JPS63188993A - Apparatus for correcting defective pattern - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a device for correcting defective patterns on printed circuit boards, and in particular, the present invention relates to a device for correcting defective patterns on printed circuit boards, and particularly for patterning defective patterns on hard gold/Kovar ribbons (nickel plated on hard gold/Kovar ribbons, and gold plated iron alloy ribbons). The present invention relates to bonding (thermocompression bonding) and pattern defect correction equipment.

[Prior art]

Bonding techniques generally include wiring work for LSI lead wires using wires (or ribbons) made of aluminum, copper, gold, or the like. The wire used for the wiring work is flexible and has a thin wire diameter of 25 μm, making it easy to cut it arbitrarily at the end of bonding.

For this reason, wire bonding and wire cutting are automated in the bonding work for LSIs.

By the way, defective patterns on printed circuit boards are corrected by bonding gold/kovar ribbons, but gold/kovar ribbons that pass the U.S. MIL standard are hard because the Kovar wire material is hard. Cannot be easily cut. For this reason, in the bonding work, the gold/Kovar ribbon is cut in advance to a predetermined length, and is grasped with tweezers and bonded to the defective pattern surface.

[Problem that the invention is trying to solve] However,
In the method of repairing a printed circuit board using such a gold/Kovar ribbon, when the pattern width becomes 100 μm or less as the density of the pattern increases, skill is required and it becomes difficult to perform the repair manually. Therefore, it is desired to automate the work when using such a hard conductive ribbon.

The present invention has been made in view of the above circumstances, and it is an object of the present invention to propose a defective pattern repairing device that can automatically repair defective pattern portions of printed circuit boards, thereby improving work efficiency and saving labor. The purpose is

[Means to solve the problem]

In order to achieve the above object, the present invention provides a defective pattern repairing apparatus for repairing pattern defects by thermocompression bonding a conductive ribbon onto the defective portion of the pattern formed on a printed circuit board. a feeding device having an inclined surface for feeding the conductive ribbon by tilting it; a cutting device for cutting the conductive ribbon on a predetermined inclined surface of the feeding device; and a crimping tool for thermally pressing one end of the conductive ribbon into a pattern and then thermally pressing the other end of the conductive ribbon cut by a cutting device.

[Effect]

According to the defect pattern correction device according to the present invention, the conductive ribbon can be automatically fed out onto the defective part by the feeding device, and one end of the conductive ribbon is thermocompressed by the crimping tool, so that the conductive ribbon is easily fixed onto the pattern. The conductive ribbon fixed on the pattern can be automatically cut and the cut ends can be thermocompression bonded without providing means for supporting the conductive ribbon. Therefore, defective patterns can be automatically corrected to improve work efficiency.

〔Example〕

DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the defect pattern correction apparatus according to the present invention will be described in detail below with reference to the accompanying drawings.

FIG. 1 is a front view of a defect pattern apparatus according to the present invention. As shown in FIG. 1, the repair device is comprised of a crimping tool 10, a conductive ribbon feeding device 12, and a conductive ribbon cutting machine 14 provided on the feeding device 12. The crimping tool 1o and the feeding device 12 are positioned approximately 2 marks above the surface of the pattern 18 of the printed circuit board 16 at a certain distance from each other, so that they can horizontally move synchronously on the circuit board. Further, the feeding device 12 is lowered by a certain interval as the crimping tool IO is lowered. A monitor camera (not shown) is provided adjacent to the crimping tool 10, and displays the pattern 18 below the tool 10 on a monitor. Generate a cross line on the monitor,
The movement of the cross line on the monitor and the movement of the tip of the crimping tool 10 are synchronized. Therefore, if the defective portion 18A of the pattern 18 and the cross line are made to overlap on the monitor, the crimping tool 10 can be easily positioned directly above the defective pattern 18A.

As shown in FIGS. 1 to 3, the upper surface of the base 20 of the feeding device 12 is an inclined surface 2OA, and the conductive ribbon 21 is fed out along the inclined surface 2OA. The conductive ribbon 21 is made of hard Kovar plated with gold. Left end 20 from which the conductive ribbon 21 is sent out
B is formed into an acute angle. The base 20 can be adjusted by slightly moving the base 20 using a slider 22 in a direction substantially perpendicular to the feeding direction of the ribbon 21, as shown by the arrow in FIG. Further, the slider 22 is attached to a fine rotation device 24, and the fine rotation device 24 is connected to the base 20 through the slider 22.
The rotation is adjusted. Therefore, the lower surface of the base 20 is easily set to be parallel to the surface of the pattern 16.

A pulley 26 is provided on the slope 2OA of the base 20, and the pulley 26 is rotated by a pulse motor 30 via a rotating shaft 28. The outer peripheral surface of the pulley 26 is lined with rubber, and the conductive ribbon 21 is sent out toward the left end of the base 20.

A guide member 32 is provided on the pulley 26 on the delivery side of the conductive ribbon 21, and a guide groove 34 for guiding the conductive ribbon 21 is formed in the guide member 32. The guide groove 34 has a width of 0.19 mm and a depth of 0.0 mm to match the ribbon dimensions (width 0.18++ on, thickness 0.15 mm).
It is formed to 7mm. The conductive ribbon 21 is prevented from floating and moves in the guide groove 7, and is smoothly attached to the base 2.
It is sent out from the left tip 20B along the inclined surface 20A of 0. Further, a conductive ribbon 2 is placed on the slope 2OA of the base 20.
1 cutting machine 14 is provided, and the cutting blade 36 of the cutting machine 14 is lowered onto the surface 40 by the upper air cylinder 38 formed on the inclined surface 20A, and can cut the conductive ribbon 21. It looks like this. Since the base 20 is formed with an inclination angle of approximately 15°, the thickness of the support surface 40 is sufficient to withstand the descending cutting blade 36.

Further, a ribbon detector 42 is provided on the right side of the pulley 26, and the ribbon detector 42 can detect the end of the conductive ribbon 22 sent out by the pulley 26. When the ribbon detector 42 detects the end of the conductive ribbon 21, it sends a detection signal to the pulse motor 30. The pulse motor 30 rotates the pulley 26 in the reverse direction when receiving the detection signal. Therefore, the remaining portion of the conductive ribbon 21 that has become short after being used does not remain in the guide groove 34 of the feeding device 12, and is automatically removed by reverse rotation of the pulley 26.

According to the defective pattern repairing device according to the present invention configured as described above, the repairing device is placed on the defective portion 18A of the pattern 18 of the printed circuit board 16 as shown in FIG. 4 using a monitor camera or the like. It will be done.

FIGS. 4(A) to 4(F) show the crimping tool 10 of the repair device.
FIG. 3 is an explanatory diagram schematically showing a feeding device 12 and a cutting blade 36. FIG.

From the feeding device 12 of the correction device, the conductive ribbon 21 is passed through the pulley 26 to the crimping tool 10 and the turn 18.
sent between. As shown in Figure 4 (B),
One end of the sent-out conductive ribbon 21 is thermocompression bonded onto the pattern 18 by the downward movement of the crimping tool 10 . Thermocompression bonding is performed under pressure by applying an electric current to the crimping tool 10. Next, as shown in FIG. 4C, the cutting blade 36 provided on the feeding device 12 is lowered to cut the conductive ribbon 21.

After cutting, as shown in (D') in Fig. 4, the crimping tool 1
0 is lifted up and moved to the right as shown in FIG. It is separated from the sending device 12. Next, as shown in FIG. 4(F), the crimping tool is moved down, and the other end of the cut conductive ribbon 21 is crimped onto the pattern 18.

As a result, the defective portion 18A of the pattern 18 is automatically corrected.

In the above embodiment, only both ends of the conductive ribbon 21 were bonded by thermocompression using the crimping tool 10, but the present invention is not limited to this. If lifting occurs in the middle part of the crimping ribbon 21, the method shown in FIG. After the step of crimping one end with the crimping tool 10 shown in ), a step of further crimping the intermediate portion with the crimping tool 10 may be provided as shown in FIGS. 5(a) to 5(C). As a result, an increase in thickness due to lifting in the multilayer substrate is prevented as much as possible, and the influence of correction can be reduced more than ever before.

〔Effect of the invention〕

As explained above, according to the defective pattern correction apparatus according to the present invention, the conductive ribbon is fed out between the crimping tool and the pattern of the printed circuit board by the feeding device, and after crimping one end of the conductive ribbon with the crimping tool. Since the conductive ribbon is cut to a predetermined length and the other end of the conductive ribbon is crimped again using a crimping tool, defective pattern areas on the printed circuit board can be automatically corrected, reducing operational complexity. It is possible to aim for

[Brief explanation of the drawing]

FIG. 1 is a side view of the defect pattern correction device according to the present invention, FIG. 2 is a top view of the feeding device of this embodiment, FIG. 3 is a front view of the feeding device of this embodiment, and FIG. ) to (
F) is an explanatory diagram when correcting a pattern on a printed circuit board according to this embodiment, and FIGS. 5(a) to (C) are explanatory diagrams showing other aspects of the method for modifying a pattern on a printed circuit board according to this embodiment. It is. 10... Crimping tool, 12... Feeding device,
14... Cutting device, 16... Printed circuit board,
18...Pattern, 18A...Pattern defective part, 20...Base 2OA...Slanted surface, 21
... Conductive ribbon, 22 ... Slider, 2
4...Rotating device, 26...Pulley. Applicant Hitachi Plant Construction Co., Ltd. Figure 5 (a) (b)

Claims (2)

[Claims] (1) In a defective pattern repair device that corrects pattern defects by thermocompression-bonding a conductive ribbon onto a defective part of a pattern formed on a printed circuit board, the conductive ribbon is tilted and fed onto the defective part of the pattern. a feeding device having an inclined surface; a cutting device for cutting the conductive ribbon on a predetermined inclined surface of the feeding device; and a crimping tool for thermo-compressing the other end of the conductive ribbon cut by a cutting device after thermo-compressing the conductive ribbon. (2) A slider for moving and adjusting the feeding machine in a direction substantially perpendicular to the feeding direction of the conductive ribbon, and a rotation device for adjusting the rotation of the feeding machine are provided, so that the conductive ribbon can be accurately bonded to the crimping tool and the pattern defects. 2. The defect pattern correction device according to claim 1, wherein the defect pattern correction device is adapted to be guided between the portion and the portion.