JPS6319170B2 - - Google Patents

Info

Publication number
JPS6319170B2
JPS6319170B2 JP16691682A JP16691682A JPS6319170B2 JP S6319170 B2 JPS6319170 B2 JP S6319170B2 JP 16691682 A JP16691682 A JP 16691682A JP 16691682 A JP16691682 A JP 16691682A JP S6319170 B2 JPS6319170 B2 JP S6319170B2
Authority
JP
Japan
Prior art keywords
heat
temperature
pot
temperature sensing
support member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP16691682A
Other languages
Japanese (ja)
Other versions
JPS5955224A (en
Inventor
Yasumichi Kobayashi
Yukio Hayashida
Shigeharu Nakamoto
Haruo Terai
Masaki Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP16691682A priority Critical patent/JPS5955224A/en
Publication of JPS5955224A publication Critical patent/JPS5955224A/en
Publication of JPS6319170B2 publication Critical patent/JPS6319170B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Control Of Resistance Heating (AREA)
  • Cookers (AREA)
  • Thermally Actuated Switches (AREA)

Description

【発明の詳細な説明】[Detailed description of the invention]

産業上の利用分野 本発明は加熱調理機器分野における鍋底温度を
検出する感温装置に関するものである。 従来例の構成とその問題点 従来、鋳込型ヒータ等の中央部に設けた感温装
置で特定の鍋の鍋底温度を検出している例がいく
つか見られるが、周囲のヒータが高温になると、
どの感温装置においても鍋底温度を満足に検出で
きず、周囲のヒータの影響を受けて実際の鍋底温
度以上に判断してしまい、実用に供する感温装置
はなかつた。 発明の目的 本発明は発熱体中央部に設けても利用可能な鍋
底温度検出用感温装置を提供するものである。 発明の構成 本発明による加熱調理器用感温装置は感熱部で
ある感温素子に鍋底の温度を正確に伝える構成を
とつており、感温素子を保持する熱伝導性の悪い
セラミツクス等の耐熱支持部材の上部を包含する
熱伝導性の良い熱伝導体内部に感温素子を併せて
包含し、耐熱支持部材を介して熱伝導体上部を鍋
底に接する接触板にバネ材で押圧しており、鍋底
の熱を熱伝導体から耐熱支持部材上部に伝え、感
温素子を鍋底の熱で包含し正確な熱伝達をしてい
るとともに、外周で垂下する円筒を設けた接触板
の円筒部で側部からのヒータの輻射熱を遮り、感
温素子がヒータからの直接の熱の影響を受けない
ようにしたものである。 実施例の説明 以下、本発明の実施例を第1図、第2図を参照
して説明する。第1図は鍋のない場合の構成例で
あり、渦巻き状シーズヒータ1を保持する支持金
具2に感温装置3が固定され、シーズヒータ1に
対する感温装置3の接触板4の位置決めがされて
いる。受熱兼感温装置3全体の保護カバー兼シー
ズヒータ1からの輻射熱遮断用の接触板4に皿バ
ネで構成したバネ材5により熱伝導性の悪い耐熱
支持部材6のフランジ部を介して熱伝導性の良い
熱伝導体7を押圧している。耐熱支持部材6に保
持され、耐熱性支持部材6と熱伝導体7に包含さ
れて、温度検出部である感温素子8が構成されて
いる。バネ材5を保持する保持筒9は内筒10と
接触板4に上部フランジ部を挾持されており、内
筒10も同様にフランジ部外周で接触板4の折曲
げ舌部数箇所によりかしめられ固定されている。
内筒10は有底の外筒11と摺動自在で、内筒1
0の下端部において動きを制限されている。保持
筒9は外筒11の底部に保持されるコイルスプリ
ング12により上方に押上げられている。 第2図は鍋13が載置された場合の構成を示し
ている。この場合、前記コイルスプリング12が
圧縮されて接触板4が下がり、シーズヒータ1と
同一面になり鍋13の底に接する。 以下、鍋13の底の温度の検出動作を第2図を
参照しながら説明する。第2図において赤熱する
シーズヒータ1からの熱は輻射と伝達があり、輻
射熱では接触板4の外周で垂下する円筒部ならび
に外筒11が加熱され、伝達熱では支持金具2を
通して外筒11が加熱される。一方鍋13の底は
シーズヒータ1と接触している面以外では水が鍋
13にはいつている場合、ほぼ水温に近い。よつ
て、感温装置3の接触板4の鍋13の底と接して
いる面以外の外面はすべて鍋13の底より高温と
なつている。接触板4は鍋13の底の温度をより
正確に拾うため、上向きに凸で曲率半径が1600mm
以上の穏やかな曲面で構成し、鍋13との接触面
積を広くとつている。また、外周で垂下する円筒
部を設け、シーズヒータ1からの輻射熱を遮つて
いる。外周部が非常に高温に加熱されるため、耐
熱性を考慮してステンレス材を用いている。さら
に鍋13の底の温度を感温素子8に伝えるため上
下方向の熱を良好に伝える必要性があり、板厚を
0.6mm以下に押えている。板厚が薄いため水平方
向には熱が伝わりにくく、また周囲からの熱は鍋
13との接触部で鍋13に伝えられ中心部に伝わ
りにくい構成となつている。次に熱伝導体7は接
触板4と接して鍋13の底の温度を感温素子8に
伝えるため、接触板4と接する面をフランジ構成
をとつて広くし、下部は応答性を上げるため径を
小さくして熱容量を小さく構成している。熱伝導
体7は感温素子8をセラミツクス等で構成した耐
熱支持部材6とともに包み込み、感温素子8も雰
囲気温度を鍋13の底の温度に近づけている。 また、耐熱支持部材6は下方において外筒11
と近いため、シーズヒータ1の熱を受け易く加熱
されるので、熱伝導体7で耐熱支持部材6の上部
を包み込む構成をとつており、耐熱支持部材6と
感温素子8を同時に鍋13の底の温度に近づけよ
うとする構成となつている。熱伝導体7の材質は
耐熱性、耐腐食性、良熱伝導性を考慮してアルミ
としている。耐熱支持部材6を介して熱伝導体7
を接触板4に押圧しているバネ材5は保持してい
る保持筒9の高さが大きくならないようにステン
レスの皿バネで構成し、シーズヒータ1で加熱さ
れている外筒11の底面からの輻射熱の影響を受
けない目的で近づかないように考慮し、全体形状
を小さく構成している。さらに、保持筒9は内筒
10と同心筒で且つフランジ端部のみで接触して
いるため外部の熱は比較的受けにくく、感温素子
8と外部とを空間的に遮断しているため感温装置
3内部での対流による熱移動を遮断して、外筒1
1の底面ならびに内筒10から感温素子8に向か
う熱を防いでいる。以上の熱伝達メカニズムによ
り、感温装置3は鍋13の底の温度を正確に検出
できる。 実施例の構成を用いて、水を沸かした場合の各
部の昇温曲線を第3図に示す。なお、第3図にお
いて、イは水温、ロは感温素子温度、ハは外筒底
面温度、ニは接触板外周で垂下する円筒部の温度
をそれぞれ示している。接触板4の外周で垂下す
る円筒部ならびに外筒11の底面部に代表される
感温装置3の外壁部の温度が高いにもかかわら
ず、感温素子8の温度は水温とほぼ平行になつて
おり、鍋13の底の温度を正確に拾つていること
がわかる。第3図の実験条件の主なものは第1表
の通りである。
INDUSTRIAL APPLICATION FIELD The present invention relates to a temperature sensing device for detecting the bottom temperature of a pot in the field of cooking equipment. Conventional configurations and their problems In the past, there have been some examples in which the temperature at the bottom of a specific pot is detected using a temperature sensing device installed in the center of a cast-in type heater, etc. Then,
None of the temperature-sensing devices could satisfactorily detect the bottom temperature of the pot, and was influenced by the surrounding heaters and judged to be higher than the actual bottom temperature, so no temperature-sensing device could be put to practical use. OBJECTS OF THE INVENTION The present invention provides a temperature sensing device for detecting the temperature at the bottom of a pot, which can be used even if it is installed in the center of a heating element. Composition of the Invention The temperature-sensing device for a cooking appliance according to the present invention is configured to accurately transmit the temperature of the bottom of the pot to the temperature-sensing element, which is the heat-sensing part, and includes a heat-resistant support such as ceramics with poor thermal conductivity to hold the temperature-sensing element. A temperature sensing element is also included inside a heat conductor with good thermal conductivity that includes the upper part of the member, and the upper part of the heat conductor is pressed by a spring material to a contact plate in contact with the bottom of the pot via a heat resistant support member. The heat from the bottom of the pot is transferred from the heat conductor to the top of the heat-resistant support member, and the temperature sensing element is surrounded by the heat from the bottom for accurate heat transfer. This prevents the temperature sensing element from being affected by direct heat from the heater by blocking the radiant heat from the heater. DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 and 2. FIG. 1 shows a configuration example without a pot, in which a temperature sensing device 3 is fixed to a support fitting 2 that holds a spiral sheathed heater 1, and a contact plate 4 of the temperature sensing device 3 is positioned with respect to the sheathed heater 1. ing. The contact plate 4, which serves as a protective cover for the entire heat-receiving and temperature-sensing device 3 and blocks radiant heat from the sheathed heater 1, conducts heat through the flange portion of the heat-resistant support member 6, which has poor thermal conductivity, by a spring member 5 made of a disc spring. The thermal conductor 7, which has good properties, is pressed. A temperature sensing element 8 serving as a temperature detection section is configured by being held by the heat resistant support member 6 and included in the heat resistant support member 6 and the heat conductor 7. The upper flange of the holding cylinder 9 that holds the spring material 5 is held between the inner cylinder 10 and the contact plate 4, and the inner cylinder 10 is similarly fixed by being caulked at several places on the outer periphery of the flange by the bent tongues of the contact plate 4. has been done.
The inner cylinder 10 is slidable on the bottomed outer cylinder 11, and the inner cylinder 1
Movement is restricted at the lower end of 0. The holding cylinder 9 is pushed upward by a coil spring 12 held at the bottom of the outer cylinder 11. FIG. 2 shows the configuration when the pot 13 is placed. In this case, the coil spring 12 is compressed and the contact plate 4 is lowered to be flush with the sheathed heater 1 and in contact with the bottom of the pot 13. Hereinafter, the operation of detecting the temperature at the bottom of the pot 13 will be explained with reference to FIG. In FIG. 2, the heat from the red-hot sheathed heater 1 is radiated and transmitted. Radiant heat heats the cylindrical part hanging down on the outer periphery of the contact plate 4 as well as the outer tube 11, while transferred heat heats the outer tube 11 through the support fitting 2. heated. On the other hand, when water is in the pot 13 at the bottom of the pot 13 except for the surface that is in contact with the sheathed heater 1, the temperature is approximately close to that of the water. Therefore, all the outer surfaces of the contact plate 4 of the temperature sensing device 3 other than the surface in contact with the bottom of the pot 13 are at a higher temperature than the bottom of the pot 13. The contact plate 4 is convex upward and has a radius of curvature of 1600 mm in order to more accurately pick up the temperature at the bottom of the pot 13.
It is constructed with the above-mentioned gently curved surface and has a wide contact area with the pot 13. Further, a cylindrical portion hanging down at the outer periphery is provided to block radiant heat from the sheathed heater 1. Since the outer periphery is heated to a very high temperature, stainless steel is used in consideration of its heat resistance. Furthermore, in order to transmit the temperature at the bottom of the pot 13 to the temperature sensing element 8, it is necessary to transmit heat in the vertical direction well, so the thickness of the plate must be reduced.
It is kept below 0.6mm. Because the board is thin, heat is not easily transmitted in the horizontal direction, and heat from the surroundings is transmitted to the pan 13 at the contact portion with the pan 13, making it difficult to transmit to the center. Next, the heat conductor 7 contacts the contact plate 4 to transmit the temperature of the bottom of the pot 13 to the temperature sensing element 8, so the surface in contact with the contact plate 4 is made wider with a flange configuration, and the lower part is designed to increase responsiveness. It has a small diameter and a small heat capacity. The heat conductor 7 encloses the temperature sensing element 8 together with the heat resistant support member 6 made of ceramics or the like, and the temperature of the temperature sensing element 8 is also kept close to the temperature of the bottom of the pot 13. Further, the heat-resistant support member 6 is provided with an outer cylinder 11 at the lower part.
Since the upper part of the heat-resistant support member 6 is wrapped in the heat conductor 7, the heat-resistant support member 6 and the temperature-sensitive element 8 are placed in the pot 13 at the same time. The structure is designed to bring the temperature close to the bottom temperature. The material of the thermal conductor 7 is aluminum considering its heat resistance, corrosion resistance, and good thermal conductivity. Heat conductor 7 via heat resistant support member 6
The spring material 5 that presses the contact plate 4 is made of a stainless steel disc spring so as not to increase the height of the holding cylinder 9 that is held therein, and the spring material 5 presses the contact plate 4 from the bottom surface of the outer cylinder 11 heated by the sheathed heater 1. The overall shape was designed to be small in order to avoid being affected by the radiant heat. Furthermore, since the holding cylinder 9 is a concentric cylinder with the inner cylinder 10 and is in contact with only the flange end, it is relatively less susceptible to external heat, and the temperature sensing element 8 is spatially isolated from the outside, so it is not sensitive to heat. By blocking heat transfer due to convection inside the heating device 3, the outer cylinder 1
1 and the inner cylinder 10 toward the temperature sensing element 8. Due to the heat transfer mechanism described above, the temperature sensing device 3 can accurately detect the temperature at the bottom of the pot 13. FIG. 3 shows temperature rise curves of various parts when water is boiled using the configuration of the example. In FIG. 3, A shows the water temperature, B shows the temperature of the temperature sensing element, C shows the bottom surface temperature of the outer cylinder, and D shows the temperature of the cylindrical part hanging down on the outer periphery of the contact plate. Even though the temperature of the outer wall portion of the temperature sensing device 3, represented by the cylindrical portion hanging down on the outer periphery of the contact plate 4 and the bottom surface portion of the outer tube 11, is high, the temperature of the temperature sensing element 8 becomes almost parallel to the water temperature. It can be seen that the temperature at the bottom of the pot 13 is accurately detected. The main experimental conditions in FIG. 3 are shown in Table 1.

【表】【table】

【表】 なお、感温装置の材質は以下の通りである。 接触板4…ステンレス鋼 熱伝導体7…アルミニウム 耐熱支持部材6…グラスセラミツクス バネ材5…ステンレスバネ材 他の構成部材はすべてステンレス鋼である。 発明の効果 以上の説明から明らかなように本発明による感
温装置は近傍に位置し赤熱するヒータからの熱に
影響されないで正確に鍋底温度を検出できる。接
触板がステンレスであるため、耐熱性耐食性にす
ぐれた構造であり、応答性も良い。応用例からも
わかるように、水の沸騰点における変曲点と感温
素子の昇温曲線の変曲点が正確に一致するため、
外部感温装置で水の沸騰点を検出できるという画
期的な応用も考えられる。また、油温制御等、
様々な工業的利用が可能である。
[Table] The materials of the temperature sensing device are as follows. Contact plate 4...Stainless steel heat conductor 7...Aluminum heat resistant support member 6...Glass ceramic spring material 5...Stainless steel spring material All other constituent members are stainless steel. Effects of the Invention As is clear from the above description, the temperature sensing device according to the present invention can accurately detect the temperature at the bottom of the pot without being affected by the heat from the red-hot heater located nearby. Since the contact plate is made of stainless steel, it has a structure with excellent heat resistance and corrosion resistance, and has good response. As can be seen from the application example, the inflection point at the boiling point of water and the inflection point of the temperature rise curve of the temperature sensing element exactly match.
A ground-breaking application is also conceivable, in which the boiling point of water can be detected using an external temperature-sensing device. In addition, oil temperature control, etc.
Various industrial uses are possible.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の実施例における感温装置の断
面図、第2図は同感温装置の使用時状態における
断面図、第3図は同感温装置で水を沸かした場合
の各部の昇温曲線図である。 4……接触板、5……バネ材、6……耐熱支持
部材、7……熱伝導体、8……感温素子。
Figure 1 is a cross-sectional view of a temperature-sensing device according to an embodiment of the present invention, Figure 2 is a cross-sectional view of the temperature-sensing device in use, and Figure 3 is a temperature increase in various parts when water is boiled with the same temperature-sensing device. It is a curve diagram. 4... Contact plate, 5... Spring material, 6... Heat resistant support member, 7... Heat conductor, 8... Temperature sensing element.

Claims (1)

【特許請求の範囲】[Claims] 1 鍋底温度を検出する感温素子と、この感温素
子を保持するセラミツクス等の耐熱支持部材と、
この耐熱支持部材の上部を包含し、且つこの耐熱
支持部材との間に前記感温素子を包含するように
設けた熱伝導性の良い熱伝導体と、この熱伝導体
を鍋底に接する受熱用で外周で垂下する円筒を設
けた接触板に、前記耐熱支持部材を介して押圧す
るバネ材よりなる加熱調理器用感温装置。
1. A temperature sensing element that detects the bottom temperature of the pot, a heat-resistant support member such as ceramics that holds this temperature sensing element,
A heat conductor with good thermal conductivity is provided to cover the upper part of the heat-resistant support member and include the temperature sensing element between the heat-resistant support member, and a heat-receiving member that contacts the heat conductor with the bottom of the pot. A temperature sensing device for a heating cooker, which is made of a spring material that is pressed via the heat-resistant support member to a contact plate provided with a cylinder that hangs down at the outer periphery.
JP16691682A 1982-09-25 1982-09-25 Temperature sensing apparatus for heating cooker Granted JPS5955224A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16691682A JPS5955224A (en) 1982-09-25 1982-09-25 Temperature sensing apparatus for heating cooker

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16691682A JPS5955224A (en) 1982-09-25 1982-09-25 Temperature sensing apparatus for heating cooker

Publications (2)

Publication Number Publication Date
JPS5955224A JPS5955224A (en) 1984-03-30
JPS6319170B2 true JPS6319170B2 (en) 1988-04-21

Family

ID=15840017

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16691682A Granted JPS5955224A (en) 1982-09-25 1982-09-25 Temperature sensing apparatus for heating cooker

Country Status (1)

Country Link
JP (1) JPS5955224A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104797014B (en) * 2015-04-30 2016-06-22 佛山市川东磁电股份有限公司 A kind of integrated sensor

Also Published As

Publication number Publication date
JPS5955224A (en) 1984-03-30

Similar Documents

Publication Publication Date Title
EP3685630B1 (en) Electric stovetop heater unit with integrated temperature control
US7488920B2 (en) Radiant heater in a cooking hob with a thermal switch
EP1937114B1 (en) A food cooking device and a cooking utensil adapted to facilitate the heating of food
GB2103910A (en) Improvements in electric cookers incorporating radiant heaters
JPS6319170B2 (en)
US3191003A (en) Surface heating unit
JPS6319169B2 (en)
JPH0252773B2 (en)
JPH1183020A (en) Pan bottom temperature sensor
JPS6330889Y2 (en)
JP2639030B2 (en) Induction heating cooker
JP4231803B2 (en) Induction heating cooker
WO2016139703A1 (en) Heating cooker
JPH0157256B2 (en)
JP5318361B2 (en) Electric rice cooker
JPS6330888Y2 (en)
JP2557508Y2 (en) Temperature sensor used for heating control
JPS60165432A (en) Thermosensitive device for use in heat cooking apparatus
JPS6312818Y2 (en)
JPS6342162B2 (en)
JPS6327629Y2 (en)
JP2639031B2 (en) Induction heating cooker
JPS6138775B2 (en)
JPS59605Y2 (en) thermal device
JPH0143216B2 (en)