JPS63174779A - Device for soldering leadless component - Google Patents

Abstract

PURPOSE:To prevent the generation of unsoldering part by providing a rotary part on the holding device part of a printed circuit board by making the holding direction of the printed circuit board changeable in an optional direction. CONSTITUTION:The rotary part 2 which is a size larger than a printed circuit board 4 is provided on the carrier 1 of the board 4 and a rotary desition is made settable freely 360 deg. by a manual operation, etc., as well. The square recessed part 9 holding the printed board 4 by engaging it is formed on the rotary part 2 to project a holding piece 10 respectively to the four sides of the recessed part 9. In the case of performing the soldering of a leadless part 3, the board 4 is attached with its upside down at the inside of the recessed part 9 of the rotary part 2 and held by the holding piece 10. When the carrier 1 is moved, the direction of the part 3 is set at 45 deg. for the progressing direction by rotating the rotary part 2. The generation of unsoldering part due to the gas stagnation at the soldering time is thus prevented.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a device for soldering leadless components to a printed circuit board, and in particular to a soldering device with an improved printed circuit board holding device in an automatic soldering device. Regarding.

[Conventional technology]

Conventionally, automatic soldering equipment for this type of flow soldering uses a holding device to hold a printed circuit board on which leadless components are mounted, and moves it to a flux application section, a heater section, and a solder bath section. The process is now carried out.

For example, FIG. 2 shows the process in the solder bath 5,
A printed circuit board 4 with leadless components 3 mounted thereon is placed in a solder tank 5.
At this time, the soldering solder in the solder bath 5 is applied to the leadless component 3 to perform soldering.

[Problem that the invention seeks to solve]

In the above-mentioned conventional automatic soldering device using flow soldering, the holding device section that holds the printed circuit board 4 is normally tilted somewhat with respect to the solder tank 5, and its advancing direction (arrow 6) is aligned with the four sides of the printed circuit board 4. parallel to or 90″
It is set to be in the direction of Therefore, the leadless component 3 mounted parallel to the four sides of the printed circuit board 4 or in the 90@ direction is also moved in a state parallel to the solder bath 5 or oriented in the 90@ direction.

For this reason, especially in the leadless component 3 that is oriented in the 90'' direction, together with the inclination of the holding device, it becomes impossible to sufficiently vent the gas from the portion shown by reference numeral 7 in FIG. There is a problem in that a stagnant portion occurs and an unsoldered portion occurs in this portion.

SUMMARY OF THE INVENTION An object of the present invention is to provide a leadless component soldering apparatus that prevents the occurrence of unsoldered parts and achieves soldering with high reliability.

[Means for solving problems]

The leadless component soldering apparatus of the present invention includes a rotating section in a holding device section that holds a printed circuit board, and the rotating section holds the printed circuit board so that the holding direction of the printed circuit board with respect to the moving direction of the holding device section is 360 degrees. It has a configuration that can be changed arbitrarily.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a perspective view showing a holding device section for holding a printed circuit board, which is a feature of the present invention.

This holding device section mainly consists of a carrier 1 for holding and moving the printed circuit board 4, and a rotating section 2 that is larger in rotation than the printed circuit board 4 is provided in a part of the carrier 1. . This rotating part 2 is constructed separately from the carrier l, and can be rotated in the direction of arrow 8 with respect to the carrier 1 by means of a guide mechanism (not shown), etc., and its rotational position can be freely set 360° by manual operation etc. can. In addition, a rectangular recess 9 into which the printed circuit board 4 is fitted and held is formed in the rotating part 2, and holding rows are formed on each of the four sides of the recess 9.
0 is formed to protrude inward.

In this example, the carrier 1 is configured to perform predetermined soldering while being moved in the direction of arrow 6 in the figure.

Therefore, according to this configuration, the printed circuit board 4 on which the required leadless components 3 are mounted and soldered is placed upside down in the recess 9 of the rotating section 2 and held by the holding chain 10. In this case, if the carrier 1 is to be moved in the direction of arrow 6, the rotating part 2 is rotated, for example, by 45 degrees from the state shown in FIG. Set it so that it is 45°.

Then, as shown in FIG. 2, the carrier 1 is moved in the direction of the arrow 6 while being tilted at a predetermined angle with respect to the solder bath 5, and soldering is performed using soldering solder. At this time, since the leadless component 3 is not parallel to or oriented at 90 degrees with respect to the advancing direction of the carrier 1, no gas stagnation occurs, and the leadless component and flow solder can be smoothly soldered onto the printed circuit board. It can wet the surface,
The unsoldered phenomenon can be improved.

Here, a plurality of rotating parts 2 may be provided for one carrier. Furthermore, the angle of the printed circuit board and leadless component relative to the carrier may be set to any angle depending on the situation.

〔Effect of the invention〕

As explained above, in the present invention, a rotating part is provided in the holding device part that holds the printed circuit board, and the rotating part holds the printed circuit board so that its direction can be changed arbitrarily over 360'. When soldering leadless components in a tank, it is possible to prevent the occurrence of gas stagnant parts, to reliably prevent the occurrence of unsoldered parts caused by this, and to achieve good soldering. Furthermore, the present invention requires only a part of the holding device to be improved, and has the effect of preventing the above-mentioned unsoldered portions and reducing equipment investment costs.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a printed circuit board holding device in a soldering apparatus of the present invention, and FIG. 2 is a sectional view for explaining a soldering process in a normal solder bath. DESCRIPTION OF SYMBOLS 1... Carrier (main part of holding device), 2... Rotating part, 3... Leadless component, 4... Printed circuit board, 5
. . . Solder tank, 6. Movement direction, 7. Gas retention portion, 8. Rotation direction, 9. Recessed portion, 10. Holding piece. Figure 1

Claims (2)

[Claims] (1) In a leadless component soldering apparatus that holds a printed circuit board on which a leadless component is mounted in a holding device section and performs soldering while moving the board, a rotating section is provided in the holding device section that holds the printed circuit board. A leadless component soldering apparatus, characterized in that a printed circuit board is held in this rotating section so that the direction in which the printed circuit board is held relative to the moving direction of the holding device section can be changed arbitrarily through 360 degrees. (2) A patent claim in which a rotating part is disposed in a carrier constituting a holding device part, and the rotating part is integrally provided with a recess into which a printed circuit board is inserted and a holding piece that holds the printed circuit board on four sides. A leadless component soldering device according to item 1.