JPS63190074U - - Google Patents

Info

Publication number
JPS63190074U
JPS63190074U JP8027787U JP8027787U JPS63190074U JP S63190074 U JPS63190074 U JP S63190074U JP 8027787 U JP8027787 U JP 8027787U JP 8027787 U JP8027787 U JP 8027787U JP S63190074 U JPS63190074 U JP S63190074U
Authority
JP
Japan
Prior art keywords
back side
adhesive tape
slip layer
bonded
strip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8027787U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8027787U priority Critical patent/JPS63190074U/ja
Publication of JPS63190074U publication Critical patent/JPS63190074U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Packages (AREA)

Description

【図面の簡単な説明】
第1図は本考案の実例を示す部分斜視図、第2
図はロール状に巻回してなる本考案の実例を示す
幅方向横断説明図である。 1……帯状基体、11……透孔、12……送り
用孔、2……粘着テープ、20……テープ支持体
、21……粘着層、3……滑り防止層。

Claims (1)

    【実用新案登録請求の範囲】
  1. 透孔と送り用孔とを長さ方向に列設してなる帯
    状基体の裏面側に、滑り防止層を背面に設けてな
    る粘着テープが貼り合されている電子部品用搬送
    体。
JP8027787U 1987-05-27 1987-05-27 Pending JPS63190074U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8027787U JPS63190074U (ja) 1987-05-27 1987-05-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8027787U JPS63190074U (ja) 1987-05-27 1987-05-27

Publications (1)

Publication Number Publication Date
JPS63190074U true JPS63190074U (ja) 1988-12-07

Family

ID=30930936

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8027787U Pending JPS63190074U (ja) 1987-05-27 1987-05-27

Country Status (1)

Country Link
JP (1) JPS63190074U (ja)

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