JPS63191637U - - Google Patents
Info
- Publication number
- JPS63191637U JPS63191637U JP1987082751U JP8275187U JPS63191637U JP S63191637 U JPS63191637 U JP S63191637U JP 1987082751 U JP1987082751 U JP 1987082751U JP 8275187 U JP8275187 U JP 8275187U JP S63191637 U JPS63191637 U JP S63191637U
- Authority
- JP
- Japan
- Prior art keywords
- bonding pad
- layer
- semiconductor substrate
- pad layer
- internal circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 3
- 239000011229 interlayer Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987082751U JPS63191637U (US06623731-20030923-C00052.png) | 1987-05-28 | 1987-05-28 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987082751U JPS63191637U (US06623731-20030923-C00052.png) | 1987-05-28 | 1987-05-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63191637U true JPS63191637U (US06623731-20030923-C00052.png) | 1988-12-09 |
Family
ID=30935689
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987082751U Pending JPS63191637U (US06623731-20030923-C00052.png) | 1987-05-28 | 1987-05-28 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63191637U (US06623731-20030923-C00052.png) |
-
1987
- 1987-05-28 JP JP1987082751U patent/JPS63191637U/ja active Pending