JPS63177433A - Detecting method for parallelism of stage to bonding tool - Google Patents

Abstract

PURPOSE:To easily, accurately detect a parallelism in an actual manner by placing a bump transfer board in which a heat resistant resin film is bonded onto a stage, and thermally pressing the board by a bonding tool to detect the parallelism from the state of the board. CONSTITUTION:A method for detecting the parallelism of a stage 3 set on a table 1 to a bonding tool 9 for TAB-connecting a semiconductor chip placed on the stage 3 to a film carrier comprises placing a bump transfer board 7 in which a heat resistant resin film is bonded onto the stage 3, and thermally pressing the board 7 by the tool 9 to detect the parallelism from the state of the board 7. For example, a resin film 15 is bonded with an adhesive onto the board 7. Then, the board 7 is placed on the stage 3 to thermally press it by the tool 9. As a result, the pressing mark 17 of the tool face 11 is formed on the film 15, and the parallelism is detected by observing the mark 17.

Description

[Detailed Description of the Invention] [Objective of the Invention] (Industrial Application Field) The present invention provides a bonding tool that connects a semiconductor chip to a film carrier using, for example, a tape carrier method, and a stage on which the semiconductor chip is placed. The present invention relates to a parallelism detection device.

(Prior Art) In recent years, with the development of semiconductor technology, semiconductor chips have become thinner and more densely packaged due to the demand for smaller and more highly functional electronic devices. As a means for realizing this thin, high-density packaging, there is, for example, the so-called tape carrier method (TAB) in which a semiconductor chip is mounted on a film carrier.

As shown in FIG. 4, in this tape carrier method, a semiconductor chip 105 is placed 6X on a stage 103 placed on a table 101, and the semiconductor chip 105 is
After aligning the holes 109 formed in the film carrier 107, the electrode pads 1 of the semiconductor chip 105 are aligned with the tool surface 113 of the bonding tool 111.
15 and the lead 117 of the film carrier 107 are heated and pressed to form a metal eutectic bond. In addition, 11
8 is a bump as a connection medium.

Incidentally, since the connection between the electrode pad 115 and the lead 117 is made within a distance of several tens of micrometers, high accuracy (on the order of several microliters) is required for the parallelism between the stage 103 and the bonding tool 111. That is, if the two are relatively inclined, for example, the pressure applied to each lead 117 will be unevenly distributed, and there is a risk that a so-called uneven contact phenomenon will occur in which the lead 117 and the electrode pad 115 are not connected. In such a case, there is a problem that some portions of the electrode pads 115 of the semiconductor chip 105 are not connected to the outside, and the semiconductor chip 105 does not function normally.

Furthermore, if the stage 103 and the bonding tool 111 are tilted relative to each other, there is a risk that the edge of the semiconductor chip 105 and the leads 117 will come into contact with each other, causing a so-called edge shoot.

Further, the pan 7118 is transferred to the lead 117 of the film carrier 107 as shown in FIG. 9, for example. First, the bump transfer plate 120 on which the bumps 118 are formed is placed on the stage 103, and on the other hand, the film carrier 107 is placed on the stage 103. After this stage 103 is raised to the position indicated by the two-dot chain line in the figure, the bonding tool 111 heated to a predetermined temperature is processed, and the lead 117 is heated and pressed against the bump 118 to cause a eutectic bonding reaction, etc. will be carried out.

Even in this case, stage 103 and bonding tool 1
If the leads 11 are tilted relative to each other, the pressure applied to the leads 117 will be unevenly distributed, resulting in poor transfer.

In contrast, the conventional detection of parallelism between the stage 103 and the bonding tool 111 is as shown in FIGS. 5 and 6, for example.
This is done as shown in the figure.

That is, the feeler gauge 11.9 is placed on the stage 103, and the tool surface 113 of the heated bonding tool 111 is pressed against the feeler gauge 119. For example, a polyimide film 121 is connected to the feeler gauge 119 with an adhesive 123, and the impression 125 of the tool surface 113 formed on the feeler gauge 119 or the adhesive 1
23, the parallelism is detected by observing the condition.

On the other hand, as shown in FIGS. 7 and 8, there is also a method of using a film 129 coated with a hot-melt adhesive 127 on the stage 103 instead of the feeler gauge 119.

However, in such a conventional method of detecting the parallelism between the stage 103 and the bonding tool 111, if the clearance gauge 119 is placed on the stage 103 with different parallelisms, For example, there is a risk that the parallelism will be different from that when the bumps 118 are actually transferred from the bump transfer plate 120, and the intermediate gap gauge 119 requires special skill to detect the parallelism in the width direction in accordance with the actual situation. Ta.

Furthermore, when the film 129 is used, since the film 129 is a thin film, it tends to have curls or other irregularities in shape, and this irregularity affects the melting state of the adhesive 127, making it difficult to accurately detect parallelism. .

Furthermore, whether the feeler gauge 119 is used or the film 129 is used, the bonding tool 1
The area for detecting the impressions 125, etc. of No. 11 is small, and in order to obtain a plurality of pieces of data, a complicated process of replacing the feeler gauge 119 or the film 129 is required.

(Problems to be Solved by the Invention) As described above, the conventional method for detecting the parallelism between the stage 103 and the bonding tool 111 is to This is done by observing the impression made by pressing 127.

For this reason, skill is required to accurately detect parallelism in practice, and complicated work steps are required to obtain a plurality of pieces of data.

The present invention has been made in view of the above-mentioned problem, and an object of the present invention is to provide a method for detecting parallelism between a stage and a bonding tool, which can easily detect parallelism accurately in practice.

[Structure of the Invention] (Means for Solving the Problems) This invention was made in view of the above problems, and includes a stage installed on a table and a semiconductor chip placed on the stage. A method for detecting the parallelism between a bonding tool and a bonding tool for TAB-connecting a film carrier to a film carrier, the bump transfer board having a heat-resistant resin film adhered to it is placed on the stage, and the bump transfer board is connected to the bonding tool. The parallelism was detected from the state of the bump transfer plate by heating and pressing with a tool.

(Function) In the above configuration, a heat-resistant resin film is adhered to the bump transfer plate, and the bump transfer plate is placed on a stage and heated and pressed using a bonding tool. Then, the parallelism between the stage and the bonding tool is detected from the state of the bump transfer plate.

(Example) ゛Examples of the present invention will be described in detail below based on the drawings.

1 to 3 show a method for detecting parallelism between a stage and a bonding tool according to an embodiment of the present invention. Here, FIG. 1 is a schematic overall configuration diagram of this invention,
FIG. 2 is an enlarged perspective view of the bump transfer plate, and FIG. 3 is an explanatory diagram of the operation of the bonding tool.

In FIG. 1, a stage 3 is installed on a table 1 so as to be movable in the X-axis direction and the Y-axis direction in FIG. A flat surface 5 is formed on the upper part of the stage 3, and a bump transfer plate 7 is vacuum-adsorbed onto this flat surface 5 by a vacuum suction device (not shown).

A bonding tool 9 is provided above the stage 5. The bonding tool 9 is a ram part (not shown)
It is supported so as to be movable in the Y-axis direction and the Z-axis direction in FIG. 1, and is configured to be able to press the bump transfer plate 7 on the stage 3 from above, as shown in FIG. 3. Further, a tool surface 11 whose surface is polished is formed at the lower part of the tip of the bonding tool 9.

The bump transfer plate 7 is made of, for example, a general glass wafer on which bumps can be formed, and has approximately the same outer diameter as the stage 3. An adhesive 13 is thinly applied to the entire surface of the bump transfer plate 7, and a heat-resistant resin film 15 such as a polyimide film is adhered thereto. Therefore, the resin film 15 reproduces the flat surface 5 of the stage 3 under substantially the same conditions.

Next, the effect will be explained.

In the above configuration, the stage 3 and the bonding tool 9
To detect the parallelism with first,
A resin film 15 is adhered onto the bump transfer plate 7 using an adhesive 13. Then, this bump transfer plate 7 is placed on the stage 3 and heated and pressed by the bonding tool 9. As a result, an indentation 17 of the tool surface 11 is formed on the resin film 15, and by observing this indentation 17, parallelism is detected.

Furthermore, if the adhesive 13 is made of a material having a melting point that melts at the heating temperature of the bonding tool 9, the indentation 1
Parallelism can also be detected by observing the melted state of the adhesive 13 under the adhesive 7.

As described above, in this embodiment, the bump transfer plate 7 that is actually used is used to connect the stage 3 and the bonding tool 9.
Since the parallelism between the bump transfer plate 7 and the bump transfer plate 7 is detected, accurate parallelism can be detected under the same conditions as when the bump transfer plate 7 is actually used.

Further, since the resin film 15 is bonded to the bump transfer plate 7 with the adhesive 13, the resin film 15 does not curl and interfere with accurate parallelism detection.

Further, since the bump transfer plate 7 has approximately the same diameter as the stage 3, the impressions 17 by the plurality of bonding tools 9 can be formed by moving the stage 3 in the X-axis or Y-axis direction in FIG. Can be done. Therefore, a large amount of data for detecting parallelism can be easily obtained and the work process can be simplified.

Moreover, the conventional function of automatically feeding the bump transfer 117 can be applied as is, without complicating the mechanism and contributing to automation of parallelism detection.

Note that the present invention is not limited to the above-mentioned embodiments; for example, the resin film may be not a polyimide film but a film with other heat resistance. It is not necessary to observe the melted state at approximately the same time. Furthermore, it goes without saying that the bump transfer plate 7 does not have to be made of a glass wafer.

[Effects of the Invention] As explained above, according to the present invention, a bump transfer plate to which a heat-resistant resin film is bonded is heated and pressed by a bonding tool, and the parallelism is detected from the state of the bump transfer plate. Because of this configuration, it is possible to easily detect the parallelism accurately in accordance with the actual situation, and it can also contribute to the automation of the parallelism detection.

[Brief explanation of the drawing]

FIG. 1 is a schematic overall configuration diagram of a method for detecting parallelism between a stage and a bonding tool according to an embodiment of the present invention;
Fig. 2 is an enlarged perspective view of the bump transfer plate, Fig. 3 is an explanatory diagram of the operation, Fig. 4 is an explanatory diagram of the conventional operation, and Figs.
The figure shows a conventional method for detecting parallelism between a stage and a bonding tool, and FIG. 9 is an explanatory diagram of the operation of transferring bumps to a film carrier. 1...Table 3...Stage 7...Bump transfer plate 9...Bonding tool

Claims (6)

[Claims] (1) A stage installed on a table and a semiconductor chip placed on this stage placed on a film carrier.
A method for detecting parallelism with a bonding tool for A-B connection, in which a bump transfer plate to which a heat-resistant resin film is adhered is placed on the stage, and the bump transfer plate is heated and pressed by the bonding tool. A method for detecting parallelism between a stage and a bonding tool, comprising: detecting parallelism from the state of the bump transfer plate. (2) The detection of the parallelism is performed by the impression of the bonding tool formed on the resin film of the bump transfer plate. Parallelism detection method. (3) The method for detecting parallelism between a stage and a bonding tool according to claim 1 or 2, wherein the bump transfer plate is made of a glass wafer. (4) The stage and bonding according to any one of claims 1 to 3, wherein the resin film is bonded to the bump transfer plate with an adhesive that melts with the heat of the bonding tool. How to detect parallelism with the tool. (5) A method for detecting parallelism between a stage and a bonding tool according to claim 4, wherein the parallelism is detected based on a molten state of the adhesive. (6) The method for detecting parallelism between a stage and a bonding tool according to any one of claims 1 to 5, wherein the resin film is a polyimide film.