JPS63174441U - - Google Patents

Info

Publication number
JPS63174441U
JPS63174441U JP1987007669U JP766987U JPS63174441U JP S63174441 U JPS63174441 U JP S63174441U JP 1987007669 U JP1987007669 U JP 1987007669U JP 766987 U JP766987 U JP 766987U JP S63174441 U JPS63174441 U JP S63174441U
Authority
JP
Japan
Prior art keywords
wire bonding
bonding apparatus
bonding
lead frame
heater part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987007669U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987007669U priority Critical patent/JPS63174441U/ja
Publication of JPS63174441U publication Critical patent/JPS63174441U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/0711
    • H10W72/07141

Landscapes

  • Wire Bonding (AREA)
JP1987007669U 1987-01-21 1987-01-21 Pending JPS63174441U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987007669U JPS63174441U (enExample) 1987-01-21 1987-01-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987007669U JPS63174441U (enExample) 1987-01-21 1987-01-21

Publications (1)

Publication Number Publication Date
JPS63174441U true JPS63174441U (enExample) 1988-11-11

Family

ID=30791338

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987007669U Pending JPS63174441U (enExample) 1987-01-21 1987-01-21

Country Status (1)

Country Link
JP (1) JPS63174441U (enExample)

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