CN211265962U - Laser unit and laser stack - Google Patents

Abstract

An embodiment of the utility model provides a laser unit and laser stack matrix, the laser unit includes laser chip, conductive substrate includes first end and second end, wherein, the side bonding of the first end of conductive substrate laser chip, conductive substrate second end has the spatial structure for the first end slope. Based on the utility model provides a laser unit and laser stack array can realize the dismantlement and the reorganization of stacking array effectively to solve the technical problem that can't ensure the vertical direction application of force among the prior art, simple structure, fastness and reliability are higher, have great range of application.

Description

Laser unit and laser stack

Technical Field

The utility model relates to a semiconductor laser field especially relates to a laser unit and laser stack matrix.

Background

In the field of semiconductor laser packaging technology, conventional conduction-cooled semiconductor laser stacks include two types, one in which the stack is formed by welding, as shown in fig. 1, and one in which the stack is formed by mechanical clamping, as shown in fig. 2.

In fig. 1, the stack is difficult to disassemble, reassemble or repair once bonding is completed, and re-bonding is often accompanied by contamination or breakage of the laser chip. In fig. 2, the mechanical clamping solution only has a force applied in the horizontal direction, but not in the vertical direction, so that the following problems occur: the vertical direction has no force restriction, and when the stack array vibrates longitudinally, the stack array is easy to fall off, so that the stack array of the semiconductor laser is not firmly fixed, and the reliability of the stack array of the semiconductor laser is seriously influenced.

Disclosure of Invention

In view of this, the utility model provides a laser unit and laser stack array can solve among the prior art effectively through designing neotype encapsulation cell structure and be difficult to dismantle, reorganization or reprocess, can't ensure the technical problem of vertical direction application of force, simple structure, and fastness and reliability are higher, have great range of application.

The technical scheme of the utility model is realized like this:

the utility model provides a laser unit, include: the laser chip comprises a laser chip and a conductive substrate, wherein the conductive substrate comprises a first end and a second end, the laser chip is bonded on the side face of the first end of the conductive substrate, and the second end of the conductive substrate is provided with a three-dimensional structure inclined relative to the first end.

In the above solution, the second end of the conductive substrate has a three-dimensional structure inclined with respect to the first end, and the three-dimensional structure includes: the second end of the conductive substrate is provided with a fixed substrate which is obliquely arranged relative to the first end, and the conductive substrate and the obliquely arranged fixed substrate are in a broken line shape.

In the above solution, the second end of the conductive substrate has a three-dimensional structure inclined with respect to the first end, and the three-dimensional structure includes: the second end of the conductive substrate is provided with an extension part, the extension part is obliquely arranged relative to the first end, and the extension parts of the first end and the second end of the conductive substrate are in a zigzag shape.

In the above aspect, the second end of the conductive substrate has a three-dimensional structure inclined with respect to the first end, and the conductive substrate includes: the end surface of the second end of the conductive substrate is an inclined surface.

In the above scheme, the inclined plane is provided with a fixed substrate with a matched inclination.

In the above scheme, the width of the inclined three-dimensional structure at the second end of the conductive substrate is smaller than or equal to the width of the first end of the conductive substrate.

In the above scheme, both side surfaces of the inclined three-dimensional structure have roughness.

In the above aspect, a buffer layer is disposed on at least one of two side surfaces of the inclined three-dimensional structure, and the buffer layer is in contact with the corresponding surface to generate a frictional force for fixation.

An embodiment of the utility model provides a laser stack matrix is still provided, including a plurality of above laser unit, unable adjustment base, a plurality of laser unit bonded in unable adjustment base is last.

In the above scheme, the fixed base and the plurality of laser units are mechanically and fixedly connected, and the fixed base and the plurality of laser units are mutually vertical or inclined.

The utility model has the advantages of:

1. owing to designed neotype laser unit, on each laser unit relatively independently bonded in unable adjustment base, when certain laser unit broke down, directly dismantle the laser unit that corresponds replace can, it is more convenient.

2. The arrangement of the inclined three-dimensional structure in the laser unit enables an external force applied to the inclined three-dimensional structure to vertically incline the inclined surface of the inclined three-dimensional structure downwards, and the force is decomposed to generate a force in the vertical direction.

3. When a plurality of laser units form a pile of battle array, combine pressure and frictional force etc. in other directions, wholly fix a plurality of units on unable adjustment base, the fastness is better.

Drawings

FIG. 1 is a first prior art package structure;

FIG. 2 is a second prior art package structure;

FIG. 3 is a schematic diagram of the structure of the laser unit of the present invention

Fig. 4 is a first schematic structural diagram of the laser stack of the present invention;

fig. 5 is a schematic structural diagram of a laser unit according to the present invention;

fig. 6 is a schematic structural diagram of the laser stack array of the present invention;

fig. 7 is a third schematic structural view of the laser stack of the present invention;

fig. 8 is a fourth schematic structural view of the laser stack of the present invention;

fig. 9 is a schematic structural diagram of the laser stack array of the present invention;

fig. 10 is a sixth schematic structural view of the laser stack of the present invention;

fig. 11 is a force diagram of the inclined three-dimensional structure of the present invention;

fig. 12-16 are schematic structural diagrams of the mechanically fixed laser stack according to the present invention.

Description of reference numerals: the laser array comprises a laser stack array 1, a laser chip 11, a conductive substrate 12, a conductive substrate first end face, a conductive substrate second end, C an extending portion of the second end, B a conductive substrate second end face, 13 a fixed substrate, 14 a buffer layer, 15 a heat conducting film, 16 a heat sink, 17 a leading-out electrode, 18 a spring plate, D a conductive substrate width, D a width of a conductive substrate second end inclined three-dimensional structure, alpha an oblique angle of the inclined three-dimensional structure, S1 a left side surface of the inclined three-dimensional structure, and S2 a right side surface of the inclined three-dimensional structure.

Detailed Description

The technical solution of the present invention will be further described in detail with reference to the accompanying drawings and specific embodiments.

An embodiment of the utility model provides a laser unit and laser stack, as shown in fig. 3, the laser unit includes: the laser chip comprises a laser chip 11 and a conductive substrate 12, wherein the conductive substrate 12 comprises a first end A and a second end B, the side face of the first end A of the conductive substrate 12 is bonded with the laser chip 11, and the second end B of the conductive substrate 12 has a three-dimensional structure inclined relative to the first end A.

In general, the oblique three-dimensional structure is stronger as the oblique angle is larger, but the heat conduction path is longer when the oblique angle is larger, so that both the stronger and the heat conduction are practically required. The oblique angle of the oblique three-dimensional structure should satisfy the condition that the oblique three-dimensional structure does not interfere with the adjacent oblique three-dimensional structure on the premise of balanced heat conduction, that is, the oblique angle cannot be infinitely increased for improving the firmness, because the heat conduction efficiency is reduced due to the lengthening of the heat conduction path, and the probability of interference with the adjacent oblique three-dimensional structure is higher when the oblique angle is larger.

The first end of conductive substrate be straight bar sheet structure, the second end is parallel with the first end collineation. The inclined three-dimensional structure of the second end forms a certain included angle with the first end, namely the inclined three-dimensional structure is arranged in an opposite inclined mode. It should be noted that "straight", "vertical" and "oblique" are relative concepts indicating positions or structures, and "oblique" in an oblique three-dimensional structure is for a straight first end of a conductive substrate.

The second end of the conductive substrate has an inclined three-dimensional structure, which includes various cases, for example, an extension portion may be disposed at the end of the second end to have the inclined three-dimensional structure, or another independent inclined three-dimensional structure may be disposed at the second end, and the following description will further describe various cases with reference to the drawings and the specific embodiments.

Example one

The second end of the conductive substrate has a three-dimensional structure inclined relative to the first end by arranging an inclined fixed substrate at the second end of the conductive substrate, and the fixed substrate can be an insulating substrate or a conductive substrate.

Fig. 3 is a schematic structural diagram of the laser unit of the present invention, as shown in fig. 3, the second end B of the conductive substrate 12 has an inclined three-dimensional structure, which specifically includes: the second end B of the conductive substrate 12 is provided with a fixed substrate 13 which is arranged obliquely relative to the first end a, the conductive substrate 12 and the obliquely arranged fixed substrate 13 are integrally in a zigzag shape, and two end surfaces of the fixed substrate 13 can be a plane or an inclined surface as long as the conductive substrate is matched with an adjacent structure in the packaging process.

In the embodiment of the present invention, the width of the inclined three-dimensional structure at the second end B of the conductive substrate 12 is less than or equal to the width of the first end of the conductive substrate 12, and all the following embodiments are applicable. As will be understood with reference to fig. 5 and 6 (and similar drawings), the horizontal direction is defined as the stacking direction of the laser units when the laser units form a stacked array, the width of the inclined three-dimensional structure is the thickness of the second end B of the conductive substrate 12 in the horizontal direction, and the width of the first end of the conductive substrate 12 is the thickness of the first end a of the conductive substrate 12 in the horizontal direction.

As shown in fig. 5 and 6, according to the first embodiment, the width of the fixed substrate 13 is D, the width of the conductive substrate 12 is D, and the width D of the fixed substrate 13 is smaller than or equal to the width D of the conductive substrate 12.

Fig. 4 shows a case where the width D of the fixed substrate 13 is equal to the width D of the conductive substrate 12, and fig. 5 and 6 show a case where the width D of the fixed substrate 13 is smaller than the width D of the conductive substrate 12.

Referring to fig. 5 and 6, when the width D of the fixed substrate 13 is smaller than the width D of the conductive substrate 12, the conductive substrate 12 presses a portion of the buffer layer 14, which is advantageous: due to the existence of friction force, the buffer layer 14 is restrained between the fixed substrate 13 and the heat sink 16, and the conductive substrate 12 can block the buffer layer 14 from the upper part under the structure, so that the buffer layer 14 cannot be popped out in the vibration process, and the firmness and the reliability of the whole laser stack are further improved.

Example two

Different from the first embodiment, the present embodiment provides an extension C at the end of the second end B of the conductive substrate 12, so that the second end of the conductive substrate has a three-dimensional structure inclined with respect to the first end.

As shown in fig. 7, the second end B of the conductive substrate has an inclined three-dimensional structure with respect to the first end, and includes: the second end B of the conductive substrate 12 has an extension portion C, the extension portion is obliquely arranged relative to the first end, the extension portions of the first end a and the second end B of the conductive substrate 12 are integrally in a broken line shape, and the extension portions and the conductive substrate 12 can be of an integral structure, that is, the conductive substrate 12 which is integrally in a broken line shape is designed, so that a plurality of laser units can be directly bonded on the heat sink 16 when a laser stack array is formed, and the structure is simpler and more compact.

The end surface of the second end extension portion C of the conductive substrate in this embodiment may be a plane or an inclined surface, as long as the end surface is matched with an adjacent structure during packaging. The extension C of the second end of the conductive substrate 12 forms an angle with the first end.

EXAMPLE III

The end face of the second end of the conductive substrate is set to be an inclined plane, so that the second end of the conductive substrate has an inclined three-dimensional structure, the inclined plane is relative to the horizontal reference plane, and a plane forming a certain included angle with the horizontal reference plane is the inclined plane.

As shown in fig. 8, the second end of the conductive substrate has an inclined three-dimensional structure, including: the end surface b of the second end of the conductive substrate 12 is a slope. In this case, when the laser stack array is formed, the lengths of the conductive substrates may be different and may be increased or decreased in a certain rule.

In this embodiment, the inclined solid structure (inclined surface) has an angle with the first end, i.e. is inclined with respect to the first end.

Example four

Based on the third embodiment, as shown in fig. 9, when the end face b of the second end of the conductive substrate 12 is an inclined surface, a fixed substrate having an inclination matching the inclined surface may be further disposed on the inclined surface, and the fixed substrate 13 is bonded to the conductive substrate 12.

In this case, when a laser stack array is formed, the lengths of the conductive substrates may be different and gradually increased or decreased according to a certain rule, and the lengths of the fixed substrates 13 are the same; alternatively, the lengths of the conductive substrates may be the same, the lengths of the fixed substrates 13 may be different, and the lengths may be increased or decreased in a certain rule, or in the case of being capable of matching with a heat sink for bonding, other forms are also possible.

Based on above embodiment, the utility model also provides a laser stack matrix, laser stack matrix include more than a plurality of laser unit, unable adjustment base, a plurality of laser unit bonded in unable adjustment base is last.

In the embodiment of the present invention, the fixing base is a heat sink 16, a plurality of laser units are bonded on the heat sink 16, the heat sink 16 is further used for dissipating heat of the plurality of laser units. As described above, the lengths of the conductive substrates in the plurality of laser units may be equal or different, for example, fig. 8 and 9 show the case where the lengths of the conductive substrates are different, and the other figures show the case where the lengths of the conductive substrates are equal, and the length of the conductive substrate is the distance from the end face a of the first end a to the end face B of the second end B of the conductive substrate.

As shown in the drawing, in the area where the heat sink 16 is located, a buffer layer 14 is further disposed between the inclined three-dimensional structures of the plurality of laser units, and is used for tolerating deformation generated during the bonding process, and simultaneously, stress of the laser chip can be released, the buffer layer 14 is the same as the buffer layer in the aforementioned "the buffer layer is disposed on at least one of the two side surfaces of the inclined three-dimensional structure", and is considered as the same buffer layer to a certain extent, and friction force is formed between the buffer layer 14 and the contact surface of the inclined three-dimensional structure, so that fixation is achieved.

The thickness and shape of the buffer layers 14 at the two ends of the laser stack array are determined according to the spacing and the gap between the whole of the laser units and the heat sink, and the thickness and the shape of the buffer layers 14 between the adjacent laser units are determined according to the spacing and the gap between the adjacent inclined three-dimensional structures.

And a heat conduction film 15 is also arranged on the bonding interface of the laser units and the heat sink and is used for promoting the heat conduction between the laser units and the heat sink and improving the heat dissipation.

The heat sink and the plurality of laser units are usually mechanically and fixedly connected, and the mechanical and fixed connection mode may specifically include, but is not limited to: threaded connection, interference fit, elastic sheet fastening, expansion with heat and contraction with cold, and no pressing block.

Specifically, the threaded connection can be implemented by arranging screw holes and external bolts at the pressing blocks on the two sides of the heat sink for fixation, as shown in fig. 12, the areas indicated by dotted lines are the screw holes and the bolts; the interference fit is realized through the heat sink, the pressing blocks on the two sides of the heat sink are provided with bulges, notches are arranged at corresponding positions on the heat sink body according to the error requirement of the interference fit, and the bulges are just inserted into the notches in an interference fit manner, as shown in figure 13; the elastic sheet fastening type is that a plurality of elastic sheets 18 are arranged in gaps between the heat sink and the plurality of laser units, as shown in fig. 14; the thermal expansion and cold shrinkage type heats the heat sink during assembly, the heat sink is made of metal with a large thermal expansion coefficient, the size of the heat sink is increased during heating, a plurality of laser units are placed in the heat sink (U-shaped openings in the figure) at the moment, and the laser units shrink after cooling to realize fixation, as shown in figure 15; the non-pressure block type has no downward fastening of the pressure blocks on two sides of the heat sink, but the buffer layers 14 have certain friction force, and the buffer layers 14 on two sides can still be fixed in the transverse and longitudinal directions by applying certain pretightening force in the assembling process, as shown in fig. 16.

When the heat sink 16 is mechanically and fixedly connected with the plurality of laser units, the heat sink 16 and the plurality of laser units can be perpendicular to each other, as shown in fig. 4 to 7 and 10, and the pressing direction of the heat sink 16 is parallel to the stacking direction of the plurality of laser units when the heat sink is fixed; alternatively, the heat sink 16 and the plurality of laser units may be disposed obliquely (i.e., not perpendicular) to each other, as shown in fig. 8 and 9, in which case the pressing direction of the heat sink 16 is at an angle to the stacking direction of the plurality of laser units when the plurality of laser units are fixed.

The embodiment of the utility model provides an in, the terminal surface an of the first end A of each electrically conductive substrate can also be the inclined plane for the plane, and the terminal surface B of second end B can the adaptability directly set up to inclined plane or plane in above scheme.

Further, the buffer layer 14 may include, but is not limited to: each buffer layer 14 is in contact with the inclined three-dimensional structure of the adjacent laser unit, and is fixed to a certain extent; the inclined three-dimensional structure may be an inclined cube with a parallelogram section, as shown in fig. 3 to 6, or an inclined cube with a trapezoid section, as shown in fig. 10.

Fig. 11 is the force diagram of the inclined three-dimensional structure of the present invention, as shown in fig. 11, the multiple laser units are packaged and fixed on the heat sink, the positive pressure applied to the two planes when the two inclined planes are fixed is about the inclined three-dimensional structure perpendicular to the inclined three-dimensional structure, the upward force of the bottom surface of the vertical three-dimensional structure is applied to the inclined three-dimensional structure for the bottom surface, the force parallel to the two inclined planes about the three-dimensional structure is two friction forces applied to the inclined three-dimensional structure by the buffer layers 14 on the two sides, and the above forces can at least realize sufficient fixation of the inclined three-dimensional structure and each laser unit.

The utility model discloses in all above embodiments, the both sides surface (S1, S2) of slope spatial structure are the inclined plane, assume to use the horizontal direction as the direction of application, the both sides surface of slope spatial structure is the stress surface of application of force on the horizontal direction, the power of applying on the slope spatial structure acts on the inclined plane perpendicularly, the power on this perpendicular to inclined plane can be decomposed into horizontal direction and vertical direction' S component, consequently can produce the power on the vertical direction, when the direction of application of force is not along the horizontal direction, basically similar with above-mentioned thinking.

Further, both side surfaces of the inclined three-dimensional structure may have roughness capable of generating friction with other structures or surfaces in contact.

Specifically, for a single laser unit, in the situation where the requirement on stability is high or the application is severe, a buffer layer may be disposed on at least one of two side surfaces of the inclined three-dimensional structure, the buffer layer contacts with the corresponding surface to generate a friction force for fixing, the direction of the friction force is parallel to the inclined surface, and the friction force may also be decomposed into component forces in the horizontal direction and the vertical direction, thereby facilitating further fixing of the laser unit and the stacked array to meet the high-standard fixing requirement and application, in which case a plurality of laser units may directly form the stacked array.

In the situation that the stability is not high or the application is not harsh, the corresponding technical effect can be realized by directly and independently applying force to the stress surface, namely, no buffer layer is arranged, in this case, the fixing base with the U-shaped structure in the figures 12-15 is needed when the plurality of laser units form the stacked array, at this time, although no buffer layer transmits external force for fixing in the direction of the inclined three-dimensional structure, the two end parts at the opening of the U-shaped fixing base can be utilized to contact the surfaces of the conducting substrates at the two ends, and the external force is applied to the surfaces of the two conducting substrates which are contacted by the two end parts at the opening of the U-shaped fixing base so as to realize the fixation.

It should be noted that, the slope spatial structure of laser unit is as the atress body of external application of force, and the final vertical direction's that acts on it power and the roughness size on its both sides surface, the roughness on buffer layer surface, the external force of acting on its both sides surface, slope spatial structure's oblique angle etc. all have the relation to still need consider laser unit and fold factors such as influence of external force in the application scene of battle array, this part need the various conditions of integrated consideration carry out accurate detailed calculation, not the utility model discloses the key technical point of key explanation, the utility model discloses do not too much to this describe.

The main body to which the external force is applied may be a fixing base or a heat sink described below, or may have another form, and in principle, the main body is not particularly limited as long as the external force can be applied to the laser unit.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. A laser unit, comprising: a laser chip, a conductive substrate comprising a first end and a second end, wherein,

the side face of the first end of the conductive substrate is bonded with the laser chip, and the second end of the conductive substrate is provided with a three-dimensional structure inclined relative to the first end.

2. The laser unit of claim 1, wherein the second end of the conductive substrate has a slanted spatial configuration relative to the first end, comprising:

the second end of the conductive substrate is provided with a fixed substrate which is obliquely arranged relative to the first end, and the conductive substrate and the obliquely arranged fixed substrate are in a broken line shape.

3. The laser unit of claim 1, wherein the second end of the conductive substrate has a slanted spatial configuration relative to the first end, comprising:

the second end of the conductive substrate is provided with an extension part, the extension part is obliquely arranged relative to the first end, and the extension parts of the first end and the second end of the conductive substrate are in a zigzag shape.

4. The laser unit of claim 1, wherein the second end of the conductive substrate has a slanted spatial structure with respect to the first end, comprising: the end surface of the second end of the conductive substrate is an inclined surface.

5. Laser unit according to claim 4, characterized in that there is a stationary substrate with matching inclination at the bevel.

6. The laser unit according to any of claims 1 to 5, wherein the second end of the electrically conductive substrate has a width of the slanted solid structure that is less than or equal to a width of the first end of the electrically conductive substrate.

7. The laser unit according to claim 6, wherein both side surfaces of the tilted solid structure have roughness.

8. The laser unit according to claim 7, wherein a buffer layer is provided on at least one of both side surfaces of the inclined solid structure, the buffer layer being in contact with a corresponding surface to generate a frictional force for fixation.

9. A laser stack comprising a plurality of laser units as claimed in any one of claims 1 to 8, a fixture base to which the plurality of laser units are bonded.

10. The laser stack array of claim 9, wherein the mounting base is mechanically fixed to the plurality of laser units, and the mounting base and the plurality of laser units are perpendicular or inclined to each other.

Images