JPS63172143U - - Google Patents
Info
- Publication number
- JPS63172143U JPS63172143U JP6547287U JP6547287U JPS63172143U JP S63172143 U JPS63172143 U JP S63172143U JP 6547287 U JP6547287 U JP 6547287U JP 6547287 U JP6547287 U JP 6547287U JP S63172143 U JPS63172143 U JP S63172143U
- Authority
- JP
- Japan
- Prior art keywords
- package
- heat dissipation
- mounting part
- semiconductor device
- plate portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 230000017525 heat dissipation Effects 0.000 claims description 4
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6547287U JPS63172143U (pt) | 1987-04-30 | 1987-04-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6547287U JPS63172143U (pt) | 1987-04-30 | 1987-04-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63172143U true JPS63172143U (pt) | 1988-11-09 |
Family
ID=30902573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6547287U Pending JPS63172143U (pt) | 1987-04-30 | 1987-04-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63172143U (pt) |
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1987
- 1987-04-30 JP JP6547287U patent/JPS63172143U/ja active Pending