with a synthetic resin thin film laminated on one side facing each other, polymerize each end of the synthetic resin thin film to form a connection surface, and In this method, a conductive metal powder such as aluminum powder is interposed, and a metal foil such as aluminum tape is placed above the metal laminate tape with the connection surface, and then the connection surface of the metal laminate tape is heated while the connection surface is heated. A conductive connection method for metal laminate tapes in which two metal laminate tapes are crimped and connected by applying vibration by ultrasonic oscillation on the metal foil surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15642682A JPS5946787A (en) | 1982-09-08 | 1982-09-08 | Method of conductively connecting metal laminated tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15642682A JPS5946787A (en) | 1982-09-08 | 1982-09-08 | Method of conductively connecting metal laminated tape |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5946787A JPS5946787A (en) | 1984-03-16 |
| JPS6319986B2 true JPS6319986B2 (en) | 1988-04-26 |
Family
ID=15627483
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15642682A Granted JPS5946787A (en) | 1982-09-08 | 1982-09-08 | Method of conductively connecting metal laminated tape |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5946787A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6135593A (en) * | 1984-07-28 | 1986-02-20 | 有限会社 インタ−フエイス技術研究所 | Method of bonding printed circuit board |
| JPS61134255A (en) * | 1984-12-03 | 1986-06-21 | Ryobi Ltd | Feeder of rolled printing paper of photo-typesetter and its setting method |
| JP6181057B2 (en) | 2012-08-28 | 2017-08-16 | 株式会社Ｇｓユアサ | Power storage device manufacturing method and power storage device |
-
1982
- 1982-09-08 JP JP15642682A patent/JPS5946787A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5946787A (en) | 1984-03-16 |
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