JPH01128570U - - Google Patents
Info
- Publication number
- JPH01128570U JPH01128570U JP2582188U JP2582188U JPH01128570U JP H01128570 U JPH01128570 U JP H01128570U JP 2582188 U JP2582188 U JP 2582188U JP 2582188 U JP2582188 U JP 2582188U JP H01128570 U JPH01128570 U JP H01128570U
- Authority
- JP
- Japan
- Prior art keywords
- adhesive layer
- electronic components
- carrier
- transportation
- push
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012790 adhesive layer Substances 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
Description
第１図は本考案の実例を示す部分斜視図、第２
図は本考案の搬送体を用いた電子部品の取り外し
時の状態を示す説明図、第３図は本考案の他の実
例を示す幅方向横断説明図である。 １……搬送用支持体、２……電子部品固定用接
着層、３……突き上げ棒挿入用孔。
図は本考案の搬送体を用いた電子部品の取り外し
時の状態を示す説明図、第３図は本考案の他の実
例を示す幅方向横断説明図である。 １……搬送用支持体、２……電子部品固定用接
着層、３……突き上げ棒挿入用孔。
Claims (1)
- 搬送用支持体面に電子部品固定用接着層を設け
ると共に該接着層付設部分に前記支持体及び該接
着層を貫通する突き上げ棒挿入用孔が設けられて
いる電子部品用搬送体。
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2582188U JPH01128570U (ja) | 1988-02-26 | 1988-02-26 | |
| KR1019890012051A KR900005862A (ko) | 1988-02-26 | 1989-08-24 | 전자부품용 반송체 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2582188U JPH01128570U (ja) | 1988-02-26 | 1988-02-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01128570U true JPH01128570U (ja) | 1989-09-01 |
Family
ID=31246893
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2582188U Pending JPH01128570U (ja) | 1988-02-26 | 1988-02-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01128570U (ja) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6470370A (en) * | 1987-09-07 | 1989-03-15 | Nec Corp | Packaging material for semiconductor device |
-
1988
- 1988-02-26 JP JP2582188U patent/JPH01128570U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6470370A (en) * | 1987-09-07 | 1989-03-15 | Nec Corp | Packaging material for semiconductor device |