JPS63170982U - - Google Patents
Info
- Publication number
- JPS63170982U JPS63170982U JP6243187U JP6243187U JPS63170982U JP S63170982 U JPS63170982 U JP S63170982U JP 6243187 U JP6243187 U JP 6243187U JP 6243187 U JP6243187 U JP 6243187U JP S63170982 U JPS63170982 U JP S63170982U
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- connection part
- foil pattern
- cover coat
- end portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6243187U JPS63170982U (fr) | 1987-04-24 | 1987-04-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6243187U JPS63170982U (fr) | 1987-04-24 | 1987-04-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63170982U true JPS63170982U (fr) | 1988-11-07 |
Family
ID=30896701
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6243187U Pending JPS63170982U (fr) | 1987-04-24 | 1987-04-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63170982U (fr) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005311106A (ja) * | 2004-04-22 | 2005-11-04 | Nitto Denko Corp | 配線回路基板 |
| JP2006066772A (ja) * | 2004-08-30 | 2006-03-09 | Matsushita Electric Ind Co Ltd | フレキシブルプリント配線板 |
| JP2006190989A (ja) * | 2005-01-06 | 2006-07-20 | Samsung Electronics Co Ltd | キャリアフィルム、これを有する表示装置、及びその製造方法 |
| JP2011253979A (ja) * | 2010-06-03 | 2011-12-15 | Sumitomo Electric Printed Circuit Inc | プリント配線板の接続構造、配線板接続体及び電子機器 |
| JP2012093646A (ja) * | 2010-10-28 | 2012-05-17 | Seiko Epson Corp | 電子デバイス及びその製造方法 |
| JP2014013638A (ja) * | 2011-10-03 | 2014-01-23 | Dainippon Printing Co Ltd | サスペンション用フレキシャー基板 |
-
1987
- 1987-04-24 JP JP6243187U patent/JPS63170982U/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005311106A (ja) * | 2004-04-22 | 2005-11-04 | Nitto Denko Corp | 配線回路基板 |
| JP2006066772A (ja) * | 2004-08-30 | 2006-03-09 | Matsushita Electric Ind Co Ltd | フレキシブルプリント配線板 |
| JP2006190989A (ja) * | 2005-01-06 | 2006-07-20 | Samsung Electronics Co Ltd | キャリアフィルム、これを有する表示装置、及びその製造方法 |
| JP2011253979A (ja) * | 2010-06-03 | 2011-12-15 | Sumitomo Electric Printed Circuit Inc | プリント配線板の接続構造、配線板接続体及び電子機器 |
| JP2012093646A (ja) * | 2010-10-28 | 2012-05-17 | Seiko Epson Corp | 電子デバイス及びその製造方法 |
| JP2014013638A (ja) * | 2011-10-03 | 2014-01-23 | Dainippon Printing Co Ltd | サスペンション用フレキシャー基板 |