JPS63186181A - High heat loss structure - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Field of Application in Industry] The present invention is applicable to a nuclear fusion reactor, a first wall of a nuclear fusion experimental device, a limiter, a diverter, or a wall of an MHD power generation channel or a high-speed flying vehicle of a space shuttle. It relates to high heat load structures applied to surface materials, etc.

[Prior art] For example, high heat load structures such as the fourth wall, limiter, and diverter of a fusion reactor have materials on the plasma side surface that have excellent heat resistance, are less likely to be worn out by the plasma, and have less impact on the plasma. Sometimes used as a board.

By the way, as shown in FIG. 3, a conventional high heat load structure has a structure in which a protective plate 2 is brazed to a substrate 1 using a φ filler 3 for surface bonding.

Note that a plurality of cooling holes 4 are provided in the substrate 1 so as to be parallel to the bonding surface thereof. In addition to brazing, the surface bonding between the substrate 1 and the protection plate 2 can be performed by diffusion bonding using an insert material.

[Problems to be Solved by the Invention] Generally, there is a large difference between the coefficient of thermal expansion of the heat-resistant material (e.g., ceramics) used for the protection plate 2 and the coefficient of thermal expansion of the material (e.g., stainless steel) used for the substrate 1. Therefore, as shown in FIG. 3, in a structure with a high heat load where the substrate 1 and the protection plate 2 are bonded face-to-face, the substrate 1 and the protection plate 2 undergo thermal expansion due to temperature changes during bonding or use. Thermal stress occurs due to the difference. As a result, there was a problem that the protection plate 2 would be cracked or peeled off.

The present invention was made in order to solve the above-mentioned conventional problems, and has a high heat load structure that reduces thermal stress caused by the difference in thermal expansion between the substrate and the protection plate, and suppresses the occurrence of cracking and peeling of the protection plate. It tries to provide something.

[Means for Solving the Problems] The present invention is a high heat load structure in which a protection plate and a substrate are surface bonded by brazing or diffusion bonding, characterized in that a groove is provided in the bonding surface of the substrate. It is something.

[Function] In the high heat load structure of the present invention, by providing grooves on the bonding surface of the substrate, the substantial bonding area between the protection plate and the substrate can be divided into fine sections. Since the thermal stress generated in the joint increases in proportion to the joint area, the thermal stress can be reduced by dividing the joint area into smaller sections. Further, by providing a groove in the bonding surface of the substrate, the rigidity of the substrate near one bonding surface can be lowered, so that the difference in thermal expansion between the protection plate and the substrate can be absorbed by deformation of the substrate. Therefore, it is possible to reduce the thermal stress that occurs at the joint between the protective plate and the substrate due to temperature changes during bonding or use, thereby suppressing cracking and peeling of the protective plate.

[Embodiments of the Invention] Hereinafter, embodiments of the present invention will be described in detail with reference to FIGS. 1 and 2.

FIG. 1 is a sectional view of a high heat load structure showing one embodiment of the present invention, and FIG. 2 is an exploded perspective view of the same structure. 1 in the diagram
1 is a substrate having a plurality of cooling holes 12 parallel to the bonding surface. For example, grid-shaped grooves 13 are provided on the bonding surface of the substrate 11.

A protection plate 14 is brazed to the bonding area of the substrate 11 in which the lattice-shaped grooves 13 are formed through a brazing material 15.

According to such a configuration, the grid-like grooves 13 are provided on the bonding surface of the substrate 11, and the substantial bonding area between the protection plate 14 and the substrate 11 is divided into fine sections.

Thermal stress at the joint, which increases in proportion to the product, can be reduced. In addition, by providing 11113 on the bonding surface of the substrate, the rigidity near the bonding surface can be lowered, and the protection plate 14
The difference in thermal expansion between the substrate 11 and the substrate 11 can be absorbed by deformation of the substrate 11 at around 13 degrees. Therefore, it is possible to reduce the thermal stress generated at the joint between the protective plate and the substrate due to temperature changes during bonding or use, and to obtain a highly durable high heat load structure in which cracking and peeling of the protective plate are suppressed.

In the above embodiment, the shape of the grooves provided on the bonding surfaces of the substrates is in the form of a lattice, but the shape is not limited to this. Material (
In particular, the groove shape may be determined depending on the bonding temperature), the operating temperature, etc. - In the above embodiments, the substrate and the protective plate were joined by brazing through a brazing material, but they may be joined by diffusion using an insert material or the like.

[Effects of the Invention] As described in detail above, according to the present invention, in a high heat load structure in which a protection plate and a substrate are surface-bonded by brazing or diffusion bonding, bonding can be achieved by providing a groove in the bonding surface of the substrate. The surface is subdivided and the rigidity near the bonding surface of the board is reduced, absorbing the difference in thermal expansion between the protective plate and the board due to temperature changes during bonding and use, reducing thermal stress generated at the bonding part. This also suppresses cracking and peeling of the protective plate, making it ideal for use in fusion reactors, fusion experimental equipment, limiters, diverters,
Alternatively, it is possible to provide a highly durable and high heat load structure suitable for ~1HD1 electron channel walls, surface materials of high-speed flying vehicles of the space shuttle, and the like.

[Brief explanation of the drawing]

Fig. 1 is a cross-sectional view of a high heat load structure showing an embodiment of the present invention, Fig. 2 is an exploded perspective view of the same structure shown in Fig. 1, and Fig. 3 is a sectional view showing a conventional high heat load structure. It is. DESCRIPTION OF SYMBOLS 11... Substrate, 12... Cooling hole, 13... Grid-shaped groove, 14... Capacity plate, 15... Brazing material. Applicant's agent Patent attorney Takehiko Suzue Figure 1 1z Figure 2 3 Figure 3

Claims (1)

[Claims] A high heat load structure in which a protection plate and a substrate are surface-joined by brazing or diffusion bonding, characterized in that a groove is provided in the bonding surface of the substrate.