JPS63170962U - - Google Patents
Info
- Publication number
- JPS63170962U JPS63170962U JP1987063226U JP6322687U JPS63170962U JP S63170962 U JPS63170962 U JP S63170962U JP 1987063226 U JP1987063226 U JP 1987063226U JP 6322687 U JP6322687 U JP 6322687U JP S63170962 U JPS63170962 U JP S63170962U
- Authority
- JP
- Japan
- Prior art keywords
- guide hole
- lead frame
- tie bar
- molding
- cut
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/0198—
-
- H10W72/5449—
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- H10W90/756—
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Punching Or Piercing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987063226U JPS63170962U (enExample) | 1987-04-24 | 1987-04-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987063226U JPS63170962U (enExample) | 1987-04-24 | 1987-04-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63170962U true JPS63170962U (enExample) | 1988-11-07 |
Family
ID=30898255
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987063226U Pending JPS63170962U (enExample) | 1987-04-24 | 1987-04-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63170962U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20170048466A (ko) * | 2014-10-03 | 2017-05-08 | 미쓰비시덴키 가부시키가이샤 | 리드 프레임, 반도체 장치의 제조 방법 |
-
1987
- 1987-04-24 JP JP1987063226U patent/JPS63170962U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20170048466A (ko) * | 2014-10-03 | 2017-05-08 | 미쓰비시덴키 가부시키가이샤 | 리드 프레임, 반도체 장치의 제조 방법 |
| US10541193B2 (en) | 2014-10-03 | 2020-01-21 | Mitsubishi Electric Corporation | Lead frame and method for manufacturing semiconductor device |
| US11387173B2 (en) | 2014-10-03 | 2022-07-12 | Mitsubishi Electric Corporation | Method for manufacturing semiconductor device |