JPS63197362U - - Google Patents
Info
- Publication number
- JPS63197362U JPS63197362U JP1987088786U JP8878687U JPS63197362U JP S63197362 U JPS63197362 U JP S63197362U JP 1987088786 U JP1987088786 U JP 1987088786U JP 8878687 U JP8878687 U JP 8878687U JP S63197362 U JPS63197362 U JP S63197362U
- Authority
- JP
- Japan
- Prior art keywords
- bonded
- lead frame
- optical coupling
- light emitting
- light receiving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W72/536—
-
- H10W72/5363—
-
- H10W90/756—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987088786U JPH0651001Y2 (ja) | 1987-06-08 | 1987-06-08 | 光結合素子 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987088786U JPH0651001Y2 (ja) | 1987-06-08 | 1987-06-08 | 光結合素子 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63197362U true JPS63197362U (OSRAM) | 1988-12-19 |
| JPH0651001Y2 JPH0651001Y2 (ja) | 1994-12-21 |
Family
ID=30947194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987088786U Expired - Lifetime JPH0651001Y2 (ja) | 1987-06-08 | 1987-06-08 | 光結合素子 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0651001Y2 (OSRAM) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3356069B2 (ja) * | 1998-07-29 | 2002-12-09 | 松下電器産業株式会社 | チップ型発光装置 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61159746A (ja) * | 1985-01-08 | 1986-07-19 | Kyodo Printing Co Ltd | Ｉｃモジユ−ルのワイヤボンデイング方法 |
| JPS62123727A (ja) * | 1985-11-25 | 1987-06-05 | Hitachi Ltd | 半導体装置 |
| JPS63219131A (ja) * | 1987-03-06 | 1988-09-12 | Nec Yamagata Ltd | 半導体装置の製造方法 |
-
1987
- 1987-06-08 JP JP1987088786U patent/JPH0651001Y2/ja not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61159746A (ja) * | 1985-01-08 | 1986-07-19 | Kyodo Printing Co Ltd | Ｉｃモジユ−ルのワイヤボンデイング方法 |
| JPS62123727A (ja) * | 1985-11-25 | 1987-06-05 | Hitachi Ltd | 半導体装置 |
| JPS63219131A (ja) * | 1987-03-06 | 1988-09-12 | Nec Yamagata Ltd | 半導体装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0651001Y2 (ja) | 1994-12-21 |