JPS63175057U - - Google Patents

Info

Publication number
JPS63175057U
JPS63175057U JP6671887U JP6671887U JPS63175057U JP S63175057 U JPS63175057 U JP S63175057U JP 6671887 U JP6671887 U JP 6671887U JP 6671887 U JP6671887 U JP 6671887U JP S63175057 U JPS63175057 U JP S63175057U
Authority
JP
Japan
Prior art keywords
tape
adhesive layer
flat
shaped substrate
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6671887U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6671887U priority Critical patent/JPS63175057U/ja
Publication of JPS63175057U publication Critical patent/JPS63175057U/ja
Pending legal-status Critical Current

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Description

【図面の簡単な説明】
第１図Ａは本考案の実例を示す部分斜視図、第
１図Ｂは第１図Ａをａ―ａ線にて切断した状態を
矢印方向からみた説明図、第２図は本考案の他の
実例を示す部分斜視図、第３図はカバーテープを
貼り合せてなる本考案の実例を示す長手方向の部
分断面図である。 １……テープ状基体、１０……平坦部、１１…
…凹部、１２……粘着剤層、１３……送り用孔、
２……電子部品。

Claims (1)

    【実用新案登録請求の範囲】
  1. テープ状基体の長手方向に平坦部と凹部とを交
    互に列設すると共に前記平坦部面に粘着剤層を設
    けてなる電子部品用搬送体。
JP6671887U 1987-04-30 1987-04-30 Pending JPS63175057U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6671887U JPS63175057U (ja) 1987-04-30 1987-04-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6671887U JPS63175057U (ja) 1987-04-30 1987-04-30

Publications (1)

Publication Number Publication Date
JPS63175057U true JPS63175057U (ja) 1988-11-14

Family

ID=30904985

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6671887U Pending JPS63175057U (ja) 1987-04-30 1987-04-30

Country Status (1)

Country Link
JP (1) JPS63175057U (ja)

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