JPS6317238Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a dip device for coating the surface of an electronic component with a protective resin.

The surfaces of electronic components such as multilayer ceramic capacitors are coated with resin in order to improve their electrical characteristics and reliability, as well as to improve their product image.

A method of coating the surface of an electronic component with resin is to immerse the electronic component soldered to a lead wire into resin stored in a tank, and then pull it out. However, according to such a manufacturing method, the resin coated on the surface of the electronic component after being pulled up from the resin surface flows to the underside of the electronic component due to changes in viscosity and the action of gravity over time. Since the resin dries as it is, each surface of the electronic component is coated with resin with an uneven thickness, which may deteriorate the electrical characteristics and quality depending on the type of electronic component. For this reason, when pulling up from the resin surface, vibrations may be applied in the vertical direction.
Due to the vertical vibration, the excess resin coated on the surface of the electronic component falls into the tank in an extremely short time. Uniform resin coating is applied. Therefore, electronic components with stable characteristics and quality can be obtained. However, even in this manufacturing method, when the electronic components are vibrated in the vertical direction, the resin surface in the tank and the resin coated on the electronic component surfaces are not easily cut, and in some cases, the electronic components may be re-inserted into the resin. The reality is that it is difficult to uniformly coat all electronic components with resin because they are sometimes immersed.

In view of these circumstances, the present invention provides a deep coating device which can uniformly coat the surface of electronic components with a resin using a device having a simple structure, and which is suitable for small-volume production of electronic components.

Hereinafter, details of the embodiments of the present invention shown in the drawings will be described.

In FIGS. 1 and 2, 1 is a multilayer ceramic capacitor, and a lead wire 3 made of a conductive material is fixed to a fixed plate 2 made of paperboard or the like.
Both electrodes having conductive paste applied to both sides of the multilayer ceramic capacitor 1 are soldered to a and 3b. Reference numeral 4 denotes a mouth-shaped set frame for supporting a fixing plate 2 supporting a plurality of laminated ceramic capacitors 1, and a side plate 6 having a plurality of grooves 5 provided at equal intervals to support the fixing plate 2.
a, 6b and supports 7a, 7 for supporting them
It is composed of b. 8 is a support frame for supporting the set frame 4, and shafts 9a, 9b, 9c, 9d
(not shown)
A, 10b, 10c, and 10d (not shown) can freely slide horizontally in the direction of arrow A on shafts 11a and 11b whose both ends are fixed to blocks 10a and 10d and 10b and 10c, respectively. 1
Reference numerals 2a and 12b designate attachment/detachment mechanisms that allow the setting frame 4 and the fixing plate 2 to which the laminated ceramic capacitor 1 is fixed to be easily fixed to and removed from the support frame 8. It is supported so that it can move in an arc, and is constantly pressed in the 8 directions of the support frame by a coil spring (not shown).
Furthermore, when placed on the side plates 6a, 6b of the set frame 4, they are fixed by permanent magnets (not shown) provided in the support frame 8 and the attachment/detachment mechanisms 12a, 12b, respectively. Reference numeral 13 denotes an eccentric cam fixed to a motor 15 supported by a plate 14 fixed to blocks 10a and 10b, which is in constant contact with the side surface of the support frame 8, and rotates the motor to move the support frame 8 in the direction of arrow A. Excite. The excitation speed can be adjusted freely by changing the rotational speed of the motor. 16a, 16b are coil springs for constantly pressing the support frame 8 against the surface of the eccentric cam 13, one end of which is connected to the blocks 10a, 1.
Pins 17a and 17b each fixed to 0b
(not shown), and the other end is hung on pins 18a and 18b respectively fixed to the support frame. 19 is a tank for storing coating resin 20;
It is placed on a vertically movable table 21, and a coating resin 20 is placed on it.
It can be attached to and detached from the vertically movable table 21 to facilitate replenishment and replacement. The vertically movable table 21 is supported by four shafts 9a, 9b, 9c, and 9d so as to be slidable in the vertical direction (in the direction of arrow D), and is engaged with a nut 22 fixed to the bottom surface, so that it can rotate freely on the base plate 23. It is slid in the direction of arrow D by rotation of the feed screw 26 supported by. 2
5 and 26 are bevel gears that mesh with each other,
The bevel gear 25 is fixed to the feed screw 24, and the bevel gear 26 is fixed to one end of a shaft 28 rotatably supported by a bearing 27 fixed to the base plate 23.
A handle 29 is fixed to the other end of the shaft 28, and by rotating the handle 29, the vertically movable table 21 slides in the direction of arrow D.

Next, the operation of the above embodiment will be described.

As shown in FIGS. 1 and 2, the fixing plate 2 on which the multilayer ceramic capacitor 1 is soldered and fixed to the lead wires 3a and 3b is attached to the side plates 6a and 6b of the set frame 4.
The multilayer ceramic capacitor 1 is inserted into the groove 5 provided on the support frame 8 and fixed on the support frame 8 by the attachment/detachment mechanisms 12a and 12b.Then, the tank 19 storing the coating resin 20 is placed in such a way that the multilayer ceramic capacitor 1 does not come into contact with the green part of the tank 19. , vertical moving table 21
Located at the top center. After the setting is completed, the handle 29 is rotated to raise the tank 19 on the vertically movable table 21 (in the direction of arrow D') to immerse the multilayer ceramic capacitor 1 into the coating resin 20 as shown in FIG. Next, the motor 15 is driven to drive the eccentric cam 13.
While rotating the handle 29 to vibrate the support frame 8 in the direction of arrow A, the handle 29 is rotated in the opposite direction to gradually lower the tank 19 (in the direction of arrow D''). As shown, when the lower surface of the multilayer ceramic capacitor 1 separates from the liquid surface of the coating resin 20, the resin coated on the multilayer ceramic capacitor 1 traces a tail to the surface of the resin 20 in the tank 19, but is not applied in the direction of arrow A. Since it descends while being shaken, the excess resin coated flows down into the tank 19 in a very short time.Therefore, as shown in FIG. 5, all the laminated ceramic capacitors 1 are coated with resin to a uniform thickness. Furthermore, even if the multilayer ceramic capacitor 1 is left as it is, the coated resin will not go around to the bottom of the multilayer ceramic capacitor 1, so a uniform resin coating will be maintained.The multilayer ceramic capacitor coated with resin in this way will dry The capacitor is manufactured by drying in the equipment.

By repeating the above operations, it is possible to successively coat the multilayer ceramic capacitors 1 supported by the setting frame 4 with resin.

According to the present invention, resin coating is performed while horizontally vibrating electronic components such as ceramic capacitors supported by a frame, so it is possible to apply resin coating with a uniform thickness, resulting in good electrical properties. Not only can you obtain highly reliable and high quality electronic components, but also
Since each frame can be handled individually, post-processing can be easily performed, which is effective for resin coating of electronic parts for small quantity production.

[Brief explanation of the drawing]

FIG. 1 is a partially cutaway perspective view of the entire dip device according to the present invention, FIG. 2 is a perspective view showing a multilayer ceramic capacitor 1 supported on a setting frame 4, and FIG. 3 is a perspective view showing a multilayer ceramic capacitor 1 supported in a tank. 1
9 is a sectional view showing the state in which the multilayer ceramic capacitor 1 is immersed in the coating resin 20 in the resin coating 20. FIG. 1 is a sectional view showing a state in which the surface of a laminated ceramic capacitor 1 is coated with resin. In the figure, 1 is a laminated ceramic capacitor, 2 is a fixed plate, 4 is a set frame, 8 is a support frame, 12a, 12b are attachment/detachment mechanisms, 13 is an eccentric cam, 15 is a drive motor, 16a, 16b are coil springs, 19 is a A tank for storing coating resin 20, 21 a vertically moving table, 22 a nut, 24 a feed screw, 2
5 and 26 are bevel gears, 28 is a shaft, and 29 is a handle.

Claims (1)

[Scope of utility model registration request] A mouth-shaped setting frame with grooves on both sides for supporting multiple fixing plates in parallel with multiple electronic components fixed vertically, and this setting frame is removably supported and can be moved horizontally. a set frame support mechanism supported by a set frame support mechanism; a vibration device that vibrates the set frame support mechanism in the horizontal direction; a spring mechanism that constantly presses the set frame support mechanism against the vibration device; a tank located below a plurality of electronic components supported by a tank for storing coating resin, a support stand that supports the tank horizontally, and the electronic components can be immersed into the resin in the tank. 1. An electronic component dip device comprising: a vertical movement mechanism that raises the tank to a position where the electronic component is placed above the surface of the resin, and lowers the tank until the electronic component is at a position above the resin surface.