JPS63193884U - - Google Patents
Info
- Publication number
- JPS63193884U JPS63193884U JP8607487U JP8607487U JPS63193884U JP S63193884 U JPS63193884 U JP S63193884U JP 8607487 U JP8607487 U JP 8607487U JP 8607487 U JP8607487 U JP 8607487U JP S63193884 U JPS63193884 U JP S63193884U
- Authority
- JP
- Japan
- Prior art keywords
- main component
- alumina ceramic
- ceramic substrate
- copper conductor
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 229910021332 silicide Inorganic materials 0.000 claims description 3
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims description 3
- 239000002356 single layer Substances 0.000 claims 1
Landscapes
- Non-Adjustable Resistors (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Description
第１図は本考案の一実施例に於ける混成集積回
路基板の断面図、第２図はチツプジヤンパーを用
いた従来の混成集積回路基板の断面図、第３図は
絶縁体層を介して形成された銅導体の多層配線と
絶縁体層上に形成された珪化物を主成分とする抵
抗体からなる混成集積回路基板の断面図である。
１……アルミナセラミツク基板、２……銅導体
、３……珪化物を主成分とする抵抗体、４……オ
ーバーコート層。
Fig. 1 is a cross-sectional view of a hybrid integrated circuit board according to an embodiment of the present invention, Fig. 2 is a cross-sectional view of a conventional hybrid integrated circuit board using chip jumpers, and Fig. 3 is a cross-sectional view of a conventional hybrid integrated circuit board using a chip jumper. FIG. 2 is a cross-sectional view of a hybrid integrated circuit board comprising a multilayer wiring of copper conductors and a resistor mainly composed of silicide formed on an insulating layer. DESCRIPTION OF SYMBOLS 1... Alumina ceramic substrate, 2... Copper conductor, 3... Resistor whose main component is silicide, 4... Overcoat layer.
Claims (1)
する多層配線の銅導体を形成し、この基板の単層
銅導体配線部のアルミナセラミツク基板上に珪化
物を主成分とする抵抗体を設けて厚膜回路を構成
したことを特徴とする混成集積回路基板。 A multilayer copper conductor with copper as a main component is formed on one side of an alumina ceramic substrate, and a resistor with a silicide as a main component is provided on the alumina ceramic substrate of the single layer copper conductor wiring portion of this substrate to form a thick film. A hybrid integrated circuit board characterized by comprising a circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8607487U JPS63193884U (en) | 1987-06-02 | 1987-06-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8607487U JPS63193884U (en) | 1987-06-02 | 1987-06-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63193884U true JPS63193884U (en) | 1988-12-14 |
Family
ID=30942052
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8607487U Pending JPS63193884U (en) | 1987-06-02 | 1987-06-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63193884U (en) |
-
1987
- 1987-06-02 JP JP8607487U patent/JPS63193884U/ja active Pending
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