JPS6319789Y2 - - Google Patents

Description

[Detailed description of the invention] This invention relates to a device for measuring electrodeposition stress of electrodeposited metal in electroforming, in particular, a metal disk is electrodeposited on the surface as a cathode, and the electrodeposition stress is determined from the curvature of the metal disk. The present invention relates to an electrodeposition stress measuring device using the method.

Conventionally, there are various methods for measuring electrodeposition stress, but the methods that can be measured in real time and are not affected by the stirring of the plating solution in the electroforming bath are the spiral contractometer method and the stereometer method. It is. The spiral contract meter method is
As the name suggests, this is a method in which a strip-shaped plate wound in a helical shape is electrodeposited as a cathode, the helix is twisted by the stress of the electrodeposition, and the stress is determined by this screw. However, since electrodeposition starts from the periphery of the spiral cathode, unless the anode and cathode are positioned in such a way that the anode surrounds the cathode, the electric field will not be uniform with respect to the cathode, resulting in different amounts of electrodeposition at each part. However, since accurate stress cannot be measured, it could not be used in an actual electroforming bath. On the other hand, in the stereosometer method, a container filled with a measuring liquid is covered with a thin smooth metal disc, and the disc and container are tightly fixed so that there are no gaps. A capillary tube is attached to the measuring surface of the container, and the minute curvature of the metal disc allows the measured liquid in the container to move up and down in the capillary tube.

The metal disk thus installed is electrodeposited on the surface as a cathode, and when the disk becomes convex or concave due to the stress, the liquid level in the capillary rises and falls. Electrodeposition stress can be determined from the distance over which the liquid level in the capillary rises and falls. However, since the stereosometer method uses a capillary measuring liquid, it is extremely troublesome to replace the metal disk, and if the metal disk is not properly attached, the measuring liquid may get mixed into the plating liquid. There were some drawbacks.

Furthermore, the container filled with the measuring liquid is placed in the plating liquid, but since the temperature of the plating liquid is usually set at 40 to 60°C, the measuring liquid and the container filled with the measuring liquid are placed in the plating liquid. The drawback was that the capillary liquid level fluctuated due to thermal expansion until it reached the liquid temperature.

The purpose of this invention is to provide an electrodeposition stress measuring device that eliminates the above-mentioned drawbacks.

The electrodeposition stress measuring device of this invention includes a metal plate, a transducer that converts the displacement in the thickness direction of the metal plate into an electric signal, a container in which the transducer is housed, and an opening of the container. a removable lid having an opening for enclosing the end with the metal plate; It is configured to be installed inside the container.

Next, this invention will be explained in detail with reference to the drawings.

The figure is a sectional view showing an embodiment of the electrodeposition stress measuring device of this invention. Metal disk 1 is O-ring 4
It is secured to container 2 with a lid 3.
On the back side of the metal disk 1 is a transducer (in this embodiment, an electric micro, also known as a differential transformer) is used to electrically convert the displacement in the thickness direction of the metal disk.
5 is provided. A lead wire 6 comes out from the metal disk 1, and the metal disk 1 is used as a cathode to connect the lid 3.
electrodeposited into the opening of the The metal disk is bent in the thickness direction due to the electrodeposition stress, and the metal disk is converted into electricity by the transducer 5. The inside of the container 2 communicates with the atmosphere outside the plating tank through a ventilation hole 7 and a ventilation pipe 8.

Although not shown, the lead wire of the transducer 5 passes through the ventilation pipe 8 and is connected to the display circuit. By ventilating the inside of the container 2 with the atmosphere as in this configuration, the inside of the container is always maintained at atmospheric pressure, so the pressure inside the container 2 changes due to temperature changes when this device is placed in a plating tank. does not occur. Therefore, there is no problem of initial temperature changes as seen with stereosometers, and measurements can be taken immediately after being placed in a plating bath. Further, since the electrodeposition is performed on the metal disk 1, a special anode structure unlike a spiral contract meter is not required. Furthermore, it is easy to use because the measurement results are obtained as electrical output without using a measuring liquid like a stereometer.

Since the inside of this device is always kept in the atmosphere, when this device is placed in a plating solution, the bending displacement of the metal disk due to the water pressure of the plating solution is output.
Therefore, by measuring the water depth, we can find the sensitivity of the bending displacement of the metal disk to pressure.
This also has the effect of allowing initial sensitivity measurements to be made at the same time.

In the above embodiment, the transducer is attached to the partition plate 10 provided inside the container, but it may also be attached directly to the inner wall of the container, for example, the side wall 9 or the bottom. In this case, the structure will be simpler than the embodiment.

The transducer is not limited to the embodiments, and may be any device as long as it converts displacement into an electrical signal, such as a piezoelectric element or a strain gauge.

Further, when the transducer is installed inside the container, the object of the invention can be achieved even if it is attached directly to a metal plate.

[Brief explanation of the drawing]

The figure is a sectional view showing an embodiment of the electrodeposition stress measuring device of this invention. In the figure, 1 is a metal disk for electrodeposition, 2 is a container, 3 is a lid, 4 is an O-ring,
5 represents a transducer, 6 represents a cathode lead wire, 7 represents a ventilation hole, and 8 represents a ventilation pipe.

Claims (1)

[Scope of utility model registration request] A metal plate that is placed in a plating solution in a plating bath and receives electrodeposition only on one side as a cathode, a transducer that converts the displacement in the thickness direction of the metal plate into an electric signal, and the transducer. It comprises a container to be stored inside, and a removable lid having an opening for sealing an open end of the container with the metal plate, and a surface of the metal plate inside the container is plated. An electrodeposition stress measuring device characterized in that the container is provided with a ventilation pipe for communicating with the atmosphere outside the tank.