JPS63183262U - - Google Patents
Info
- Publication number
- JPS63183262U JPS63183262U JP7423987U JP7423987U JPS63183262U JP S63183262 U JPS63183262 U JP S63183262U JP 7423987 U JP7423987 U JP 7423987U JP 7423987 U JP7423987 U JP 7423987U JP S63183262 U JPS63183262 U JP S63183262U
- Authority
- JP
- Japan
- Prior art keywords
- target
- sputtering device
- plate
- backing plate
- mounting structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004544 sputter deposition Methods 0.000 claims description 3
- 239000007767 bonding agent Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7423987U JPS63183262U (fr) | 1987-05-18 | 1987-05-18 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7423987U JPS63183262U (fr) | 1987-05-18 | 1987-05-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63183262U true JPS63183262U (fr) | 1988-11-25 |
Family
ID=30919269
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7423987U Pending JPS63183262U (fr) | 1987-05-18 | 1987-05-18 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63183262U (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003027227A (ja) * | 2001-07-23 | 2003-01-29 | Dainippon Printing Co Ltd | スパッタリング用ターゲット |
WO2012036079A1 (fr) * | 2010-09-15 | 2012-03-22 | シャープ株式会社 | Procédé pour la fabrication d'un dispositif à semi-conducteurs |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6096760A (ja) * | 1983-11-01 | 1985-05-30 | Ulvac Corp | スパツタリングタ−ゲツト装置 |
JPS61166964A (ja) * | 1985-01-18 | 1986-07-28 | Tokuda Seisakusho Ltd | スパツタリング用タ−ゲツト |
-
1987
- 1987-05-18 JP JP7423987U patent/JPS63183262U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6096760A (ja) * | 1983-11-01 | 1985-05-30 | Ulvac Corp | スパツタリングタ−ゲツト装置 |
JPS61166964A (ja) * | 1985-01-18 | 1986-07-28 | Tokuda Seisakusho Ltd | スパツタリング用タ−ゲツト |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003027227A (ja) * | 2001-07-23 | 2003-01-29 | Dainippon Printing Co Ltd | スパッタリング用ターゲット |
WO2012036079A1 (fr) * | 2010-09-15 | 2012-03-22 | シャープ株式会社 | Procédé pour la fabrication d'un dispositif à semi-conducteurs |
US8753921B2 (en) | 2010-09-15 | 2014-06-17 | Sharp Kabushiki Kaisha | Manufacturing method for semiconductor device |
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