JPS63193875U - - Google Patents
Info
- Publication number
- JPS63193875U JPS63193875U JP8516787U JP8516787U JPS63193875U JP S63193875 U JPS63193875 U JP S63193875U JP 8516787 U JP8516787 U JP 8516787U JP 8516787 U JP8516787 U JP 8516787U JP S63193875 U JPS63193875 U JP S63193875U
- Authority
- JP
- Japan
- Prior art keywords
- board
- cutting
- groove
- hard
- thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000011889 copper foil Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8516787U JPS63193875U (US07122547-20061017-C00224.png) | 1987-05-29 | 1987-05-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8516787U JPS63193875U (US07122547-20061017-C00224.png) | 1987-05-29 | 1987-05-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63193875U true JPS63193875U (US07122547-20061017-C00224.png) | 1988-12-14 |
Family
ID=30940326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8516787U Pending JPS63193875U (US07122547-20061017-C00224.png) | 1987-05-29 | 1987-05-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63193875U (US07122547-20061017-C00224.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017022183A (ja) * | 2015-07-07 | 2017-01-26 | 矢崎総業株式会社 | 電子部品ユニット用基板、及び、電子部品ユニット |
| JP2018182215A (ja) * | 2017-04-20 | 2018-11-15 | 日本シイエムケイ株式会社 | リジッド・フレックス多層プリント配線板の製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5388157A (en) * | 1977-01-13 | 1978-08-03 | Matsushita Electric Ind Co Ltd | Printed circuit board |
| JPS6355568B2 (US07122547-20061017-C00224.png) * | 1982-08-16 | 1988-11-02 | Shimizu Construction Co Ltd |
-
1987
- 1987-05-29 JP JP8516787U patent/JPS63193875U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5388157A (en) * | 1977-01-13 | 1978-08-03 | Matsushita Electric Ind Co Ltd | Printed circuit board |
| JPS6355568B2 (US07122547-20061017-C00224.png) * | 1982-08-16 | 1988-11-02 | Shimizu Construction Co Ltd |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017022183A (ja) * | 2015-07-07 | 2017-01-26 | 矢崎総業株式会社 | 電子部品ユニット用基板、及び、電子部品ユニット |
| JP2018182215A (ja) * | 2017-04-20 | 2018-11-15 | 日本シイエムケイ株式会社 | リジッド・フレックス多層プリント配線板の製造方法 |
