JPS63198338A - Resin-sealing apparatus for semiconductor element - Google Patents

Abstract

PURPOSE:To suitably constitute the driving direction of reciprocating means by providing a flexible transmission member for connecting the output of the reciprocating means to a plunger to transmit a reciprocating force to the plunger and ventilation means for cooling air to the sliding passage of the member in upper and lower molds. CONSTITUTION:A plunger 43 is driven by a flexible transmission member 41 for connecting the plunger 43 to the output 40 of reciprocating means, and the bending direction of the member 41 is altered to suitably determine the direction of the means to the plunger 43. The means 41 is cooled with cooling air from ventilation means 58-62 in its sliding passage. Thus, the disposing direction of its reciprocating driver can be properly determined with respect to the plunger 43, thereby effectively concentrically cooling a chain 41 of the member.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an improvement in a resin sealing device for semiconductor elements used for resin sealing of semiconductor elements.

[Conventional technology]

FIG. 8 is a side view showing a conventional resin sealing device for semiconductor elements disclosed in, for example, Japanese Utility Model Application Publication No. 59-9538.
In the figure, (1) is the lower platen, (2) is the four tie bars connected to the lower platen (1), and (3) is the upper end of the tie bar (2) facing the lower platen (1). The upper platen (4) is connected to the lower platen (1), the servo motor (5) is supported by the tie bar (2), and the reciprocating means (4) is driven by the servo motor (4). A movable platen (not shown) is moved up and down by a movable platen (not shown), (6) is a lower mold disposed on the upper part of this movable platen (5), and (7) is the upper platen (3) facing this lower mold. (8) is a pair of supports connected to the upper part of the upper platen (3);
(9) is a mounting plate connected to the upper ends of this pair of pillars, (IQ+ is a servo motor connected to this mounting plate (9), and circle is the first gear driven by this servo motor α■. The key is that this first gear (second gear Q3 meshed with 111) is a screw shaft rotatably supported by the mounting plate (9) and the upper part of the upper platen (3), and the second gear (Q3) is rotatably supported by the mounting plate (9) and the upper part of the upper platen (3). I is driven by this screw iq
The movable plate -051, which has a threaded portion (14a) that is screwed into the upper platen (141) and is supported by the pillar (7), is connected to this movable plate (141) and is connected to the upper platen (3).
and a plunger that moves up and down within each through hole (3a) (7a) of the upper mold (7), uiil is this plunger [15
This is a tablet that is press-fitted by 1.

In the device configured as described above, the movable platen (5) is moved up via the reciprocating means (not shown) by the drive of the servo motor (4), and the lower mold (6) is moved up and down by the upper mold (6). 7
). Here, the tablet 00 is placed in the through hole (7a) and the servo motor aα is driven. The rotational force of the servo motor QQI is transmitted from the first gear αυ to the screw shaft via the second gear (141).

Here, since the screw portion (14a) of the movable plate (141) is screwed onto the screw shaft +131, the rotation of the screw shaft OJ causes the movable plate 04) to be supported by the column (8) and displaced downward. Lower the plunger 09. For this reason-
A tablet +-u6) is press-fitted between the upper mold (7) and the lower mold (6), and a semiconductor element (not shown) is sealed with resin.

By the way, the plunger u9 is directly driven by the screw shaft Q3), and is always connected to the screw shaft 03 and the plunger α9.
When maintaining the plunger Q51, the movable plate (14), the mounting plate (9), the first gear wheel, and the second gear α2 are removed from the support column (8).

[Problem that the invention seeks to solve]

Since the conventional resin sealing device for semiconductor devices is configured as described above, the pressure direction of the plunger and the arrangement direction of the reciprocating drive system that drives this plunger are arranged in fixed directions. There are also problems such as restrictions on the location of the reciprocating drive system, which hinders the downsizing of the device.

This invention has been made to solve the above-mentioned problems, and it is an object of the present invention to obtain a resin sealing device for a semiconductor element, which makes it possible to appropriately determine the arrangement direction of a reciprocating drive system for a plunger. With the goal.

[Means for solving problems]

A resin sealing device for a semiconductor element according to the present invention includes an upper mold and a lower mold for housing a semiconductor element, a plunger for press-fitting a resin into the upper mold and the lower mold to seal the semiconductor element, Reciprocating means having an output section capable of reciprocating the plunger; a flexible transmission member that connects the output section of the reciprocating means with the plunger and transmits the reciprocating driving force of the output section to the plunger; A ventilation means is provided for blowing cooling air into the sliding path of the transmission member in the upper mold and the lower mold.

[Effect]

In the resin sealing device for semiconductor devices according to the present invention, the Lee plunger is driven by a transmission member that connects the plunger and the output part of the reciprocating means, and by changing the bending direction of the transmission member, the reciprocating motion relative to the plunger is achieved. The means are appropriately oriented, while the transmission means is cooled in its pointing path by cooling air from the ventilation means.

[Example] Hereinafter, an example of the present invention will be described with reference to the drawings. 1st
In Fig. 5, 1 is a base connected to the movable platen (5) via a pole 121), and 122) is an AC servo motor connected to this base 23).
is a pulley connected to the output shaft (22a) of this AC servo motor (2/D is this boo IJ as shown in Figure 2).
A belt is wound around i, a driven pulley is rotated by this belt □□□, ■ is a belt wound around this driven pulley □□□, @ is a driven pulley rotated by this belt ω , ■ is a pair of first gears connected to this driven pulley ■ and one device, □□□ is a pair of second gears meshed with this pair of first gears ■, (support) is connected to the base ■ The gear box shown in Fig. 3 is supported by a pair of rotating shafts that are supported in this gear box via bearings Sυ, and the second gears of the pair of gears are connected as shown in Fig. 3. A pair of couplings connected to the rotating shaft, ■ a pair of ball screw shafts connected to this pair of couplings, A pair of bearing boxes are supported through a pair of bearing boxes, (381 is a pair of covers that handle the bearings), (381 is a mounting base that is connected to the base field, and is connected to the pair of bearing boxes (rounds); The guide rails 139) connected to the mounting base are a pair of nuts that mesh with the pair of ball screw shafts (139), which are respectively engaged with the guide rails (139). A pair of rods (4υ is the chrysanthemum of this pair of rods) are connected at one end to a nut ■, and a pair of chains are connected via a pin (42J) to a link plate (4υ) as shown in Figure 6.
1a) and a large number of rollers (41b) are connected. (4
3 is a pair of plungers having rod portions (43a) connected via pins (techniques) at the ends of the pair of chains, and (45) is an internal lower mold connected to the movable platen (5). , a link plate (41a) of a pair of lower guides (4η) and a pair of guide holes (45a) into which upper guides (481) are fitted, and a pair of chains (4), as shown in FIGS. 4 and 5. It has a pair of grooves (45b) for arranging the bolts (07) and (the fence is the internal lower mold temperature).
49 and ω, the chain (411 rollers (41
a pair of lower guides and a pair of upper guides each having guide parts (47a) and (48a) for guiding the chain (47a) and (48a). A pair of arcuate sliding paths 61) are formed on which the rollers (41b) of ) slide as shown in FIG. An external lower mold having a pair of cylinder holes (46a) into which the plunger (431) is slid, and a through hole (46b) into which the rod part (43a) is inserted;
The movable platen (
5) It is also connected to the internal lower mold holder. (Foundation)
A pair of end plates are connected to the end faces of the inner lower mold holder and the outer lower mold (461), and have a groove (54a) in which the link plate (41a) of the chain (41) is placed.

(to) is an end plate that is connected to the end surface of the inner lower mold (machine) via bolts ω, and has passages (55a) of the rod (4), and is divided into two parts around the rod q Route 511
etc. openings are closed. 69 is a joint that is connected to the end plate and communicates between the inside and outside, 69 is a filter that cleans air from an air source (not shown), 69 is a regulator that controls the air pressure, and 69 is a solenoid valve. (61J
is a flow controller that controls the flow rate, and the trowel is a tube that supplies air to the joint, which connects the flow controller (61J and the joint mark).

In the structure as described above, when the movable platen (5) rises and the outer lower mold joint is joined to the upper mold (7), the AC servo motor is driven and the
31, Bell) (241 (521, Pulley (2) ■, 1st
A pair of ball screw shafts (to) are rotated via the coupling (2) of the gear (2) and the second gear @-rotary shaft. in this case,
Since the ball screw shaft field is rotatably supported by the bearing box (to), the ball screw shaft continues to rotate, but since the pair of nuts are engaged with the guide rail ■, the ball screw shaft continues to rotate. A pair of nuts (■) move forward according to the rotation of (■). Therefore, a pair of rods (4) are displaced into the sliding path 6D, and a pair of chains (411) are displaced into a pair of plungers (
Raise 43. That is, each pair of rods (40)
, pin (42), chain (411, pin (44J, rod part (43a), plunger (through 0, tablet l)
-Q6) is press-fitted into the external lower mold position and upper mold (7).

On the other hand, when sealing a semiconductor element with resin, it is necessary to heat the tablet (161), so the lower external mold position and the lower internal mold position become high temperature - this heat is transferred to the chain +41. This will reduce the life of the chain (411), but in the vicinity of the slideway 6D, connect the filter, regulator, solenoid valve, flow controller (61), tube (mouth, joint (support)) from the air source. Air is supplied through the slideway (5
11, the through hole (46b) and the cylinder hole (462), and the chain (41) is reliably cooled intensively.

Note that the air passage may be configured to be discharged on the way to the cylinder hole (46a) in the sliding path 6D.

By the way, the displacement direction of the plunger (43) can be set at an appropriate angle by appropriately determining the arc size of the chain (41J) with respect to the horizontal displacement of the nut.

Furthermore, by making the circular arc dimensions of the pair of sliding paths 61) the same, one sliding path 6D has the same or similar shape, and by arranging the pair of chains (41) in parallel, the inside of the sliding path 511 is lower. It facilitates the processing of gold u+451.

On the other hand, the lower guide (471) and upper guide (481) that form the slideway elevation are individually processed in advance, and the internal lower mold +451
+49) ω, so each guide (4
7 (48) roller (41b) guide part (47a) (4
8a) (7) Machining becomes easier - and the chain (41
Even if the size of J is changed, each guide f47) +
It is only necessary to replace 481, and it can also be used as an internal lower mold stop.

In addition, the guide hole (45a) of the inner lower bracket and U+a is located on the end plate (
Since the configuration is sealed with the guide hole (451)
can be easily processed by electric discharge machining or milling.

By the way, in the above explanation, the angle between the displacement direction of the plunger +43 and the displacement direction of the nut (3ω) is 90 degrees, and the number of plungers is two, but the angle and the number of plungers are each particularly limited. It's not a thing.

In addition, a chain (4υ driven by a ball screw shaft ■ and a nut ■), a plunger (43
However, the driving means is not limited to this, and a chain (corresponding to 41J, for example, a wire) can also have the same effect.

〔Effect of the invention〕

As described above, the present invention provides an upper mold and a lower mold for housing a semiconductor element, a plunger for press-fitting a resin into the upper mold and the lower mold to seal the semiconductor element, and a reciprocating movement of the plunger. movable reciprocating means; a flexible transmission member connecting the output portion of the reciprocating means with the plunger and transmitting the reciprocating driving force of the reciprocating means to the plunger; and the upper mold and the Since a ventilation means for passing cooling air is provided in the sliding path of the transmission member in the lower mold, the driving direction of the reciprocating means can be configured as appropriate with respect to the plunger, and the space of the device can be selected. Since the reciprocating means can be arranged, the space of one device can be used effectively.

Furthermore, when the mold dimensions are different, only the length of the transmission member needs to be changed, and there is an advantage that it can also be used as a reciprocating means.

Furthermore, the flexible transmission member is intensively cooled by the ventilation means, which has the effect of improving the life of the transmission member itself.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing one embodiment of the present invention, FIG. 2 is a configuration diagram showing its drive system, FIG. 3 is a plan view of the reciprocating means of the invention, and FIG. − Cross-sectional view along ■ line −
5 is a sectional view taken along line V-■ in FIG. 4, FIG. 6 is a perspective view of the chain, FIG. 7 is a perspective view of essential parts of the invention, and FIG.
The figure is a side view of a conventional device. In the figure - (7) is the upper mold -
161 is a tablet, (331 is a ball screw shaft - 〇91
is a nut, (40 is a rod, (41) is a chain, (4
J is the plunger, (the fence is the internal lower mold, (40 is the external lower mold - Q is the end plate, the mark is the joint, the side is the filter (59) is the regulator, ((to) is the solenoid valve - +611 is the flow controller ((Support) is a tube. The same reference numerals in each figure indicate the same or corresponding parts. Agent Masuo Oiwa Figure 1 Figure 2 Figure 4 SJ 45achi 549 Figure 5 Figure 6 Figure 7 - 111111111

Claims (1)

[Claims] An upper mold and a lower mold for housing the semiconductor element, a plunger for press-fitting resin into the upper mold and the lower mold to seal the semiconductor element, and a reciprocating device having an output part capable of reciprocating the plunger. a flexible transmission member that connects the output part of the reciprocating means with the plunger and transmits the reciprocating driving force of the output part to the plunger; A resin sealing device for a semiconductor element, comprising a ventilation means for blowing cooling air into the sliding path of the transmission member.