JPS63177059U - - Google Patents
Info
- Publication number
- JPS63177059U JPS63177059U JP1987067028U JP6702887U JPS63177059U JP S63177059 U JPS63177059 U JP S63177059U JP 1987067028 U JP1987067028 U JP 1987067028U JP 6702887 U JP6702887 U JP 6702887U JP S63177059 U JPS63177059 U JP S63177059U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- semiconductor device
- heat
- frame
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000017525 heat dissipation Effects 0.000 claims description 23
- 239000004065 semiconductor Substances 0.000 claims description 20
- 239000004020 conductor Substances 0.000 claims description 5
- 230000005855 radiation Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 239000002470 thermal conductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987067028U JPH0541557Y2 (enrdf_load_html_response) | 1987-05-02 | 1987-05-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987067028U JPH0541557Y2 (enrdf_load_html_response) | 1987-05-02 | 1987-05-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63177059U true JPS63177059U (enrdf_load_html_response) | 1988-11-16 |
| JPH0541557Y2 JPH0541557Y2 (enrdf_load_html_response) | 1993-10-20 |
Family
ID=30905567
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987067028U Expired - Lifetime JPH0541557Y2 (enrdf_load_html_response) | 1987-05-02 | 1987-05-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0541557Y2 (enrdf_load_html_response) |
-
1987
- 1987-05-02 JP JP1987067028U patent/JPH0541557Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0541557Y2 (enrdf_load_html_response) | 1993-10-20 |