JPH0541557Y2 - - Google Patents

Info

Publication number
JPH0541557Y2
JPH0541557Y2 JP1987067028U JP6702887U JPH0541557Y2 JP H0541557 Y2 JPH0541557 Y2 JP H0541557Y2 JP 1987067028 U JP1987067028 U JP 1987067028U JP 6702887 U JP6702887 U JP 6702887U JP H0541557 Y2 JPH0541557 Y2 JP H0541557Y2
Authority
JP
Japan
Prior art keywords
semiconductor device
heat dissipation
heat
plate
plate piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987067028U
Other languages
English (en)
Japanese (ja)
Other versions
JPS63177059U (enrdf_load_html_response
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987067028U priority Critical patent/JPH0541557Y2/ja
Publication of JPS63177059U publication Critical patent/JPS63177059U/ja
Application granted granted Critical
Publication of JPH0541557Y2 publication Critical patent/JPH0541557Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
JP1987067028U 1987-05-02 1987-05-02 Expired - Lifetime JPH0541557Y2 (enrdf_load_html_response)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987067028U JPH0541557Y2 (enrdf_load_html_response) 1987-05-02 1987-05-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987067028U JPH0541557Y2 (enrdf_load_html_response) 1987-05-02 1987-05-02

Publications (2)

Publication Number Publication Date
JPS63177059U JPS63177059U (enrdf_load_html_response) 1988-11-16
JPH0541557Y2 true JPH0541557Y2 (enrdf_load_html_response) 1993-10-20

Family

ID=30905567

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987067028U Expired - Lifetime JPH0541557Y2 (enrdf_load_html_response) 1987-05-02 1987-05-02

Country Status (1)

Country Link
JP (1) JPH0541557Y2 (enrdf_load_html_response)

Also Published As

Publication number Publication date
JPS63177059U (enrdf_load_html_response) 1988-11-16

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