JPS63191631U - - Google Patents

Info

Publication number
JPS63191631U
JPS63191631U JP8311487U JP8311487U JPS63191631U JP S63191631 U JPS63191631 U JP S63191631U JP 8311487 U JP8311487 U JP 8311487U JP 8311487 U JP8311487 U JP 8311487U JP S63191631 U JPS63191631 U JP S63191631U
Authority
JP
Japan
Prior art keywords
bonding
heater
semiconductor chip
heating
preheating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8311487U
Other languages
English (en)
Japanese (ja)
Other versions
JP2525772Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987083114U priority Critical patent/JP2525772Y2/ja
Publication of JPS63191631U publication Critical patent/JPS63191631U/ja
Application granted granted Critical
Publication of JP2525772Y2 publication Critical patent/JP2525772Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP1987083114U 1987-05-29 1987-05-29 半導体製造装置 Expired - Lifetime JP2525772Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987083114U JP2525772Y2 (ja) 1987-05-29 1987-05-29 半導体製造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987083114U JP2525772Y2 (ja) 1987-05-29 1987-05-29 半導体製造装置

Publications (2)

Publication Number Publication Date
JPS63191631U true JPS63191631U (enrdf_load_stackoverflow) 1988-12-09
JP2525772Y2 JP2525772Y2 (ja) 1997-02-12

Family

ID=30936407

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987083114U Expired - Lifetime JP2525772Y2 (ja) 1987-05-29 1987-05-29 半導体製造装置

Country Status (1)

Country Link
JP (1) JP2525772Y2 (enrdf_load_stackoverflow)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59208734A (ja) * 1983-05-13 1984-11-27 Hitachi Ltd ペレツトボンデイング装置
JPS6045027A (ja) * 1983-08-23 1985-03-11 Toshiba Corp フレームフイーダ
JPS6231129A (ja) * 1985-08-02 1987-02-10 Mitsubishi Electric Corp 半導体装置組立てボンダ−用ワ−ク加熱装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59208734A (ja) * 1983-05-13 1984-11-27 Hitachi Ltd ペレツトボンデイング装置
JPS6045027A (ja) * 1983-08-23 1985-03-11 Toshiba Corp フレームフイーダ
JPS6231129A (ja) * 1985-08-02 1987-02-10 Mitsubishi Electric Corp 半導体装置組立てボンダ−用ワ−ク加熱装置

Also Published As

Publication number Publication date
JP2525772Y2 (ja) 1997-02-12

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