JPS63183262U - - Google Patents

Info

Publication number
JPS63183262U
JPS63183262U JP7423987U JP7423987U JPS63183262U JP S63183262 U JPS63183262 U JP S63183262U JP 7423987 U JP7423987 U JP 7423987U JP 7423987 U JP7423987 U JP 7423987U JP S63183262 U JPS63183262 U JP S63183262U
Authority
JP
Japan
Prior art keywords
target
sputtering device
plate
backing plate
mounting structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7423987U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7423987U priority Critical patent/JPS63183262U/ja
Publication of JPS63183262U publication Critical patent/JPS63183262U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Physical Vapour Deposition (AREA)
JP7423987U 1987-05-18 1987-05-18 Pending JPS63183262U (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7423987U JPS63183262U (fr) 1987-05-18 1987-05-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7423987U JPS63183262U (fr) 1987-05-18 1987-05-18

Publications (1)

Publication Number Publication Date
JPS63183262U true JPS63183262U (fr) 1988-11-25

Family

ID=30919269

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7423987U Pending JPS63183262U (fr) 1987-05-18 1987-05-18

Country Status (1)

Country Link
JP (1) JPS63183262U (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003027227A (ja) * 2001-07-23 2003-01-29 Dainippon Printing Co Ltd スパッタリング用ターゲット
WO2012036079A1 (fr) * 2010-09-15 2012-03-22 シャープ株式会社 Procédé pour la fabrication d'un dispositif à semi-conducteurs

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6096760A (ja) * 1983-11-01 1985-05-30 Ulvac Corp スパツタリングタ−ゲツト装置
JPS61166964A (ja) * 1985-01-18 1986-07-28 Tokuda Seisakusho Ltd スパツタリング用タ−ゲツト

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6096760A (ja) * 1983-11-01 1985-05-30 Ulvac Corp スパツタリングタ−ゲツト装置
JPS61166964A (ja) * 1985-01-18 1986-07-28 Tokuda Seisakusho Ltd スパツタリング用タ−ゲツト

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003027227A (ja) * 2001-07-23 2003-01-29 Dainippon Printing Co Ltd スパッタリング用ターゲット
WO2012036079A1 (fr) * 2010-09-15 2012-03-22 シャープ株式会社 Procédé pour la fabrication d'un dispositif à semi-conducteurs
US8753921B2 (en) 2010-09-15 2014-06-17 Sharp Kabushiki Kaisha Manufacturing method for semiconductor device

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