JPS63171883A - Insulating stainless steel sheet having excellent heat resistance and its production - Google Patents
Insulating stainless steel sheet having excellent heat resistance and its productionInfo
- Publication number
- JPS63171883A JPS63171883A JP469487A JP469487A JPS63171883A JP S63171883 A JPS63171883 A JP S63171883A JP 469487 A JP469487 A JP 469487A JP 469487 A JP469487 A JP 469487A JP S63171883 A JPS63171883 A JP S63171883A
- Authority
- JP
- Japan
- Prior art keywords
- stainless steel
- heat resistance
- film
- steel sheet
- steel plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910001220 stainless steel Inorganic materials 0.000 title claims abstract description 25
- 239000010935 stainless steel Substances 0.000 title claims abstract description 25
- 238000004519 manufacturing process Methods 0.000 title claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 28
- 239000000843 powder Substances 0.000 claims abstract description 27
- 229910052751 metal Inorganic materials 0.000 claims abstract description 18
- 239000002184 metal Substances 0.000 claims abstract description 18
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 17
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229920006254 polymer film Polymers 0.000 claims abstract description 15
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 15
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 14
- 229910052726 zirconium Inorganic materials 0.000 claims abstract description 13
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 12
- 150000004703 alkoxides Chemical class 0.000 claims abstract description 11
- 150000003839 salts Chemical class 0.000 claims abstract description 11
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 11
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical compound C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 claims abstract description 7
- 239000000203 mixture Substances 0.000 claims abstract description 6
- 239000002245 particle Substances 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 229920000642 polymer Polymers 0.000 abstract description 10
- 238000000576 coating method Methods 0.000 description 14
- 238000009413 insulation Methods 0.000 description 12
- 239000010936 titanium Substances 0.000 description 11
- 229910000831 Steel Inorganic materials 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 10
- 239000010959 steel Substances 0.000 description 10
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 9
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 8
- 230000018044 dehydration Effects 0.000 description 6
- 238000006297 dehydration reaction Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 125000000218 acetic acid group Chemical group C(C)(=O)* 0.000 description 4
- SMZOGRDCAXLAAR-UHFFFAOYSA-N aluminium isopropoxide Chemical compound [Al+3].CC(C)[O-].CC(C)[O-].CC(C)[O-] SMZOGRDCAXLAAR-UHFFFAOYSA-N 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 238000006482 condensation reaction Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- YOBOXHGSEJBUPB-MTOQALJVSA-N (z)-4-hydroxypent-3-en-2-one;zirconium Chemical compound [Zr].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O YOBOXHGSEJBUPB-MTOQALJVSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- JPUHCPXFQIXLMW-UHFFFAOYSA-N aluminium triethoxide Chemical compound CCO[Al](OCC)OCC JPUHCPXFQIXLMW-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 210000003298 dental enamel Anatomy 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 2
- VXUYXOFXAQZZMF-UHFFFAOYSA-N titanium(IV) isopropoxide Chemical compound CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 description 2
- RYSXWUYLAWPLES-MTOQALJVSA-N (Z)-4-hydroxypent-3-en-2-one titanium Chemical compound [Ti].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O RYSXWUYLAWPLES-MTOQALJVSA-N 0.000 description 1
- BWLBGMIXKSTLSX-UHFFFAOYSA-N 2-hydroxyisobutyric acid Chemical compound CC(C)(O)C(O)=O BWLBGMIXKSTLSX-UHFFFAOYSA-N 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- BSDOQSMQCZQLDV-UHFFFAOYSA-N butan-1-olate;zirconium(4+) Chemical compound [Zr+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] BSDOQSMQCZQLDV-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000002320 enamel (paints) Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 150000002736 metal compounds Chemical group 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- XPGAWFIWCWKDDL-UHFFFAOYSA-N propan-1-olate;zirconium(4+) Chemical compound [Zr+4].CCC[O-].CCC[O-].CCC[O-].CCC[O-] XPGAWFIWCWKDDL-UHFFFAOYSA-N 0.000 description 1
- ZGSOBQAJAUGRBK-UHFFFAOYSA-N propan-2-olate;zirconium(4+) Chemical compound [Zr+4].CC(C)[O-].CC(C)[O-].CC(C)[O-].CC(C)[O-] ZGSOBQAJAUGRBK-UHFFFAOYSA-N 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- JMXKSZRRTHPKDL-UHFFFAOYSA-N titanium ethoxide Chemical compound [Ti+4].CC[O-].CC[O-].CC[O-].CC[O-] JMXKSZRRTHPKDL-UHFFFAOYSA-N 0.000 description 1
- WOZZOSDBXABUFO-UHFFFAOYSA-N tri(butan-2-yloxy)alumane Chemical compound [Al+3].CCC(C)[O-].CCC(C)[O-].CCC(C)[O-] WOZZOSDBXABUFO-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
- C23C18/1208—Oxides, e.g. ceramics
- C23C18/1216—Metal oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1225—Deposition of multilayers of inorganic material
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Chemically Coating (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明はステンレス鋼板の表面に金属酸化物のポリマー
皮膜を複層形成して、耐熱性、電気絶縁性を付与したス
テンレス鋼板およびその製造方法に関する。Detailed Description of the Invention (Industrial Field of Application) The present invention provides a stainless steel plate which has heat resistance and electrical insulation properties by forming a multilayer polymer film of metal oxide on the surface of the stainless steel plate, and a method for manufacturing the same. Regarding.
(従来技術)
電気的発熱体の保護部材のごとく、耐熱性と絶縁性とが
必要な用途には、従来耐熱ガラスやセラミックの板を加
工したものが使用されていた。しかしこれらの材料の板
は可視性が劣るため、板を目的の形状に加工する場合、
板厚を薄くしなけ八ばならず、薄くすると強度が低下し
てしまうという問題があった。(Prior Art) Processed heat-resistant glass or ceramic plates have conventionally been used for applications that require heat resistance and insulation, such as protective members for electrical heating elements. However, plates made of these materials have poor visibility, so when processing the plate into the desired shape,
There was a problem that the plate thickness had to be made thinner, and if it was made thinner, the strength would decrease.
そこでこの問題を解消するために、金属板に耐熱性有機
樹脂塗膜やホーロー皮膜を形成した材料を使用する方法
が一部で試みられている。In order to solve this problem, some attempts have been made to use a material in which a heat-resistant organic resin coating or enamel coating is formed on a metal plate.
(発明が解決しようとする問題点)
前者の材料のうち比較的耐熱性の高いものはポリイミド
塗膜を形成したものであるが、このものでも耐熱限界は
約400℃と低いものであった。(Problems to be Solved by the Invention) Among the former materials, those with relatively high heat resistance have a polyimide coating, but even this material has a low heat resistance limit of about 400°C.
これに対して後者の材料は耐熱性には優れているが、ホ
ーロー皮膜は一般に焼成の際ピンホールが発生するため
、絶縁性をIOMΩ以上にするには皮膜厚を通常50μ
m以上と厚くする必要があった。しかしホーロー皮膜は
このように厚くすると加工性が低下し、加工の際クラッ
クが発生し易(、また金属板との密着力も劣ってしまう
ものであった。On the other hand, the latter material has excellent heat resistance, but the enamel film generally produces pinholes during firing, so the film thickness is usually 50 μm to achieve insulation properties of IOMΩ or higher.
It was necessary to make it thicker than m. However, when the enamel film is made thicker in this way, its workability deteriorates and cracks are more likely to occur during processing (and its adhesion to the metal plate is also poor).
このようなことから、鋼板表面に耐熱温度が商く、絶縁
性、可撓性に優れた皮膜を形成した材料が要望されてい
た。For this reason, there has been a demand for a material that has a film formed on the surface of the steel plate that has a high heat resistance, excellent insulation properties, and flexibility.
(問題点を解決するための手段)
本発明は金属板として、ステンレス鋼板を用い、この鋼
板表面に耐熱性、絶縁性、可撓性に優れた皮膜として、
下層にセラミック粉末を含有するAl、Zr%Ti%S
iの1種または2種以上の酸化物ポリマー皮膜を複層形
成した。そしてこの酸化物ポリマー皮膜を前記金属のア
ルコキシドまたはアセチルアセトネート金属塩溶液を塗
布しで、脱水縮合させる方法で形成するようにした。(Means for Solving the Problems) The present invention uses a stainless steel plate as the metal plate, and as a film with excellent heat resistance, insulation, and flexibility on the surface of the steel plate.
Al containing ceramic powder in the lower layer, Zr%Ti%S
A multilayer film of one or more oxide polymers of i was formed. Then, this oxide polymer film was formed by applying a solution of the alkoxide or acetylacetonate metal salt of the metal and performing dehydration condensation.
すなわち、本発明はステンレス鋼板の表面に下層として
、アルミナまたはシリカあるいはこれらの両者の粉末を
含有するAl、Zr、 Ti%Siの1種または2種以
上の酸化物ポリマー皮膜を形成し、さらにこの下層の上
に該^l、 Zr、 Ti*たはSiの1種または2種
以上の酸化物ポリマー皮膜を形成し、これらの各酸化物
ポリマー皮膜をAl、Zr、 Ti%Siのアルコキシ
ドまたはアセチルアセトネート金属塩の1種または2種
以上を0.1重量%以上含有するアルコール溶液に、平
均粒径0.01〜5μ曽のアルミナ粉末またはシリカ粉
末あるいはこれらの両粉末混合物を添加しで、その添加
溶液をステンレス鋼板表面に塗布して300〜500℃
で加熱することにより下層を形成し、次にこの下層の上
にAl、Zr、 Ti、 Siのアルコキシドまたは7
セチル7セトネート金属塩の1種または2種以上を0.
005重量%以上含有するアルコール溶液を塗布して、
300〜500℃に加熱し、上層を形成するようにした
。That is, the present invention forms an oxide polymer film of one or more of Al, Zr, and Ti%Si containing powders of alumina, silica, or both as a lower layer on the surface of a stainless steel plate, and then An oxide polymer film of one or more of ^l, Zr, Ti* or Si is formed on the lower layer, and each of these oxide polymer films is made of Al, Zr, Ti%Si alkoxide or acetyl. Adding alumina powder or silica powder or a mixture of both powders with an average particle size of 0.01 to 5 μm to an alcohol solution containing 0.1% by weight or more of one or more acetonate metal salts, Apply the additive solution to the surface of the stainless steel plate and heat it to 300 to 500℃.
A lower layer is formed by heating with
One or more types of cetyl 7cetonate metal salts are added at 0.
Applying an alcohol solution containing 0.005% by weight or more,
It was heated to 300-500°C to form an upper layer.
添付図面は本発明鋼板の断面を模式的に示したもので、
1がステンレス鋼板、2が下層で、アルミナまたはシリ
カあるいはこれらの両者の粉末3を含有するAl、Zr
、 Ti、 Siの1種または2種以上の酸化物ポリマ
ー皮膜、4が上層で、Al、Zr%Ti。The attached drawings schematically show the cross section of the steel plate of the present invention.
1 is a stainless steel plate, 2 is a lower layer, which is made of Al, Zr containing powder 3 of alumina or silica or both of these.
, Ti, Si, oxide polymer film of one or more types, 4 is the upper layer, Al, Zr%Ti.
Siの1種または2種以上の酸化物ポリマー皮膜である
。It is a polymer film made of one or more oxides of Si.
本発明で下層の酸化物ポリマー皮膜は、例えば^1酸化
物の場合、酸素を介して^1同志が結合してポリマーに
なったもので、Zrs Ti%Siの各酸化物の場合も
同様の結合でポリマーになっている。この酸化物ポリマ
ー皮膜に含有させる粉末のアルミナやシリカは結晶状の
ものであって、ポリマーにはなっていない。In the present invention, in the case of the lower layer oxide polymer film, for example, in the case of ^1 oxide, ^1 comrades are bonded to each other through oxygen to become a polymer, and the same applies to each oxide of Zrs Ti% Si. It is made into a polymer by bonding. The powder alumina and silica contained in this oxide polymer film are crystalline and do not form a polymer.
下層にアルミナやシリカの粉末を含有させるのは酸化物
ポリマー皮膜を厚膜にした場合のクラック発生を防止す
るためである。すなわち^IやZrなどの酸化物ポリマ
ー皮膜は皮膜形成の際膜厚を約1μm以上にすると脱水
縮合反応によりポリマー ゛になるとき皮膜収縮が大き
く、無数のクラックが発生してしまう、一方膜厚を1μ
m未満にしてクラックの発生を防止すると、絶縁性が低
下してしまう、しかしアルミナやシリカ粉末を皮膜中に
充填すると、これらの粉末は体積収縮しないので、皮膜
収縮が緩和され、膜厚を厚(してもクラックが発生しな
くなるのである。The purpose of containing alumina or silica powder in the lower layer is to prevent cracks from occurring when the oxide polymer film is made thick. In other words, when forming an oxide polymer film such as ^I or Zr, if the film thickness is increased to approximately 1 μm or more, the film shrinks greatly when it becomes a polymer due to dehydration condensation reaction, resulting in countless cracks. 1μ
If the temperature is less than m, the insulation properties will decrease, but if alumina or silica powder is filled into the film, these powders will not shrink in volume, so the shrinkage of the film will be alleviated, and the film thickness will be reduced. (Even if you do this, cracks will no longer occur.)
これらの粉末はアルミナまたはシリカの単体、混合物で
もよいが、平均粒径0.01〜5μ論のものを用いる。These powders may be a single substance or a mixture of alumina or silica, but those having an average particle size of 0.01 to 5 μm are used.
o、oiμm未満の微粒子は高価で、5μmより大さ
くすると皮膜形成の際均−に分散させるのが困難で、皮
膜の凹凸も大きくなる。粉末含有量は酸化物ポリマー皮
@ioo重量部に対して20〜80重量部、好ましくは
50重量部にする。Fine particles smaller than 0.0 μm are expensive, and particles larger than 5 μm are difficult to disperse evenly during film formation, and the film becomes uneven. The powder content is between 20 and 80 parts by weight, preferably 50 parts by weight, based on parts by weight of the oxide polymer skin@ioo.
20重量部未満であると、下層膜厚を10μm以上にし
た場合、皮膜にクラックが発生しで剥離する、一方80
重量部より多いと、鋼板との密着性が低下する。If the amount is less than 20 parts by weight, cracks will occur in the film and the film will peel off when the thickness of the lower layer is 10 μm or more.
If the amount exceeds parts by weight, the adhesion to the steel plate will decrease.
下層膜厚は5μm以上、好ましくは5〜25μ論、一般
的には10μmにする。5μm未満であるとピンホール
が着しく多く、25μ鴎より厚くすると可視性が低下し
、クラックが発生して剥離が生じる。The thickness of the lower layer is 5 μm or more, preferably 5 to 25 μm, and generally 10 μm. If it is less than 5 μm, there will be many pinholes, and if it is thicker than 25 μm, visibility will decrease, cracks will occur, and peeling will occur.
上層の酸化物ポリマー皮膜は下層の酸化物ポリマー皮膜
と同様のものである。この上層を設けるのは下層だけで
あるとピンホールが存在し、吸湿により絶縁性が不十分
となり、かつアルミナやシリカ粉末による凹凸があるか
らである。下層だけでピンホールないようにするには、
その膜厚を50μm以上にしなければならないが、前記
のように25μm超にすると可視性が低下してしまう。The upper oxide polymer coating is similar to the lower oxide polymer coating. This is because if only the lower layer is provided with this upper layer, pinholes will exist, the insulation will be insufficient due to moisture absorption, and there will be unevenness due to alumina or silica powder. To avoid pinholes only in the lower layer,
The film thickness must be 50 μm or more, but as mentioned above, if it exceeds 25 μm, visibility will decrease.
しかし25μmでもまだピンホールや凹凸が存在し、絶
縁性は^くて抵抗値で10−Ω程度の絶縁性しか得られ
ない、そこでさらに上層を設けてピンホールや凹凸をな
くするのである。However, even with a thickness of 25 μm, there are still pinholes and unevenness, and the insulation is poor, with a resistance value of only about 10-Ω.Therefore, an upper layer is provided to eliminate the pinholes and unevenness.
皮膜全体の絶縁性は10MΩ以上にし、凹凸を少なくす
るには、上層膜厚を0.01〜0.3μ鶴、一般には約
0.1μ論になるようにする。0.01μ曽未満である
とピンホールや凹凸を十分被覆できず、0.3μ論より
厚くしてもその効果は変わらない。The insulation of the entire film should be 10 MΩ or more, and in order to reduce unevenness, the thickness of the upper layer should be 0.01 to 0.3 μm, generally about 0.1 μm. If it is less than 0.01 μm, pinholes and unevenness cannot be covered sufficiently, and even if it is thicker than 0.3 μm, the effect will not change.
下層皮膜の形成は31% Zr5Tis Siのアルコ
キシドまたはアセチルアセトネート金属塩の1種または
2種以上を0.1重量%以上含有するアルコール溶液を
調整して、この溶液中に平均粒径0.01〜5μ輪アル
ミナ粉末またはシリカ粉末あるいはこれらの両粉末混合
物を添加して、その添加溶液をステンレス鋼板表面に塗
布し、300〜500℃で加熱することにより形成する
。前記金属のアルコキシドまたはアセチルアセトネート
金属塩のアルコール溶液にすると、鋼板に塗布すると、
空気中の水分により容易に加水分解し、かつ加熱により
脱水縮合反応を起こして金属同志が酸素を介しで結合し
、ポリマー皮膜となる。溶液には加水分解を促進するた
め、水や酸(例えば塩酸、硫酸、リン酸など)あるいは
アルカリ(例えばアンモニアなど)を微量、例えば水の
場合0.01重量%以上、酸またはアルカリの場合0.
001重量%以上添加しておいてもよい。The formation of the lower layer film is performed by preparing an alcohol solution containing 0.1% by weight or more of one or more of the alkoxide or acetylacetonate metal salt of 31% Zr5TisSi, and adding an average particle size of 0.01% to the solution. It is formed by adding ~5μ ring alumina powder, silica powder, or a mixture of both powders, applying the added solution to the surface of a stainless steel plate, and heating it at 300 to 500°C. When an alcohol solution of the metal alkoxide or acetylacetonate metal salt is applied to a steel plate,
It is easily hydrolyzed by moisture in the air, and when heated, a dehydration condensation reaction occurs, and the metals bond together through oxygen, forming a polymer film. In order to promote hydrolysis, the solution contains a trace amount of water, acid (e.g. hydrochloric acid, sulfuric acid, phosphoric acid, etc.) or alkali (e.g. ammonia, etc.), for example, 0.01% by weight or more in the case of water, 0.0% in the case of acid or alkali. ..
0.001% by weight or more may be added.
溶液濃度を0.1重量%以上にするのは下層膜厚を5μ
mにするためで、脱水縮合させる加熱温度を300〜5
00℃にするのは、300℃未満であると脱水縮合が完
全に進行しないため、完全な酸化物皮膜にならず、50
0℃を越えると溶媒のアルコールが急激に蒸発し、ピン
ホールが発生する。To make the solution concentration 0.1% by weight or more, the lower layer thickness should be 5 μm.
The heating temperature for dehydration condensation was set at 300 to 5 m.
The reason for setting the temperature to 00℃ is that if the temperature is lower than 300℃, the dehydration condensation will not proceed completely, so a complete oxide film will not be formed, and the temperature will be lower than 50℃.
When the temperature exceeds 0°C, the solvent alcohol evaporates rapidly, causing pinholes.
下層に塗布する^1SZr、 Ti、 Siのアルコキ
シドの好ましいものを挙げれば、アルミニウムエトキシ
ド、アルミニウムイソプロポキシド、アルミニウムエト
キシド、ジルコニウムテトラプロポキシド、ジルコニウ
ムテトラブトキシド、チタンテトラエトキシド、チタン
テトラブトキシド、メチルシリケート、エチルシリケー
トなどが、また7セチルアセトネート金属塩としては、
アセチルアセトネートジルコニウム、アセチル7セトネ
ートアルミニウム、7セチル7セトネートチタニウムな
どがある。Preferred examples of alkoxides of SZr, Ti, and Si to be applied to the lower layer include aluminum ethoxide, aluminum isopropoxide, aluminum ethoxide, zirconium tetrapropoxide, zirconium tetrabutoxide, titanium tetraethoxide, titanium tetrabutoxide, Methyl silicate, ethyl silicate, etc., and 7cetylacetonate metal salt,
Examples include zirconium acetylacetonate, aluminum acetyl 7cetonate, and titanium 7cetyl 7cetonate.
これらの化合物の塗布はアルコールに上記化合物の1種
または2種以上を0.1重量%以上溶解させで行うが、
使用するアルコールは上記化合物を均一に分散できるも
のであれば特に制限はなく、例えばメタノール、エタノ
ール、イソプロピルアルコール、ブタノールなどで十分
である。なおアルコール以外にもトルエンやキシレンの
ような低沸点溶媒を使用することもできる。Application of these compounds is carried out by dissolving one or more of the above compounds in an amount of 0.1% by weight or more in alcohol.
The alcohol used is not particularly limited as long as it can uniformly disperse the above compound, and methanol, ethanol, isopropyl alcohol, butanol, etc. are sufficient, for example. In addition to alcohol, a low boiling point solvent such as toluene or xylene can also be used.
溶液の鋼板への塗布は、ロール−コート法、スプレー法
、バーコード法、浸漬引き上げ法など均一に塗布できる
方法によればよい。The solution may be applied to the steel plate by any method capable of uniformly applying the solution, such as a roll-coating method, a spray method, a bar-coding method, or a dipping/pulling method.
上層の酸化物皮膜の形成はAl、Zr、 Ti、 Si
のアルコキシドまたはアセチルアセトネート金属塩の1
種または2種以上を0.005重量%以上含有するアル
コール溶液を塗布すればよい。ここで溶液濃度を0.0
05重量%以上にするのは上層膜厚を0.01μm以上
にするためである。前記金属のアルコキシドお上りアセ
チルアセトネート金属塩並びに溶媒は下層の場合に挙げ
たものでよく、脱水縮合反応を起こさせるための加熱も
同温度(300〜500℃)でよい。The upper layer oxide film is formed by Al, Zr, Ti, Si
1 of the alkoxide or acetylacetonate metal salt of
An alcohol solution containing 0.005% by weight or more of the species or two or more species may be applied. Here, the solution concentration is 0.0
The reason for setting the amount to be 0.05% by weight or more is to make the upper layer film thickness 0.01 μm or more. The acetylacetonate metal salt and solvent used as the alkoxide of the metal may be those mentioned in the case of the lower layer, and the heating for causing the dehydration condensation reaction may be at the same temperature (300 to 500°C).
(実施例)
実施例1
アセチル7セトネートノルコニウムの0,1mol/e
イソプロピルアルコール溶液に平均粒径が0.1μ鴨の
アルミナ粉末を0.3sol/9添加して、均一に分散
した。この溶液を板厚0.4−のステンレス鋼板に塗布
し、400℃の電気炉中に10分間入れ、下層皮膜(I
I厚約10μ―)を形成した。(Example) Example 1 0.1 mol/e of acetyl 7cetonate norconium
0.3 sol/9 of alumina powder having an average particle size of 0.1 μm was added to an isopropyl alcohol solution and uniformly dispersed. This solution was applied to a 0.4-thick stainless steel plate and placed in an electric furnace at 400°C for 10 minutes to form the lower layer coating (I
A thickness of approximately 10 μm was formed.
次にこの鋼板を下記アルコキシドの0.1mol/gイ
ソプロピルアルコール溶液に浸漬し、51/秒の一定速
度で引上げ、均一に塗布した。Next, this steel plate was immersed in a 0.1 mol/g isopropyl alcohol solution of the following alkoxide, pulled up at a constant speed of 51/sec, and coated uniformly.
(イ)アセチルアセトネートジルコニウム(ロ)チタン
テトラブトキシド
(ハ)アルミニウムイソプロポキシド
(ニ)エチルシリケート
塗布後は500℃の電気炉中に5分間入れ、上層皮l!
!(膜厚的0.1μ■)を形成した。(a) Zirconium acetylacetonate (b) Titanium tetrabutoxide (c) Aluminum isopropoxide (d) Ethyl silicate After coating, place in an electric furnace at 500°C for 5 minutes to remove the upper layer!
! (film thickness: 0.1 μm) was formed.
これらのステンレス鋼板皮膜の耐熱性、絶縁性および加
工密着性は表1に示す通りであった。なお皮膜加工密着
性はステンレス鋼板を5箇曹R〜100mmHの曲率で
90度曲げした後、命げ加工部にセロテープを圧潰して
、はがす時皮膜が剥離してしまう曲げR値で評価したく
以下実施例2.3においでも同様に評価した)。The heat resistance, insulation properties, and processing adhesion of these stainless steel plate coatings were as shown in Table 1. The film adhesion should be evaluated by the bending R value at which the film peels off when a stainless steel plate is bent 90 degrees at a curvature of 5°C to 100mmH, then cellophane tape is crushed on the bent part and the film is peeled off. Similar evaluations were made in Example 2.3 below).
実施例2
アセチル7セトネートチタニウムの0.2mol/gn
−ブタノール溶液に平均粒径が0.3μ論のシリカ粉末
を均一に分散して、この溶液を板厚0.3−のステンレ
ス鋼板に均一に塗布し、これを450℃の電気炉中に7
分間入れ、下層皮膜(膜厚的12μm)を形成した。Example 2 0.2 mol/gn of titanium acetyl 7cetonate
- Uniformly disperse silica powder with an average particle size of 0.3 μm in a butanol solution, apply this solution uniformly to a stainless steel plate with a thickness of 0.3 μm, and place it in an electric furnace at 450°C for 7
The mixture was soaked for a minute to form a lower layer film (12 μm in film thickness).
次にこの鋼板の下層皮膜の上に下記アセチルア七トネー
ト金属塩の0,1wol/6 n−ブタノール溶液に浸
漬し、10 am1秒の一定速度で引上げ、均一に塗布
した。Next, the steel plate was immersed in a 0.1 wol/6 n-butanol solution of acetyl heptatonate metal salt shown below and pulled up at a constant speed of 10 am 1 sec to uniformly coat the lower coating on the steel plate.
(イ)7セチルアセトネートジルコニウム(ロ)アセチ
ルアセトネートチタニウム(ハ)アセチル7セトネート
アルミニウム塗布後は400℃の電気炉中に10分間入
れ、上層皮II(膜厚的0.07μm)を形成した。(a) Zirconium 7cetylacetonate (b) Titanium acetylacetonate (c) After coating acetyl 7cetonate aluminum, place it in an electric furnace at 400°C for 10 minutes to form upper layer II (film thickness 0.07 μm) did.
これらのステンレス鋼板皮膜の耐熱性、絶縁性および加
工密着性は表2に示す通りであった。The heat resistance, insulation properties, and processing adhesion of these stainless steel plate coatings were as shown in Table 2.
実施例3
エチルシリケート509、ブタノール1909、水45
9および塩酸0.99からなる溶液に平均粒径2,0μ
論のアルミナ粉末とシリカ粉末とを各0.1−ol/g
ずつ添加して、均一に分散し、この溶液を板厚0.1−
のステンレス鋼板に均一に塗布し、これを450℃の電
気炉中に7分間入れ、下層皮膜(II厚約8μm)を形
成した。Example 3 Ethyl silicate 509, butanol 1909, water 45
9 and hydrochloric acid with an average particle size of 2.0μ.
0.1-ol/g of alumina powder and silica powder each
Add this solution uniformly to a plate with a thickness of 0.1-
This was applied uniformly onto a stainless steel plate and placed in an electric furnace at 450° C. for 7 minutes to form a lower layer film (II thickness approximately 8 μm).
次にこの鋼板を下記アルコキシドの0.05mol/8
エタノール溶液に浸漬し、21111/秒の一定速度で
引上げ、均一に塗布した。Next, this steel plate was mixed with 0.05 mol/8 of the following alkoxide.
It was immersed in an ethanol solution and pulled up at a constant speed of 21111/sec to uniformly coat it.
(イ)ジルコニウムテトライソプaボキシド(ロ)チタ
ンテトライソプロポキシド
(ハ)アルミニウムブトキシド
(ニ)メチルシリケート
塗布後は450℃の電気炉中に7分間入れ、上層皮膜(
膜厚的0.07μ曹)を形成した。(a) Zirconium tetraisopropoxide (b) Titanium tetraisopropoxide (c) Aluminum butoxide (d) Methyl silicate After coating, place in an electric furnace at 450°C for 7 minutes to coat the upper layer (
A film thickness of 0.07 μm was formed.
これらのステンレス鋼板皮膜の耐熱性、絶縁性および加
工密着性は表3に示す通りであった。The heat resistance, insulation properties, and processing adhesion of these stainless steel plate coatings were as shown in Table 3.
(効果)
以上のごとく本発明のステンレス鋼板は皮膜が耐熱性、
絶縁性に優れた金属陵化物であるが、加工性に優れてい
るので、種々の形状に加工できる。(Effects) As described above, the stainless steel sheet of the present invention has a heat-resistant coating and
Although it is a metal compound with excellent insulation properties, it also has excellent workability, so it can be processed into various shapes.
添付図面は本発明のステンレス鋼板の慎式断面図である
。The accompanying drawing is a schematic sectional view of the stainless steel plate of the present invention.
Claims (2)
たはシリカあるいはこれらの両者の粉末を含有するAl
、Zr、Ti、Siの1種または2種以上の酸化物ポリ
マー皮膜を形成し、さらにこの下層の上に該Al、Zr
、TiまたはSiの1種または2種以上の酸化物ポリマ
ー皮膜を形成したことを特徴とする耐熱性に優れた絶縁
性ステンレス鋼板。(1) Al containing alumina, silica, or both powders as a lower layer on the surface of the stainless steel plate.
, Zr, Ti, and Si, and furthermore, on this lower layer, the Al, Zr
An insulating stainless steel sheet with excellent heat resistance, characterized by forming an oxide polymer film of one or more of Ti and Si.
セチルアセトネート金属塩の1種または2種以上を0.
1重量%以上含有するアルコール溶液に、平均粒径0.
01〜5μmのアルミナ粉末またはシリカ粉末あるいは
これらの両粉末混合物を添加して、その添加溶液をステ
ンレス鋼板表面に塗布して300〜500℃で加熱する
ことにより下層を形成し、次にこの下層の上にAl、Z
r、Ti、Siのアルコキシドまたはアセチルアセトネ
ート金属塩の1種または2種以上を0.005重量%以
上含有するアルコール溶液を塗布して、300〜500
℃に加熱し、上層を形成することを特徴とする耐熱性に
優れた絶縁性ステンレス鋼板の製造方法。(2) One or more types of alkoxides or acetylacetonate metal salts of Al, Zr, Ti, and Si at 0.
In an alcohol solution containing 1% by weight or more, an average particle size of 0.
Alumina powder, silica powder, or a mixture of both powders of 01 to 5 μm are added, and the added solution is applied to the surface of a stainless steel plate and heated at 300 to 500°C to form a lower layer. Al, Z on top
300 to 500
A method for manufacturing an insulating stainless steel sheet with excellent heat resistance, which comprises heating to ℃ to form an upper layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP469487A JPS63171883A (en) | 1987-01-12 | 1987-01-12 | Insulating stainless steel sheet having excellent heat resistance and its production |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP469487A JPS63171883A (en) | 1987-01-12 | 1987-01-12 | Insulating stainless steel sheet having excellent heat resistance and its production |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63171883A true JPS63171883A (en) | 1988-07-15 |
Family
ID=11590994
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP469487A Pending JPS63171883A (en) | 1987-01-12 | 1987-01-12 | Insulating stainless steel sheet having excellent heat resistance and its production |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63171883A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012193458A (en) * | 2012-07-09 | 2012-10-11 | Sumitomo Osaka Cement Co Ltd | Coating liquid for forming thermal discoloration preventive film of stainless steel, and method for preventing thermal discoloration of stainless steel |
CN107400888A (en) * | 2016-05-19 | 2017-11-28 | 南京理工大学 | A kind of stainless steel resistance to high temperature oxidation and seawater corrosion resistance Na2SiO3/Al2O3Preparation method of composite coating |
-
1987
- 1987-01-12 JP JP469487A patent/JPS63171883A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012193458A (en) * | 2012-07-09 | 2012-10-11 | Sumitomo Osaka Cement Co Ltd | Coating liquid for forming thermal discoloration preventive film of stainless steel, and method for preventing thermal discoloration of stainless steel |
CN107400888A (en) * | 2016-05-19 | 2017-11-28 | 南京理工大学 | A kind of stainless steel resistance to high temperature oxidation and seawater corrosion resistance Na2SiO3/Al2O3Preparation method of composite coating |
CN107400888B (en) * | 2016-05-19 | 2019-08-30 | 南京理工大学 | A kind of stainless steel resistance to high temperature oxidation and seawater corrosion resistance Na2SiO3/Al2O3Preparation method of composite coating |
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