JPS63182269A - Method of adhering metal to ceramic - Google Patents
Method of adhering metal to ceramicInfo
- Publication number
- JPS63182269A JPS63182269A JP1140387A JP1140387A JPS63182269A JP S63182269 A JPS63182269 A JP S63182269A JP 1140387 A JP1140387 A JP 1140387A JP 1140387 A JP1140387 A JP 1140387A JP S63182269 A JPS63182269 A JP S63182269A
- Authority
- JP
- Japan
- Prior art keywords
- short
- fibers
- metal
- bonding
- inorganic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 title claims description 25
- 239000002184 metal Substances 0.000 title claims description 25
- 238000000034 method Methods 0.000 title claims description 15
- 239000000919 ceramic Substances 0.000 title claims description 13
- 239000000853 adhesive Substances 0.000 claims description 21
- 230000001070 adhesive effect Effects 0.000 claims description 21
- 239000000835 fiber Substances 0.000 claims description 21
- 229910001220 stainless steel Inorganic materials 0.000 claims description 8
- 239000010935 stainless steel Substances 0.000 claims description 8
- 230000001788 irregular Effects 0.000 claims description 4
- 239000012790 adhesive layer Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 6
- 239000011230 binding agent Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000008646 thermal stress Effects 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 239000002585 base Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910019142 PO4 Inorganic materials 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000004568 cement Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 2
- 239000010452 phosphate Substances 0.000 description 2
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910052910 alkali metal silicate Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229920000592 inorganic polymer Polymers 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 235000019353 potassium silicate Nutrition 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Landscapes
- Ceramic Products (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、熱＊Ｉ］！係数が異なる金属とセラミックス
とを接着する方法に関し、特に耐熱性を要求される場合
に有効に適用される。[Detailed Description of the Invention] (Industrial Field of Application) The present invention provides heat *I]! The present invention relates to a method of bonding metals and ceramics with different coefficients, and is particularly effectively applied when heat resistance is required.
（従来の技術）
有機高分子系接着剤は、多様な分野において多量に使用
されているが、その最高使用温度はたかだか２００℃で
ある。(Prior Art) Organic polymer adhesives are used in large quantities in various fields, but their maximum operating temperature is at most 200°C.
近年、電機拳電子工業、窯業などにおいて、より高温で
の接着が要求される分野では＃熱性を有する無機系接着
剤の需要が拡大しつつある。In recent years, demand for inorganic adhesives with thermal properties is increasing in fields that require bonding at higher temperatures, such as in the electronics industry and the ceramics industry.
無機系接着剤には、低融点ガラス、ハンダ、セメント等
が古くから使用されているが、このうち前二者は、接着
に際して接着剤の融点以上の温度で施グする必要があり
、また使用温度は融点以下でなければならないという制
約がある。また、セメントは接着剤が水和物であり、そ
の結晶水が失われない温度以下という比較的低温度望域
でしか使用できない。Low melting point glass, solder, cement, etc. have been used as inorganic adhesives for a long time, but the first two need to be applied at a temperature higher than the melting point of the adhesive, and are difficult to use. There is a restriction that the temperature must be below the melting point. In addition, the adhesive in cement is a hydrate, and it can only be used in a relatively low temperature range below the temperature at which the water of crystallization is not lost.
一方、（１）珪醜アルカリ、燐酸塩、シリカゾルなどの
無機バインダー、（２）バインダーの硬化を促進する硬
化剤、及び（３）充填剤とから構成される無機質接着剤
は、比較的低温で硬化させることにより耐熱性無機高分
子の接着層を生成することができ、その耐熱温度も種類
によっては２０００°Ｃ以上もあり、最近注目を浴びて
いる。On the other hand, inorganic adhesives consisting of (1) an inorganic binder such as a silicon alkali, phosphate, or silica sol, (2) a curing agent that accelerates the curing of the binder, and (3) a filler can be used at relatively low temperatures. By curing, it is possible to produce a heat-resistant inorganic polymer adhesive layer, and its heat resistance temperature can exceed 2000°C depending on the type, and has recently attracted attention.
無機質接着剤は、その優れた耐熱性の反面、有機系接着
剤に較べて、気密性、耐衝撃性、可撓性、耐水性などが
劣るという欠点がある。Although inorganic adhesives have excellent heat resistance, they have the disadvantage that they are inferior in airtightness, impact resistance, flexibility, water resistance, etc., compared to organic adhesives.
例えば、 ３００°Ｃ以上の温度履歴がかかるというよ
うなところで、しかも線膨ｌＩ！率が著しく異なる金属
とセラミックスとを接着する場合には、温度履歴により
、接着部が剥離してしまう場合が多い。For example, in a place where a temperature history of 300°C or more is applied, linear expansion lI! When bonding metals and ceramics that have significantly different bonding rates, the bonded portion often peels off due to temperature history.
上記の様な場合、従来の無機質接着剤ではその接着剤の
バインダー硬化剤、充填剤の組成の構成を変えて対応し
ようという研究も多くなされているが、完全に接着する
ことが極めて困難であるというのが現状である。Many studies have been conducted to address the above-mentioned cases by changing the binder, curing agent, and filler composition of conventional inorganic adhesives, but it is extremely difficult to achieve complete adhesion. That is the current situation.
（発明が解決しようとする問題点）
本発明は、上記問題点を解決するためになされたもので
あり、金属とセラミックスとを接着するに際し、従来の
接着剤、接着方法では、接着力が不十分な場合における
接着方法の改善を目的とする。(Problems to be Solved by the Invention) The present invention has been made to solve the above problems, and when bonding metal and ceramics, conventional adhesives and bonding methods lack adhesive strength. The aim is to improve bonding methods in sufficient cases.
（問題点を解決するための手段）
本発明の要旨は、無機質接着剤の層を介して金属とセラ
ミックスとを接着する方法において、金属短繊維を含有
する無機質接着剤を使用する事を特徴とする金属とセラ
ミックスとの接着方法である。金属短繊維としては、用
途や経済性などに応じて、例えば銅、鉄、ステンレス、
タングステンなど任意に選択できる。(Means for Solving the Problems) The gist of the present invention is a method for bonding metal and ceramics through a layer of inorganic adhesive, characterized by using an inorganic adhesive containing short metal fibers. This is a method of bonding metal and ceramics. Short metal fibers include copper, iron, stainless steel, etc., depending on the purpose and economic efficiency.
You can select any material such as tungsten.
これらの短繊維の断面形状としては、通常使用される細
線のように、円形であってもよいが、異形即ち円形や楕
円以外の複雑な形状をしていることが好ましい、この場
合、短ｍ雄の表面積が大きく、それだけ奏せられる効果
も大きい。The cross-sectional shape of these short fibers may be circular like normally used thin wires, but it is preferable that they have an irregular shape, that is, a complex shape other than a circle or an ellipse. The male has a larger surface area, and the effect it can produce is greater.
異形断面を有する短繊維の製造方法の一例を、ステンレ
ス短繊維を例にとって説明する。An example of a method for producing short fibers having an irregular cross section will be explained using stainless steel short fibers as an example.
ステンレス丸棒からの切削加工時に、びびり振動現象を
利用して直接切削分離するもので、ステンレス短繊維の
径は切削速度、送り等の切削条件と工具振動数とによっ
て決まり、長さは基本的に一定となる。During cutting from a stainless steel round bar, the chatter vibration phenomenon is used to directly cut and separate the short fibers.The diameter of the short stainless steel fibers is determined by the cutting conditions such as cutting speed and feed, and the tool vibration frequency, and the length is basically becomes constant.
本発明において、使用されるステンレス短繊維の換算直
径は２０〜５００＃Ｌ、Ｉｎ、標準長さは１〜１０ｍｍ
程度が好ましい。In the present invention, the converted diameter of the stainless steel short fibers used is 20 to 500 #L, In, and the standard length is 1 to 10 mm.
degree is preferred.
本発明に使用される金属短繊維の製法は、上記の方法に
限定されないことは当然である。Naturally, the method for producing the short metal fibers used in the present invention is not limited to the above method.
また、接着剤層中に占める金属短繊維の比率は３〜３０
重量％が好ましく、これ以下では添加効果に乏しく、こ
れ以上になると流動性が失われることにより接着の作業
性が著しく損われる。In addition, the ratio of short metal fibers in the adhesive layer is 3 to 30.
The weight percentage is preferable; if the amount is less than this, the addition effect will be poor, and if it is more than this, the fluidity will be lost and the workability of adhesion will be significantly impaired.
本願発明の実施に際しては、金属短繊維は無機質接着剤
に予め添加混合して用いるのが好ましいが、場合によっ
ては接着時に別個の両者を複合しながら用いる事も可能
である。When carrying out the present invention, it is preferable to use the short metal fibers by adding them to the inorganic adhesive in advance, but in some cases, it is also possible to use the two in combination at the time of adhesion.
本発明は、基材がセラミックスであり、この表面に金属
を接着する場合と、この逆に基材が金属であり、その表
面にセラミックスを接着する場合のいずれの場合におい
ても有効に適用することができる。The present invention can be effectively applied to both cases where the base material is a ceramic and a metal is bonded to the surface thereof, and vice versa, where the base material is a metal and a ceramic is bonded to the surface of the base material. Can be done.
本発明における無機質接着剤としては、従来知られてい
る珪酸アルカリ、燐酸塩、シリカゾルなどの無機バイン
ダーとバインダーの硬化を促進する硬化剤、充填剤から
構成されるものを有効に用いる事ができる。As the inorganic adhesive in the present invention, those consisting of a conventionally known inorganic binder such as an alkali silicate, phosphate, or silica sol, a curing agent that accelerates the curing of the binder, and a filler can be effectively used.
（作用）
金属はセラミックスに較べると、一般に熱ｍ張係数が著
しく大きく、従って特に両者の接着物を高温度下で使用
する場合には、接着剤層及び接着の界面には大きな熱応
力が発生する。通常の無機質接着剤のみからなる接着層
では、この熱応力に抗しきれずクランクが発生し、この
クラックが大きく成長して剥離する。(Function) Compared to ceramics, metals generally have significantly higher thermal tensile coefficients, and therefore, especially when bonding the two together at high temperatures, large thermal stress occurs at the adhesive layer and the bonding interface. do. An adhesive layer made only of ordinary inorganic adhesives cannot withstand this thermal stress and cracks occur, and the cracks grow large and peel off.
本発明における金属短！＠雄の効果は、無機質接着剤層
を補強し、熱応力によるクラックの発生を防ぐと共に、
熱応力が一定以上となりクラックが発生しても、そのク
ラックが成長し、金属短繊維にぶつかって止まることに
ある。また、クラックを多数の微少クラックに分散させ
熱応力を吸収、分散せしめ、結果的に剥離を防止する役
割を果していると説明される。尚、通常の円形断面の金
属短繊維においてもこれらの効果は発揮されるが、異形
断面をもつ金属短繊維においては、接着層との接着がよ
り優れており、これらの効果はさらに大きい。Metal short in the present invention! The effect of @male is to reinforce the inorganic adhesive layer and prevent cracks from occurring due to thermal stress.
Even if the thermal stress exceeds a certain level and a crack occurs, the crack grows and stops when it collides with the short metal fibers. It is also explained that it disperses cracks into a large number of minute cracks, absorbs and disperses thermal stress, and as a result plays a role in preventing peeling. Although these effects are exhibited even with ordinary short metal fibers having a circular cross section, short metal fibers having an irregular cross section have better adhesion to the adhesive layer, and these effects are even greater.
（実施例及び比較例）
以下に実施例及び比較例により本発明の方法を更に詳細
に説明するが、本発明はこれらの実施例の方法に限定さ
れるものではない。なお、実施例及び比較例中の部は重
量部を示す。(Examples and Comparative Examples) The method of the present invention will be explained in more detail below using Examples and Comparative Examples, but the present invention is not limited to the method of these Examples. Note that parts in Examples and Comparative Examples indicate parts by weight.
実施例
水ガラス３号４０部、ジルコニア（平均径５０色）４２
部、アルミナ（平均径１０ル） １５部、水３部よりな
る無機質接着剤中にびびり振動切削したステンレス短繊
維（換算直径４０ル、長さ３ｍｍ）を２５部添加し、よ
く混合したものを用いて、５Ｓ４１の鉄板（５０Ｘ
１００Ｘ ３ｍｍ厚み）上に焼結アルミナ板（２０Ｘ
２０Ｘ ３ｍｍ厚み）を８枚、目地幅１ｍｍで接着し
た。−昼夜放置後１５０ ’０で１時間キュアーを行な
い接着剤層を充分硬化せしめた。Example: 40 parts of water glass No. 3, 42 parts of zirconia (average diameter: 50 colors)
25 parts of short stainless steel fibers cut by chatter vibration (equivalent diameter: 40 l, length: 3 mm) were added to an inorganic adhesive consisting of 15 parts of alumina (average diameter: 10 l), and 3 parts of water, and mixed well. Using a 5S41 iron plate (50X
100X 3mm thick) on top of a sintered alumina plate (20X
20×3mm thick) were glued together with a joint width of 1mm. - After being left for day and night, the adhesive layer was cured for 1 hour at 150'0 to fully cure the adhesive layer.
比較例
ステンレス短繊維を添加せず、上記無機質接着剤のみを
用い、他の条件は同一で接着を行った。Comparative Example Bonding was carried out using only the above-mentioned inorganic adhesive without adding short stainless steel fibers and under the same conditions as above.
両者（実施例及び比較例）について、室温６００°Ｃの
昇温降温を繰り返し、接着部の状況を観察した。両者の
比較を第１表に示す。For both (Example and Comparative Example), the temperature was repeatedly raised and lowered from room temperature to 600°C, and the state of the bonded portion was observed. A comparison between the two is shown in Table 1.
第 １ 表
（発明の効果）
本発明の方法によれば、金属とセラミックスとを強固に
接着することができ、この接着物は高温下での使用に耐
えるだけでなく、繰り返しの熱履歴にも優れた耐久性を
示す。Table 1 (Effects of the Invention) According to the method of the present invention, it is possible to firmly bond metals and ceramics, and this bonded material not only withstands use under high temperatures but also withstands repeated thermal history. Shows excellent durability.
Claims (1)
接着する方法において、金属短繊維を含有する無機質接
着剤を使用する事を特徴とする金属とセラミックスとの
接着方法。 ２、金属短繊維がステンレス短繊維であることを特徴と
する特許請求の範囲第１項記載の方法。 ３、金属短繊維が異形断面を有することを特徴とする特
許請求の範囲第１項記載の方法。 ４、金属短繊維を３〜３０重量％含有する無機質接着剤
を使用することを特徴とする特許請求の範囲第１項記載
の方法。[Claims] 1. A method for bonding metal and ceramics using an inorganic adhesive containing short metal fibers in the method of bonding metal and ceramics through a layer of inorganic adhesive. . 2. The method according to claim 1, wherein the metal short fibers are stainless steel short fibers. 3. The method according to claim 1, wherein the short metal fibers have an irregular cross section. 4. The method according to claim 1, characterized in that an inorganic adhesive containing 3 to 30% by weight of short metal fibers is used.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1140387A JPS63182269A (en) | 1987-01-22 | 1987-01-22 | Method of adhering metal to ceramic |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1140387A JPS63182269A (en) | 1987-01-22 | 1987-01-22 | Method of adhering metal to ceramic |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63182269A true JPS63182269A (en) | 1988-07-27 |
Family
ID=11777050
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1140387A Pending JPS63182269A (en) | 1987-01-22 | 1987-01-22 | Method of adhering metal to ceramic |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63182269A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6445780A (en) * | 1987-08-12 | 1989-02-20 | Shinagawa Refractories Co | Method for bonding material having different thermal expansion coefficients |
-
1987
- 1987-01-22 JP JP1140387A patent/JPS63182269A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6445780A (en) * | 1987-08-12 | 1989-02-20 | Shinagawa Refractories Co | Method for bonding material having different thermal expansion coefficients |
| JPH0466832B2 (en) * | 1987-08-12 | 1992-10-26 | Shinagawa Refractories Co |
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