JPS63177041U - - Google Patents
Info
- Publication number
- JPS63177041U JPS63177041U JP6667287U JP6667287U JPS63177041U JP S63177041 U JPS63177041 U JP S63177041U JP 6667287 U JP6667287 U JP 6667287U JP 6667287 U JP6667287 U JP 6667287U JP S63177041 U JPS63177041 U JP S63177041U
- Authority
- JP
- Japan
- Prior art keywords
- film
- carrier tape
- film carrier
- base film
- conveyance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 239000011521 glass Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6667287U JPS63177041U (enExample) | 1987-05-01 | 1987-05-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6667287U JPS63177041U (enExample) | 1987-05-01 | 1987-05-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63177041U true JPS63177041U (enExample) | 1988-11-16 |
Family
ID=30904898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6667287U Pending JPS63177041U (enExample) | 1987-05-01 | 1987-05-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63177041U (enExample) |
-
1987
- 1987-05-01 JP JP6667287U patent/JPS63177041U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0559384A3 (en) | Devices with tape automated bonding | |
| JPS63177041U (enExample) | ||
| JP2522094B2 (ja) | 半導体パッケ―ジのリ―ドカット方法 | |
| JPS62199939U (enExample) | ||
| JPS63157054U (enExample) | ||
| JPH069984Y2 (ja) | 電子部品搬送体 | |
| JPS6310550U (enExample) | ||
| JPS63134964U (enExample) | ||
| JPS6060215U (ja) | 基板分割装置 | |
| JPS62188180U (enExample) | ||
| JPS6265275U (enExample) | ||
| JPS61195056U (enExample) | ||
| JPS628646U (enExample) | ||
| JPS61192480U (enExample) | ||
| JPS63171367U (enExample) | ||
| JPS59158336U (ja) | 半導体装置 | |
| JPS6450925U (enExample) | ||
| JPS6322734U (enExample) | ||
| JPS63147833U (enExample) | ||
| JPS61166562U (enExample) | ||
| JPS63147864U (enExample) | ||
| JPS6126004U (ja) | スプリングのテ−プ接着装置 | |
| JPS6388982U (enExample) | ||
| JPS6263936U (enExample) | ||
| JPS63175056U (enExample) |