JPS63187395U - - Google Patents
Info
- Publication number
- JPS63187395U JPS63187395U JP1987080039U JP8003987U JPS63187395U JP S63187395 U JPS63187395 U JP S63187395U JP 1987080039 U JP1987080039 U JP 1987080039U JP 8003987 U JP8003987 U JP 8003987U JP S63187395 U JPS63187395 U JP S63187395U
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- heat
- heating element
- detection element
- uniforming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001514 detection method Methods 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 5
- 239000012212 insulator Substances 0.000 claims description 4
- 239000000565 sealant Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は、この考案の一実施例を示すハイブリ
ツドＩＣの断面図、第２図及び第３図は他の実施
例を示すハイブリツドＩＣの断面図、第４図は、
従来の温調技術を説明するための断面図である。 １……均熱絶縁体、２……発熱体、３……温調
素子、４……温度検出素子、５……被温調回路素
子、６……封止材。
ツドＩＣの断面図、第２図及び第３図は他の実施
例を示すハイブリツドＩＣの断面図、第４図は、
従来の温調技術を説明するための断面図である。 １……均熱絶縁体、２……発熱体、３……温調
素子、４……温度検出素子、５……被温調回路素
子、６……封止材。
Claims (1)
- 【実用新案登録請求の範囲】 (1) 被温調回路と、発熱体と、温度検出素子と
、この温度検出素子にて検出される温度に応じ、
前記発熱体を制御し所定温度に調節するための温
調回路とを、均熱絶縁体表面に実装し、且つこれ
らを断熱封止材で封止してなることを特徴とする
ハイブリツド集積回路装置。 (2) 前記被温調回路が、前記均熱絶縁体の一方
の表面に、前記発熱体及び温度検出素子が他方の
表面に実装されたものである実用新案登録請求の
範囲第１項記載のハイブリツド集積回路装置。 (3) 前記被温調回路、温度検出素子及び温調回
路が前記均熱絶縁体の一方の表面に、前記発熱体
が他方の表面に実装されたものである実用新案登
録請求の範囲第１項記載のハイブリツド集積回路
装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987080039U JPS63187395U (ja) | 1987-05-26 | 1987-05-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987080039U JPS63187395U (ja) | 1987-05-26 | 1987-05-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63187395U true JPS63187395U (ja) | 1988-11-30 |
Family
ID=30930479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987080039U Pending JPS63187395U (ja) | 1987-05-26 | 1987-05-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63187395U (ja) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5324452B2 (ja) * | 1975-08-29 | 1978-07-20 |
-
1987
- 1987-05-26 JP JP1987080039U patent/JPS63187395U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5324452B2 (ja) * | 1975-08-29 | 1978-07-20 |