JPS63172147U - - Google Patents
Info
- Publication number
- JPS63172147U JPS63172147U JP1987064337U JP6433787U JPS63172147U JP S63172147 U JPS63172147 U JP S63172147U JP 1987064337 U JP1987064337 U JP 1987064337U JP 6433787 U JP6433787 U JP 6433787U JP S63172147 U JPS63172147 U JP S63172147U
- Authority
- JP
- Japan
- Prior art keywords
- lead wires
- tie bar
- lead frame
- utility
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/0198—Manufacture or treatment batch processes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Devices Affording Protection Of Roads Or Walls For Sound Insulation (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987064337U JPS63172147U (enExample) | 1987-04-28 | 1987-04-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987064337U JPS63172147U (enExample) | 1987-04-28 | 1987-04-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63172147U true JPS63172147U (enExample) | 1988-11-09 |
Family
ID=30900402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987064337U Pending JPS63172147U (enExample) | 1987-04-28 | 1987-04-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63172147U (enExample) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5512439U (enExample) * | 1978-07-11 | 1980-01-26 | ||
| JPS5517382B2 (enExample) * | 1975-03-03 | 1980-05-10 | ||
| JPS576252B2 (enExample) * | 1975-06-24 | 1982-02-04 | ||
| JPS6310567B2 (enExample) * | 1983-11-05 | 1988-03-08 | Hitachi Seisakusho Kk |
-
1987
- 1987-04-28 JP JP1987064337U patent/JPS63172147U/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5517382B2 (enExample) * | 1975-03-03 | 1980-05-10 | ||
| JPS576252B2 (enExample) * | 1975-06-24 | 1982-02-04 | ||
| JPS5512439U (enExample) * | 1978-07-11 | 1980-01-26 | ||
| JPS6310567B2 (enExample) * | 1983-11-05 | 1988-03-08 | Hitachi Seisakusho Kk |