JPS63170946U - - Google Patents
Info
- Publication number
- JPS63170946U JPS63170946U JP1987062676U JP6267687U JPS63170946U JP S63170946 U JPS63170946 U JP S63170946U JP 1987062676 U JP1987062676 U JP 1987062676U JP 6267687 U JP6267687 U JP 6267687U JP S63170946 U JPS63170946 U JP S63170946U
- Authority
- JP
- Japan
- Prior art keywords
- die pad
- semiconductor pellet
- lead
- sealing resin
- bonding wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987062676U JPH0442921Y2 (en:Method) | 1987-04-27 | 1987-04-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987062676U JPH0442921Y2 (en:Method) | 1987-04-27 | 1987-04-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63170946U true JPS63170946U (en:Method) | 1988-11-07 |
| JPH0442921Y2 JPH0442921Y2 (en:Method) | 1992-10-12 |
Family
ID=30897174
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987062676U Expired JPH0442921Y2 (en:Method) | 1987-04-27 | 1987-04-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0442921Y2 (en:Method) |
-
1987
- 1987-04-27 JP JP1987062676U patent/JPH0442921Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0442921Y2 (en:Method) | 1992-10-12 |