JPS63175064A - Polyarylene sulfide resin composition and electronic parts using same - Google Patents

Abstract

PURPOSE:To obtain the titled composition good in dispersion of the filler contained, outstanding in molding processability, sliding characteristics, etc., suitable for electronic parts, by incorporating a filler-contg. polyarylene sulfide resin with specified amount of an ammonium perfluoroalkylsulfonate. CONSTITUTION:The objective composition can be obtained by incorporating (A) 100pts.wt. of a polyarylene sulfide resin containing 10-80wt.% of filler (e.g. silica) with a melt flow rate 10-20,000g/10min with (B) 0.001-5pts.wt. of an ammonium polyfluoroalkylsulfonate of formula (Rf is 3-20C alkyl substituted by two or more fluorine atoms; R is 1-20C hydrocarbon; n is 0 or 1).

Description

Detailed Description of the Invention (Industrial Application Field) The present invention relates to a polyarylene sulfide resin composition with improved filler dispersibility, and is applicable to various injection molding materials, compression molding materials, and extrusion molding materials. It is used as a molding material and relates to electronic parts using the same.

(Prior art and its problems) Polyarylene sulfide resins have excellent heat resistance, flame retardance, chemical resistance, etc., and are used for various purposes as high-performance engineering plastics. The polyarylene sulfide resin itself does not have sufficient elongation,
Due to lack of toughness, fillers are usually mixed. For example, polyarylene sulfide resin compositions containing fluororesin, graphite, etc. as fillers are used for various sliding parts applications to improve friction and wear characteristics. Furthermore, in electronic component encapsulant applications, a large amount of filler is blended in order to improve the reliability of electronic components.

A common problem with polyarylene sulfide resin compositions containing these fillers is poor dispersion of the fillers used, resulting in decreased fluidity during molding,
Parts molded from the composition may not have sufficient desired performance, such as sliding properties, colorability, reliability of electronic parts, etc.

Silane coupling agents, titanate coupling agents, organoaluminum coupling agents, etc. are known as means to improve the dispersibility of the filler, but in the case of polyarylene sulfide resins, the effects may be insufficient. ,
This has problems such as deteriorating other useful performance.

On the other hand, the same is true when using fluorine-based compounds, but they may have insufficient heat resistance or lack affinity with polyarylene sulfide resins, resulting in the generation of volatile matter during molding and fillers. It has the disadvantage that the effect on the dispersion of is small.

(Means for Solving the Problems) In view of the above-mentioned circumstances, the present inventors aimed to obtain a polyarylene sulfide resin composition that has improved filler dispersibility and is thermally stable during molding. After careful consideration,
For polyarylene sulfide resins containing fillers,
The inventors discovered that it is effective to add bar 70 roalkylsulfonic acid ammonium salt, leading to the present invention.

That is, the present invention relates to a polyarylene sulfide resin composition containing 100 parts by weight of a polyarylene sulfide resin containing a filler and ammonium polyfluoroalkylsulfonate [0,001 to 5 parts by weight], and an electronic component using the same.

In the present invention, the polyarylene sulfide resin is an uncrosslinked or partially crosslinked polyarylene sulfide resin and a mixture thereof,
The melt flow rate measured at 15,5'C15=load) is 10 to 20,000 g/10 minutes, and various types of molecular bonds are used depending on the purpose. Note that the polyarylene sulfate may be any organic group such as alkoxy, hydroxyl, carboxyl, amine, halogen, glycidyl, or trifunctional group. Known polyphenylene sulfide resins containing 60 mol % or more of a typical polyvalent structural unit preferably used in the present invention can be mentioned.

As the filler in the present invention, various known inorganic and organic fillers can be used. Specifically, silica, diatomaceous earth, alumina, titanium oxide, iron oxide, zinc oxide, magnesium oxide, antimonic acid, antimony oxide, barium ferrite, strontium ferrite, beryllium oxide, pumice, pumice balloon, aluminum, lead oxide, oxide Oxides such as bismuth and zirconium oxide; Hydroxides such as aluminum hydroxide, magnesium hydroxide, and basic magnesium carbonate; Carbonates such as calcium carbonate, magnesium carbonate, dolomite, and toneite; Calcium sulfate, barium sulfate, ammonium sulfate, Sulfuric acid or sulfite groups such as calcium sulfite; talc, clay, mica, asbestos, glass fiber, galagraphite, carbon fiber, carbon hollow sphere, iron powder, copper powder, lead powder, aluminum powder, molybdenum sulfide, boron fiber, carbonized Particulate, fibrous, spherical, and hollow inorganic fillers such as silicon fiber, brass fiber, potassium titanate, lead zirconate titanate, zinc borate, barium metaborate, calcium borate, and sodium borate; Examples include particles and spheres of organic fillers such as polytetrafluoroethylene and silicone rubber.

The amount of the filler added can be arbitrarily changed depending on the application, but is preferably 10 to 80% by weight in the polyarylene sulfide resin containing the filler.

The ammonium polyfluoroalkyl sulfonate used in the present invention has the general formula Rf SOs N ()T) n
(R)4-n (where Rf is an alkyl group having 3 to 20 carbon atoms and substituted with two or more fluorine atoms, R is a hydrocarbon group having 1 to 20 carbon atoms, and n is 0 or 1) The most preferred ammonium salt of perfluoroalkylsulfonic acid is al.

Examples of such ammonium sulfonate include C
s F+s SOs N (Ct H5)4, Cs F
ly S'Os N (CH ri 4 , C, F,, 5
o3N(C,H,), ,C,F,,So, N(C,
Examples include, but are not limited to, H,)4, C,F, So, NH(CH,), and the like.

The amount of ammonium perfluoroalkylsulfonate used is 10% of the polyarylene sulfide resin containing filler.
0 parts by weight [1001~5m:, 1 part is appropriate; if it is less than α001, the effect of the present invention will be insufficient, and if it exceeds 5 parts by weight, the mechanical strength will decrease significantly. I don't like it.

The composition of the present invention may contain other known additives, such as silane coupling agents, titanate coupling agents, organoaluminum coupling agents, heat stabilizers, antioxidants, corrosion inhibitors, fluidity improvers, Colorants such as pigments and dyes
: Can be added in an appropriate amount.

The composition of the present invention can be used for various molded products made by injection molding, compression molding, extrusion molding, etc., and is particularly suitable for electronic parts. Specific examples of the electronic components include ICs, hybrid ICs, transistors, diodes, triodes,
Examples include capacitors, resistors, thyristors, coils, varistors, transducer-1 crystal oscillators, fuses, rectifiers, power supplies, switches, relays, sensors, Hall elements, and composite parts thereof.

Furthermore, the composition of the present invention can be used not only as a general molding material, as a sealant, but also as a stampable sheet.

(Effects of the Invention) Since the filler contained in the composition of the present invention is well dispersed, various effects caused by the addition of the filler are sufficiently enhanced.

That is, it is possible to improve molding processability due to a decrease in melt viscosity, to improve sliding properties and coloring properties, and to improve the reliability of electronic components due to the inclusion of a large amount of filler and good dispersion. Furthermore, since the composition of the present invention is stable against heat during molding, it is possible to provide molded products with good appearance and fewer voids, such as electronic parts.

(Example) The present invention will be explained below with reference to Examples and Comparative Examples.

Examples 1 to 6 Polyphenylene sulfide 100 parts with a melt flow rate of 35009/10 minutes, 150 parts of the filler shown in Table 1, C, F, So, N which is ammonium perfluoroalkyl sulfonate. (C,H,), 1
Parts by weight were uniformly mixed, cultured and kneaded at 330°C in a 50 m extruder, and the melt sheath viscosity of the pelletized product was measured at 320°C (shear rate 1000 sec-').

Table 1 Comparative Examples 1 to 5 In Examples 1 to 5, the same procedure was carried out without adding the per-70-roalkylsulfonic acid ammonium base, and Table 2 Table 2 Examples 6 to 9, Comparative Examples 6 to 7 120 parts by weight of polyphenylene sulfide resin with a melt flow rate of 100 g/10 minutes, 50" glass fiber
M parts, 30 parts of polytetrafluoroethylene powder (1 part is perfluoroalkylsulfonic acid ammonium salt represented by CsF+ySOsN(C5Hy)4)
10 parts by weight were uniformly blended and melt-kneaded at 320°C in a 50 mm extruder. Using the obtained pellets, specimens for strength measurement were prepared to measure tensile strength, and M abrasion characteristics were measured. A specimen was prepared for measurement and the wear characteristics (versus mild steel) were measured.
Obtained the results in the table.

Table 3 Example 10 100 parts by weight of polyphenylene sulfide with a melt flow rate of 1QOOO9/10 minutes, 150 parts by weight of fused silica, ammonium perfluoroalkylsulfonate represented by C, F, So, NH(CH,) 1! After uniformly mixing these parts, they were melt-kneaded at 310°C. The obtained pellet was used to seal a 16-pin Bioroller IC, and a reliability test (pressure cutter test, 2 atm, 2
00 hours). There were 0 defective products out of 100.

Comparative Example 8 All reliability tests were conducted in the same manner as in Example 10 except that ammonium perfluoroalkylsulfonate m1m1 was not used, but 3Z out of 100 products were defective.

Claims (1)

[Claims] 1. Polyarylene sulfide resin 100 containing filler
A polyarylene sulfide resin composition comprising 0.001 to 5 parts by weight of ammonium salt of polyfluoroalkyl sulfonate. 2. Polyarylene sulfide resin 100 containing filler
An electronic component using a polyarylene sulfide resin composition comprising 0.001 to 5 parts by weight of ammonium salt of polyfluoroalkylsulfonate.