JPS63198060A - Dust-proof container - Google Patents
Dust-proof containerInfo
- Publication number
- JPS63198060A JPS63198060A JP62029803A JP2980387A JPS63198060A JP S63198060 A JPS63198060 A JP S63198060A JP 62029803 A JP62029803 A JP 62029803A JP 2980387 A JP2980387 A JP 2980387A JP S63198060 A JPS63198060 A JP S63198060A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- pressing
- pressure
- dust
- shape memory
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 68
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims abstract description 22
- 238000003825 pressing Methods 0.000 claims abstract description 20
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 239000000428 dust Substances 0.000 abstract description 10
- 239000004065 semiconductor Substances 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 description 3
- 239000000696 magnetic material Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- 241000257465 Echinoidea Species 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67353—Closed carriers specially adapted for a single substrate
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
- G03F7/70741—Handling masks outside exposure position, e.g. reticle libraries
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67359—Closed carriers specially adapted for containing masks, reticles or pellicles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Library & Information Science (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野コ
本発明は、ＬＳＩ等の半導体回路を製造するためのレチ
クル、フォトマスクまたはウニ八等の基板を収納する防
塵容器に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a dust-proof container for storing a reticle, a photomask, or a substrate such as a sea urchin for manufacturing semiconductor circuits such as LSI.
近年の半導体素子の集積度の向上により、基板に付着し
た微細な塵埃の影響で半導体素子の製造の歩留が悪化す
る。これを防止するために、基板を防塵容器に収納し、
また基板の焼付位置までの栄送を自動化し、さらに容器
からの基板の取り出しを無人化している。As the degree of integration of semiconductor devices has increased in recent years, the production yield of semiconductor devices has deteriorated due to the influence of fine dust adhering to substrates. To prevent this, store the board in a dust-proof container and
Additionally, the transport of the substrates to the printing position is automated, and the removal of the substrates from the container is automated.
［従来技術］
半導体製造プロセスで用いるレチクル等の基板は、従来
単に密閉容器内の搭載支持部材上に載置して収容してい
た。しかしながら、このような容器では基板が固定され
ていないため容器穆動時の振動、衝撃等により基板が損
傷したり、また容器内で塵埃が発生してパターン精度に
悪影響を及ぼすおそれがあった。[Prior Art] Conventionally, a substrate such as a reticle used in a semiconductor manufacturing process has been simply placed and housed on a mounting support member in a closed container. However, in such a container, since the substrate is not fixed, there is a risk that the substrate may be damaged by vibrations, shocks, etc. when the container is moved, and dust may be generated within the container, adversely affecting pattern accuracy.
このような不具合を解消するため基板の固定保持手段を
備えた防塵容器が提案されている。このような防塵容器
は、基板の自動取出しを可能とするため基板の固定保持
を解除する機構が必要である。従来の防塵容器は、下皿
および上蓋からなる筺体において、下皿の搭載部材上に
基板を載置し、上蓋を閉じると上蓋内面に回動可能に設
けた剛体の押え部材がリンク、コイルスプリング等を介
して基板を押圧する構造であった。この従来の押え部材
は、前記リンク機構およびコイルスプリングを介して筺
体前面の基板自動取出し用の扉に連結され、扉の開放動
作に連動して押え部材を機械的に引張って押え部材を回
動させ基板との係合を解除する構造であった。In order to solve this problem, a dustproof container equipped with means for fixing and holding the substrate has been proposed. Such a dustproof container requires a mechanism for releasing the fixed holding of the substrate in order to enable automatic removal of the substrate. Conventional dustproof containers have a housing consisting of a lower tray and an upper lid. When the board is placed on the mounting member of the lower tray and the upper lid is closed, a rigid holding member rotatably provided on the inner surface of the upper lid is linked and a coil spring is attached. The structure was such that the substrate was pressed through the This conventional holding member is connected to a door for automatic board removal on the front of the housing through the link mechanism and coil spring, and rotates by mechanically pulling the holding member in conjunction with the opening operation of the door. It was designed to release the engagement with the substrate.
［発明が解決しようとする問題点コ
しかしながら、このような従来の防塵容器においては、
押え部材が回動構造であるため、回転軸部分の機械的摩
擦により微細な塵埃が発生し、またリンク機構およびコ
イルバネの連結部の機械的摩擦およびコイルバネの伸縮
時の振動、衝撃等により塵埃が発生して基板に付着し、
パターンの精度に悪影響を及ぼし品質の低下を来してい
た。[Problems to be solved by the invention]However, in such conventional dustproof containers,
Since the holding member has a rotating structure, fine dust is generated due to mechanical friction of the rotating shaft part, and dust is also generated due to mechanical friction of the link mechanism and the connection part of the coil spring, and vibrations and shocks when the coil spring expands and contracts. generated and attached to the substrate,
This had a negative effect on the accuracy of the pattern, resulting in a decline in quality.
本発明は前記従来技術の欠点に鑑みなされたものであっ
て、機械的摺接部をなくした基板押圧・抑圧解除手段を
設けることにより、容器内での塵埃の発生を防止し半導
体製品の歩留の向上を図った防塵容器の提供を目的とす
る。The present invention has been made in view of the drawbacks of the prior art, and by providing a substrate pressing/suppressing release means that eliminates mechanical sliding parts, it prevents the generation of dust in the container and improves the speed of semiconductor products. The purpose is to provide a dustproof container with improved dust retention.
［問題点を解決するための手段および作用］上記の目的
を達成するため、本発明に係る防塵容器は、その内部に
基板搭載用支持部材および筺体内に収容した基板をこの
支持部材側に押圧しまたはその押圧を解除する抑圧・押
圧解除手段を備え、押圧・押圧解除手段を外部信号によ
って制御することとしている。[Means and effects for solving the problem] In order to achieve the above object, the dustproof container according to the present invention has a support member for mounting a board inside the container and a board accommodated in the housing that is pressed toward the support member. The device is provided with a suppression/pressure release means for releasing the pressure and the pressure, and the pressure/pressure release means is controlled by an external signal.
これにより、筺体内に収容した基板は通常は抑圧手段に
より保持され、基板を搬入・搬出したい場合等は外部信
号でこの抑圧を解除することにより基板の保持を解除で
きる。As a result, the substrate accommodated in the housing is normally held by the suppressing means, and when the substrate is to be carried in or out, the holding of the substrate can be released by canceling this suppression using an external signal.
この押圧解除機構は、押圧解除時にバネ部材を基板から
離隔させる方向に変形する形状記憶合金等で構成すれば
、この形状記憶合金等に電流を流す等により押圧を解除
でき便宜である。It is convenient if the pressure release mechanism is made of a shape memory alloy or the like that deforms in the direction of separating the spring member from the substrate when the pressure is released, since the pressure can be released by passing an electric current through the shape memory alloy or the like.
［実施例］
第１図は本発明に係る防塵容器の開いた状態の斜視図で
あり、第２図はその閉じた状態の要部構成断面図である
。上Ｍ１および下皿２により密閉筺体３が構成される。[Example] FIG. 1 is a perspective view of a dustproof container according to the present invention in an open state, and FIG. 2 is a sectional view of the main part configuration in a closed state. The upper M1 and the lower plate 2 constitute a sealed housing 3.
上蓋１は下皿２に対し背面で開閉可能にヒンジ結合され
ている。上Ｍ１の前面には基板１０の自動出入れのため
の開口部４（第２図）が形成されている。この開口部４
を密封的に覆うための扉５が上蓋１にヒンジ結合されて
いる。扉５はバネ６により常に閉じる方向に付勢されて
いる。下皿２には基板搭載支持用の４木のピン９が突設
されている。また下皿２の内部の左右両側面および後面
には基板位置決め用のストッパ１１が設けられている。The upper lid 1 is hinged to the lower plate 2 at the back so that it can be opened and closed. An opening 4 (FIG. 2) for automatic insertion and removal of the substrate 10 is formed on the front surface of the upper M1. This opening 4
A door 5 for sealingly covering the top cover 1 is hinged to the top cover 1. The door 5 is always urged in the closing direction by a spring 6. Four wooden pins 9 for supporting mounting of a board are protruded from the lower plate 2. Further, stoppers 11 for positioning the substrate are provided on both left and right side surfaces and the rear surface of the inside of the lower plate 2.
レチクル等の基板１０はストツバ１１にガイドされてビ
ン９上に載置される。上蓋１および下皿２の外側の各側
面には弾発差込式の１対のロック部材７および８が取付
けられ上蓋１と下皿２とを結合する。上蓋１の内面には
、一端が上蓋側に固定された片持ち状の４木の基板押え
用板バネ１２が装着されている。各板バネ１２は、第２
図の実線で示すように、その自由端部側が下皿２内に収
容した基板１０を上からビン９側に押圧するように構成
されている。各板バネ１２には形状記憶合金からなる押
圧解除部材１３が係合している。押圧解除部材１３は略
Ｕ字形であって、先端部１３ｂが板バネ１２に当接し、
両板元部が上蓋側に固定された端子１３ａに接続されて
いる。各端子１３ａはパターン配線または適当な配線手
段１４により直列に接続され、あるいは上Ｍ１の外部側
面の電極端子１５に連結される。押圧解除部材１３を構
成する形状記憶合金は通常時は、第２図の実線で示すよ
うに、板バネ１２が基板１０に対し押圧力を付与するの
に支障のない形状とし、電極端子１５を介して電流を通
ずることにより上方に穆勤し板バネ１２を持ち上げて基
板１０から離隔させる形状（第２図点線）に変形するよ
うに設定しておく。A substrate 10 such as a reticle is guided by a stopper 11 and placed on a bin 9. A pair of snap-in locking members 7 and 8 are attached to each outer side surface of the upper lid 1 and the lower tray 2 to connect the upper lid 1 and the lower tray 2. A cantilever-shaped four-piece board holding leaf spring 12 with one end fixed to the upper lid side is attached to the inner surface of the upper lid 1. Each leaf spring 12 has a second
As shown by the solid line in the figure, the free end side is configured to press the substrate 10 housed in the lower tray 2 from above toward the bottle 9 side. Each leaf spring 12 is engaged with a pressure release member 13 made of a shape memory alloy. The pressure release member 13 is approximately U-shaped, and its tip 13b abuts against the leaf spring 12.
Both plate base portions are connected to a terminal 13a fixed to the upper lid side. Each terminal 13a is connected in series by pattern wiring or suitable wiring means 14, or connected to an electrode terminal 15 on the external side of the upper M1. Normally, the shape memory alloy constituting the pressure release member 13 has a shape that does not hinder the plate spring 12 from applying a pressing force to the substrate 10, as shown by the solid line in FIG. The plate spring 12 is set to be deformed into a shape (dotted line in FIG. 2) in which the plate spring 12 is lifted up and separated from the substrate 10 by passing an electric current through the plate spring 12.
以上のような構成の防塵容器に基板１０を収納して上蓋
１を閉じることにより基板１０は板バネ１２によりビン
９上に押圧されて固定保持される。このような防塵容器
は、例えば露光焼付装置等と連結された基板の自動着脱
機構内に複数段に積層されてセットされる。By storing the substrate 10 in the dust-proof container configured as described above and closing the upper lid 1, the substrate 10 is pressed onto the bottle 9 by the plate spring 12 and is fixedly held. Such dustproof containers are stacked and set in a plurality of stages in an automatic substrate attachment/detachment mechanism connected to, for example, an exposure/printing apparatus or the like.
基板の自動取出しを行なう場合には、形状記憶合金から
なる押圧解除部材１３に通電する。これにより形状記憶
合金が変形して、第２図点線のように、板バネ１２を基
板１０から離隔させ押圧力を解除する。この状態で５７
１５を開き（第２図点線）、自動搬入および排出機構（
図示しない）により容器内の基板１０を取出す。基板１
０の使用後、基板１ｏを再び容器内に自動収納する場合
には、形状記憶合金に通電した状態で容器内に基板１０
を挿入し、ピン９上に載置後電流を遮断すれば形状記憶
合金は実線の形状に戻り板バネ１２が再び基板１０を押
圧してピン９上に固定保持する。When automatically removing the substrate, the pressure release member 13 made of a shape memory alloy is energized. As a result, the shape memory alloy is deformed, and the plate spring 12 is separated from the substrate 10, as shown by the dotted line in FIG. 2, and the pressing force is released. 57 in this state
15 (dotted line in Figure 2), and open the automatic loading and unloading mechanism (
(not shown) to remove the substrate 10 from the container. Board 1
When the substrate 1o is automatically stored in the container again after use of the substrate 1o, the substrate 10 is placed in the container while the shape memory alloy is energized.
When the shape memory alloy is inserted and placed on the pin 9 and the current is cut off, the shape memory alloy returns to the shape of the solid line, and the plate spring 12 presses the substrate 10 again to fix and hold it on the pin 9.
なお、基板押圧手段である板バネ１２の個数、配置位置
、形状等は任意である。また、形状記憶合金の電極同士
の接続方法、電極端子取出位置等は任意であり、容器を
装着すべき装置構造に合せて最適な位置に電極端子１５
を設けることができる。Note that the number, arrangement position, shape, etc. of the plate springs 12 serving as the substrate pressing means are arbitrary. In addition, the connection method between the shape memory alloy electrodes, the electrode terminal extraction position, etc. are arbitrary, and the electrode terminal 15 is placed in the optimal position according to the structure of the device to which the container is attached.
can be provided.
例えば、第１図においては４個の形状記憶合金を直列に
接続し、その両端を２つの電極端子に引き出しているが
、各形状記憶合金の両端をそれぞれ２ケずつ計８ヶの電
極端子１５に引き出してもよく、あるいは第１図中点１
４ａの位置からさらに１つの電極端子１５へ配線を引き
出す等、必要な形状記憶合金にのみ選択的に通電可能と
するように端子１３ａ同士を接続配線することもできる
。For example, in FIG. 1, four shape memory alloys are connected in series, and both ends are drawn out to two electrode terminals, but each shape memory alloy is connected to two electrode terminals, two at each end, for a total of eight electrode terminals 15. You can also pull it out at the middle point 1 in Figure 1.
The terminals 13a can also be connected and wired so that electricity can be selectively applied only to the necessary shape memory alloy, such as by further drawing a wire from the position of 4a to one electrode terminal 15.
また、押圧解除部材１３に直接通電して動作させる代り
に、第３図のようにラバーヒータその他適当な加熱手段
２１を用いて押圧加熱手段を直接または容器外部から適
当な伝熱材を介して加熱してもよい。In addition, instead of operating the press release member 13 by directly applying current to it, as shown in FIG. May be heated.
また、第４図のように電流の通電に代えて赤外線等の熱
線２２を照射することにより押圧解除部材１３を動作さ
せてもよい。Further, as shown in FIG. 4, the pressure release member 13 may be operated by irradiating it with a heat ray 22 such as infrared rays instead of applying current.
さらに、前記実施例の形状記憶合金に代えて、第５図の
ようにバイメタル２３を用いて加熱時に板バネ１２を基
板から離隔させるように変形させてもよい。また、板バ
ネ１２自体をバイメタルで形成してもよい
また、第６図のように上蓋１側に基板１０を保持し、下
皿２側から板バネ２４により基板１０を押圧して固定保
持してもよいし、さらに第７図のように上Ｎ１および下
皿２の両方に板バネ２５．２５を設けて基板１０の両側
から基板１０を押圧保持してもよい。Furthermore, instead of the shape memory alloy of the above embodiment, a bimetal 23 may be used as shown in FIG. 5 to deform the leaf spring 12 so as to separate it from the substrate when heated. Alternatively, the plate spring 12 itself may be made of bimetal.Alternatively, as shown in FIG. 6, the board 10 may be held on the upper lid 1 side, and the board 10 may be pressed and fixed by the plate spring 24 from the lower plate 2 side. Alternatively, as shown in FIG. 7, leaf springs 25 and 25 may be provided on both the upper plate N1 and the lower plate 2 to press and hold the substrate 10 from both sides of the substrate 10.
さらに、第８図のようにピエゾ等のバイモルフまたはモ
ノモルフ素子２７を用いて通電時に板バネ１２を基板か
ら離隔させるように変形させてもよい。Furthermore, as shown in FIG. 8, a bimorph or monomorph element 27 such as a piezo may be used to deform the leaf spring 12 so as to separate it from the substrate when energized.
また、第９〜１１図のように磁力を用いることもできる
。第９図は基板１０の周囲に磁性材料製のパターン２８
を形成し、ピン９の代わりを永久磁石２９で構成したも
のである。この磁性材料製のパターン２８の代わりに基
板１０の周囲を磁性体で構成してもよい、磁石２９には
コイル３０が巻回されており、これに通電することによ
り磁石２９の磁力がコイル３０の電磁力により相殺され
る。これにより、基板１０の押圧および押圧解除を行な
うものである。Moreover, magnetic force can also be used as shown in FIGS. 9-11. FIG. 9 shows a pattern 28 made of magnetic material around the substrate 10.
The pin 9 is replaced by a permanent magnet 29. Instead of the pattern 28 made of magnetic material, the periphery of the substrate 10 may be made of a magnetic material.A coil 30 is wound around the magnet 29, and by energizing this, the magnetic force of the magnet 29 is transferred to the coil 30. is canceled out by the electromagnetic force. This allows the substrate 10 to be pressed and released.
第１０図は電磁石３１により板バネ１２を基板から離隔
させるように変形させるものである。In FIG. 10, the plate spring 12 is deformed by an electromagnet 31 so as to be separated from the substrate.
第１１図は、まずコイル３２に通電することにより永久
磁石３３の磁力を付勢して板バネ１２を吸着し基板ｌＯ
を押圧する。板バネ１２は通常の状態では基板１０から
離隔した位置にあるが、−電磁石３３に吸着されるとそ
の磁力により基板１０を保持し続ける。FIG. 11 shows that by first energizing the coil 32, the magnetic force of the permanent magnet 33 is energized to attract the leaf spring 12, and the substrate lO
Press. Although the plate spring 12 is in a position separated from the substrate 10 in a normal state, when it is attracted by the -electromagnet 33, it continues to hold the substrate 10 by its magnetic force.
押圧を解除する場合は、コイル３２により磁石３３の磁
力を相殺するようにすればよい。When the pressure is released, the magnetic force of the magnet 33 may be canceled out by the coil 32.
［発明の効果］
以上説明したように、本発明に係る防塵容器においては
、バネ材と形状記憶合金等により構成された押圧・押圧
解除手段を有し容器内の基板を押圧して固定保持してい
るため、機械的リンク機構等を介することなく確実に基
板を押圧することができる。また、形状記憶合金等を用
いれば、リンク機構、コイルスプリング等を介すること
なくバネ材の押圧力を解除することが可能となり、従来
のような機械的摩擦接触による塵埃の発生が防止され、
基板への塵埃付着によるパターン精度低下の問題がなく
なり製品の歩留が向上する。[Effects of the Invention] As explained above, the dustproof container according to the present invention has a pressing/pressing release means made of a spring material, a shape memory alloy, etc., and presses and holds the substrate in the container fixed. Therefore, the substrate can be reliably pressed without using a mechanical link mechanism or the like. In addition, by using shape memory alloys, etc., it becomes possible to release the pressing force of the spring material without using a link mechanism, coil spring, etc., which prevents the generation of dust due to mechanical friction contact as in the past.
The problem of pattern accuracy deterioration due to dust adhesion to the substrate is eliminated, and product yield is improved.
第１図は本発明に係る防塵容器の開いた状態の斜視図、
第２図は本発明に係る防塵容器の閉じた状態の要部断面
図、第３〜１１図は本発明に係る防塵容器の他の実施例
を示す要部断面−である。
１：上蓋、
２；下皿、
３：筺体、
９：ピン、
ｌＯ二基板、
１２：板バネ、
１３：押圧解除部材。
す
第 １ 図
第６図FIG. 1 is a perspective view of the dustproof container according to the present invention in an open state;
FIG. 2 is a cross-sectional view of a main part of the dust-proof container according to the present invention in a closed state, and FIGS. 3 to 11 are cross-sectional views of main parts showing other embodiments of the dust-proof container according to the present invention. 1: Upper lid, 2: Lower plate, 3: Housing, 9: Pin, 1O2 board, 12: Leaf spring, 13: Pressure release member. Figure 1 Figure 6
Claims (1)
容した基板を前記支持部材側に押圧しまたはその押圧を
解除する手段と、該押圧または押圧解除手段を外部信号
によって制御する手段とを具備したことを特徴とする防
塵容器。 ２、前記筺体が相互にヒンジ結合された下皿および上蓋
からなり、前記基板支持部材が該下皿または上蓋の一方
に設けられ、かつ前記押圧または押圧解除手段が該下皿
または上蓋の他の一方に設けられ前記基板を押圧するよ
うに構成したバネ部材および該バネ部材を基板から離隔
させるための押圧解除機構からなる特許請求の範囲第１
項記載の防塵容器。 ３、前記押圧解除機構が、押圧解除時に、前記バネ部材
を基板から離隔させる方向に変形する形状記憶合金から
なる特許請求の範囲第２項記載の防塵容器。 ４、前記制御手段が、前記形状記憶合金に電流を流すこ
とにより形状を変化させるように構成してある特許請求
の範囲第３項記載の防塵容器。 ５、前記制御手段が、前記形状記憶合金に熱線を照射す
ることにより形状を変化させるように構成してある特許
請求の範囲第３項記載の防塵容器。 ６、前記押圧解除機構が、押圧解除時に、前記バネ部材
を基板から離隔させる方向に変形するバイメタルまたは
バイモルフ素子からなる特許請求の範囲第２項記載の防
塵容器。 ７、前記バイメタルまたはバイモルフ素子が、バネ部材
を兼ねている特許請求の範囲第６項記載の防塵容器。 ８、前記バネ部材を複数個備え、各バネ部材に対応して
前記押圧解除手段を設けてある特許請求の範囲第２項か
ら第７項までのいずれか１項記載の防塵容器。 ９、前記筺体が相互にヒンジ結合された下皿および上蓋
からなり、前記基板支持部材が該下皿または上蓋の一方
に設けられており、前記押圧または押圧解除手段が磁力
を用いて前記基板を押圧しまたはその押圧を解除するも
のである特許請求の範囲第１項記載の防塵容器。[Scope of Claims] 1. A housing having a substrate support member inside, a means for pressing the substrate housed in the housing toward the support member or releasing the pressure, and a means for pressing or releasing the pressure from the outside. A dustproof container characterized by comprising means for controlling by a signal. 2. The housing consists of a lower plate and an upper cover that are hinged to each other, the substrate support member is provided on one of the lower plate or the upper cover, and the pressing or pressing release means is provided on the other side of the lower plate or the upper cover. Claim 1 comprising a spring member provided on one side and configured to press the substrate, and a pressure release mechanism for separating the spring member from the substrate.
Dust-proof container as described in section. 3. The dustproof container according to claim 2, wherein the pressure release mechanism is made of a shape memory alloy that deforms in a direction to separate the spring member from the substrate when the pressure is released. 4. The dustproof container according to claim 3, wherein the control means is configured to change the shape of the shape memory alloy by passing an electric current through the shape memory alloy. 5. The dustproof container according to claim 3, wherein the control means is configured to change the shape of the shape memory alloy by irradiating the shape memory alloy with heat rays. 6. The dustproof container according to claim 2, wherein the pressure release mechanism is made of a bimetal or bimorph element that deforms in a direction to separate the spring member from the substrate when the pressure is released. 7. The dustproof container according to claim 6, wherein the bimetal or bimorph element also serves as a spring member. 8. The dustproof container according to any one of claims 2 to 7, which includes a plurality of the spring members and includes the pressure release means corresponding to each spring member. 9. The housing comprises a lower plate and an upper lid that are hinged to each other, the substrate support member is provided on either the lower plate or the upper lid, and the pressing or pressing release means uses magnetic force to press the substrate. The dustproof container according to claim 1, which is configured to be pressed or released from pressure.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62029803A JPS63198060A (en) | 1987-02-13 | 1987-02-13 | Dust-proof container |
| US07/154,308 US4842136A (en) | 1987-02-13 | 1988-02-10 | Dust-proof container having improved construction for holding a reticle therein |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62029803A JPS63198060A (en) | 1987-02-13 | 1987-02-13 | Dust-proof container |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63198060A true JPS63198060A (en) | 1988-08-16 |
Family
ID=12286174
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62029803A Pending JPS63198060A (en) | 1987-02-13 | 1987-02-13 | Dust-proof container |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63198060A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005028339A1 (en) * | 2003-09-16 | 2005-03-31 | Dai Nippon Printing Co., Ltd. | Substrate containing case |
-
1987
- 1987-02-13 JP JP62029803A patent/JPS63198060A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005028339A1 (en) * | 2003-09-16 | 2005-03-31 | Dai Nippon Printing Co., Ltd. | Substrate containing case |
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